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Journal of Lightwave Technology, ISSN 0733-8724, 02/2015, Volume 33, Issue 4, pp. 761 - 767
Journal Article
Optics Express, ISSN 1094-4087, 07/2015, Volume 23, Issue 15, pp. 19202 - 19212
We report the experimental measurement of 112 Gb/s transmission back-to-back and through 12 km of S-SMF with a single directly-modulated laser (DML) using the... 
OFDM | COMMUNICATION-SYSTEMS | OPTICS
Journal Article
Optics Express, ISSN 1094-4087, 07/2016, Volume 24, Issue 15, pp. 17193 - 17199
We demonstrate successful transmission of four 45 Gbps PAM4 single-channels through OM4 multimode fibers (MMFs) and wideband MMF using a PAM4 PHY chip and four... 
OPTICS
Journal Article
Journal of Lightwave Technology, ISSN 0733-8724, 02/2017, Volume 35, Issue 4, pp. 565 - 571
This paper reviews and examines several techniques for expanding the carrying capacity of multimode fiber (MMF) using vertical cavity surface emitting lasers... 
Optical fibers | fiber optics | Wavelength measurement | interconnects | vertical cavity surface emitting laser (VCSEL) | Optical attenuators | Bandwidth | Forward error correction | Data center | Vertical cavity surface emitting lasers | OPTICS | TELECOMMUNICATIONS | MULTIMODE FIBER | ENGINEERING, ELECTRICAL & ELECTRONIC
Journal Article
Journal of Medical Imaging, ISSN 2329-4302, 1/2017, Volume 4, Issue 1, pp. 011010 - 011010
We compare the performance of two detector materials, cadmium telluride (CdTe) and bismuth silicon oxide (BSO), for optical property modulation-based radiation... 
fast timing | cadmium telluride | Positron emission tomography | time-of-flight | bismuth silicon oxide | optical property modulation | Paper | positron emission tomography | Special Section on Development, Challenges, and Opportunities of Positron Emission Tomography
Journal Article
Proceedings of SPIE - The International Society for Optical Engineering, ISSN 0277-786X, 2016, Volume 9969
Conference Proceeding
2016 Optical Fiber Communications Conference and Exhibition, OFC 2016, 08/2016
Conference Proceeding
08/2017
A capacitor in a multilayer printed circuit board is described. The capacitor may include a via of a via-in-pad type and a dielectric mixture filled in the via... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | ELECTRICITY | PRINTED CIRCUITS
Patent
08/2017
A capacitor in a multilayer printed circuit board (100) is described. The capacitor may include a via (114, 116) of a via-in-pad type and a dielectric mixture... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | ELECTRICITY | PRINTED CIRCUITS
Patent
04/2017
A capacitor in a multilayer printed circuit board 100 is described. The capacitor may include a via 114, 116 of a via-in-pad type and a dielectric mixture... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | ELECTRICITY | PRINTED CIRCUITS
Patent
2016 IEEE Nuclear Science Symposium, Medical Imaging Conference and Room-Temperature Semiconductor Detector Workshop (NSS/MIC/RTSD), 10/2016, Volume 2017-, pp. 1 - 3
In this paper, we further explore the optical property modulation-based method for ionizing radiation photon detection in PET as a potential new direction to... 
cadmium telluride | Crystals | Detectors | Conductivity | ToF-PET | electron multiplication effect | Optical modulation | Optical sensors | Photonics | optical property modulation | bismuth silicon oxide | Electron Multiplication Effect | Optical Property Modulation | Bismuth Silicon Oxide | Cadmium Telluride
Conference Proceeding
01/2018
In one example embodiment, a transmitter module includes a header electrically coupled to a chassis ground. First and second input nodes are configured to... 
TRANSMISSION | ELECTRIC COMMUNICATION TECHNIQUE | TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION | ELECTRICITY
Patent
03/2016
A capacitor in a multilayer printed circuit board 100 is described. The capacitor may include a via 114, 116 of a via-in-pad type and a dielectric mixture... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | ELECTRICITY | PRINTED CIRCUITS
Patent
Patent
03/2016
A capacitor in a multilayer printed circuit board is described. The capacitor may include a via of a via-in-pad type and a dielectric mixture filled in the via... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | ELECTRICITY | PRINTED CIRCUITS
Patent
05/2019
A circuit includes a printed circuit board including a first portion defining a window formed as a first void on a first side of the printed circuit board and... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | BASIC ELECTRIC ELEMENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | DEVICES USING STIMULATED EMISSION | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | ELECTRICITY | PRINTED CIRCUITS
Patent
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