X
Search Filters
Format Format
Subjects Subjects
Subjects Subjects
X
Sort by Item Count (A-Z)
Filter by Count
basic electric elements (16) 16
electric solid state devices not otherwise provided for (16) 16
electricity (16) 16
semiconductor devices (16) 16
physics (7) 7
calculating (4) 4
computing (4) 4
counting (4) 4
diagnosis (4) 4
electric digital data processing (4) 4
human necessities (4) 4
hygiene (4) 4
identification (4) 4
medical or veterinary science (4) 4
surgery (4) 4
analog circuits (2) 2
clocks (2) 2
cmos integrated circuits (2) 2
compact (2) 2
high-speed (2) 2
horology (2) 2
mechanical parts of clocks or watches in general (2) 2
mechanically-driven clocks or watches (2) 2
mips (2) 2
noise (2) 2
optical receivers (2) 2
receivers (2) 2
risc (2) 2
time pieces using the position of the sun, moon or stars (2) 2
transmitters (2) 2
ambient intelligence (1) 1
amplifier (1) 1
arithmetic (1) 1
arrays (1) 1
bandwidth (1) 1
calibration (1) 1
capacitance (1) 1
chip (1) 1
circuit optimization (1) 1
circuit synthesis (1) 1
circuit testing (1) 1
circuits (1) 1
cmos (1) 1
cmos process (1) 1
consumption (1) 1
controlling (1) 1
couplings (1) 1
crosstalk (1) 1
delay (1) 1
design optimization (1) 1
devices (1) 1
educational institutions (1) 1
electric potential (1) 1
electrooptic modulators (1) 1
energy (1) 1
energy consumption (1) 1
engineering, electrical & electronic (1) 1
feedback circuits (1) 1
finite impulse response filter (1) 1
hardware design languages (1) 1
hybrid integrated circuits (1) 1
hysteresis (1) 1
inductor (1) 1
inductors (1) 1
intersymbol interference (1) 1
inverters (1) 1
ivr (1) 1
jitter (1) 1
layout (1) 1
libraries (1) 1
magnetic (1) 1
magnetic cores (1) 1
metals (1) 1
microarchitecture (1) 1
modulation (1) 1
modulator (1) 1
modulators (1) 1
multiplexing (1) 1
noise levels (1) 1
on-die (1) 1
optical ring resonators (1) 1
optical transmitters (1) 1
optical waveguides (1) 1
optics (1) 1
photodiodes (1) 1
program processors (1) 1
programmable logic arrays (1) 1
radio access networks (1) 1
regulating (1) 1
regulators (1) 1
repeaters (1) 1
signal design (1) 1
silicon (1) 1
standards development (1) 1
switches (1) 1
systems for regulating electric or magnetic variables (1) 1
testing (1) 1
thermal noise (1) 1
very large scale integration (1) 1
voltage (1) 1
more...
Language Language
Publication Date Publication Date
Click on a bar to filter by decade
Slide to change publication date range


IEEE Journal of Solid-State Circuits, ISSN 0018-9200, 09/2012, Volume 47, Issue 9, pp. 2049 - 2067
Journal Article
Optics Express, ISSN 1094-4087, 03/2011, Volume 19, Issue 6, pp. 5172 - 5186
Using low parasitic microsolder bumping, we hybrid integrated efficient photonic devices from different platforms with advanced 40 nm CMOS VLSI circuits to... 
CMOS | COMPACT | ENERGY | CHIP | OPTICS | HIGH-SPEED | MODULATOR
Journal Article
Optics express, 03/2011, Volume 19, Issue 6, p. 5172
Using low parasitic microsolder bumping, we hybrid integrated efficient photonic devices from different platforms with advanced 40 nm CMOS VLSI circuits to... 
Journal Article
09/2019
A method for constructing a ramp-stacked chip assembly starts by obtaining a set of semiconductor chips, including a first chip and a set of additional chips.... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
Proceedings - IEEE International Symposium on Circuits and Systems, ISSN 0271-4310, 04/2018, Volume 2018-
Conference Proceeding
06/2018
An assembly component and a technique for assembling a chip package using the assembly component are described. This chip package includes a set of... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
2010 IEEE International Solid-State Circuits Conference - (ISSCC), ISSN 0193-6530, 02/2010, Volume 53, pp. 182 - 183
We present circuits for efficient repeaterless on-chip wires. A transmitter sends RZ pulses to a clockless hysteresis receiver using a 3-tap FIR filter to... 
Energy consumption | Transmitters | Wires | Intersymbol interference | Bandwidth | Repeaters | Finite impulse response filter | Circuit testing | Hysteresis | Clocks
Conference Proceeding
04/2019
Distributions of on-chip inductors for monolithic voltage regulation are described. On-chip voltage regulation may be provided by integrated voltage regulators... 
CONTROLLING | SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES | PHYSICS | REGULATING | ELECTRICITY
Patent
IEEE Symposium on VLSI Circuits, Digest of Technical Papers, 2011, pp. 290 - 291
Conference Proceeding
06/2016
조립 부품(100) 및 조립 부품을 이용하여 칩 패키지를 조립하는 기술이 설명된다. 이 칩 패키지는 수직 방향으로 스택 내에 배열되는 반도체 다이들(310-1 내지 310-N)의 세트를 포함하는데, 반도체 다이들은 수직 스택의 일 측에 계단형 테라스(112-1)를 정의하도록 수평... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
06/2016
An assembly component (100) and a technique for assembling a chip package using the assembly component are described. This chip package includes a set of... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
12/2015
An assembly component and a technique for assembling a chip package using the assembly component are described. This chip package includes a set of... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
07/2015
An assembly component and a technique for assembling a chip package using the assembly component are described. This chip package includes a set of... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
02/2018
dispositivo com dispositivo de retenção e travamento axial e método para o mesmo. trata-se de um dispositivo que inclui um invólucro que compreende uma parede... 
HOROLOGY | TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS | PHYSICS | MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL | MECHANICALLY-DRIVEN CLOCKS OR WATCHES
Patent
04/2015
An assembly component (100) and a technique for assembling a chip package using the assembly component are described. This chip package includes a set of... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
04/2015
An assembly component and a technique for assembling a chip package using the assembly component are described. This chip package includes a set of... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
06/2017
In embodiments of wearable device heart monitor systems, a wearable device has electrical contacts integrated in a housing base of the wearable device as... 
SURGERY | DIAGNOSIS | HYGIENE | MEDICAL OR VETERINARY SCIENCE | COMPUTING | COUNTING | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | HUMAN NECESSITIES | IDENTIFICATION | CALCULATING
Patent
10/2016
A device includes a case comprising a case sidewall defining a circular receiver having a receiving opening and a central axis. An inner wall of the case... 
HOROLOGY | TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS | PHYSICS | MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL | MECHANICALLY-DRIVEN CLOCKS OR WATCHES
Patent
No results were found for your search.

Cannot display more than 1000 results, please narrow the terms of your search.