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human necessities (10) 10
hygiene (10) 10
medical or veterinary science (10) 10
integrated circuit packaging (7) 7
bandages, dressings or absorbent pads (6) 6
devices providing patency to, or preventing collapsing of,tubular structures of the body, e.g. stents (6) 6
electromagnetic compatibility (6) 6
equations (6) 6
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diagnosis (5) 5
identification (5) 5
surgery (5) 5
temperature (5) 5
devices for introducing media into, or onto, the body (4) 4
devices for producing or ending sleep or stupor (4) 4
devices for transducing body media or for taking media fromthe body (4) 4
encapsulation (4) 4
engineering, electrical & electronic (4) 4
engineering, manufacturing (4) 4
engineering, mechanical (4) 4
materials science, multidisciplinary (4) 4
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electrotherapy (3) 3
emc (3) 3
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ansys (2) 2
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cure (2) 2
electric heating (2) 2
electric lighting not otherwise provided for (2) 2
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electricity (2) 2
electromagnetic induction heating (2) 2
electronic packaging thermal management (2) 2
epoxy molding compound (2) 2
filling (2) 2
orthogonal arrays (2) 2
resins (2) 2
software packages (2) 2
stress (2) 2
surface treatment (2) 2
taguchi methods (2) 2
temperature measurement (2) 2
temperature uniformity (2) 2
thermal expansion (2) 2
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viscosity (2) 2
warpage (2) 2
wire (2) 2
a-si-h (1) 1
ablation (1) 1
acceleration (1) 1
adhesion effect (1) 1
adhesion effects (1) 1
adhesives (1) 1
air-pressure (1) 1
analysis (1) 1
analytical models (1) 1
animal experimentation (1) 1
animals (1) 1
apnoe (1) 1
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atmospheric modeling (1) 1
atomising (1) 1
atomizing (1) 1
beschleunigung (1) 1
bipolar plate (1) 1
cavity fillet (1) 1
cavity resonators (1) 1
cholangiography - instrumentation (1) 1
cleaning (1) 1
compounds (1) 1
computer programs (1) 1
connectors (1) 1
continuous multiple station (1) 1
corner effect (1) 1
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crawler-type-scrapers (1) 1
cu filling (1) 1
cu rdl (1) 1
cure shrinkage (1) 1
cure-induced shrinkage (1) 1
curing (1) 1
deform (1) 1
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defrosting period (1) 1
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dünne schicht (1) 1
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Advances in Mechanical Engineering, ISSN 1687-8132, 2014, Volume 2014, p. 349078
Recently, energy saving is one of the important issues for polymer processing industry. Electromagnetic induction heating has many advantages such as fast... 
ELEMENT | THERMODYNAMICS | INJECTION | DESIGN METHOD | ENGINEERING, MECHANICAL
Journal Article
IEEE Transactions on Components, Packaging and Manufacturing Technology, ISSN 2156-3950, 01/2011, Volume 1, Issue 1, pp. 76 - 82
Journal Article
IEEE Transactions on Components, Packaging and Manufacturing Technology, ISSN 2156-3950, 11/2011, Volume 1, Issue 11, pp. 1755 - 1760
Journal Article
Applied Mechanics and Materials, ISSN 1660-9336, 01/2013, Volume 284-287, pp. 1540 - 1546
There are more than 20 different types of current commercially available mandibular advancement devices (MAD). Although there are so many different types of... 
ANSYS | Mandibular advancement device (MAD)
Journal Article
Advanced Materials Research, ISSN 1022-6680, 10/2012, Volume 579, pp. 365 - 375
The Rapid Prototyping (R.P.) technology which is used in manufacturing a three-dimensional solid part is based on the layer forming method. Currently, the main... 
Plane forming | R.P | Rapid prototyping | Taguchi methods | Spray | Atomizing | Orthogonal arrays
Journal Article
Journal of Materials Processing Tech, ISSN 0924-0136, 2007, Volume 184, Issue 1, pp. 163 - 172
In this study, a novel concept of microinjection molding system was presented. The system was design as a separated module, which is a hot runner plunger-type... 
Microinjection molding | Plunger | Valve-type hot runner | ENGINEERING, MANUFACTURING | ENGINEERING, INDUSTRIAL | microinjection molding | valve-type hot runner | plunger | MATERIALS SCIENCE, MULTIDISCIPLINARY | Thermoplastics
Journal Article
Asia‐Pacific Journal of Chemical Engineering, ISSN 1932-2135, 03/2009, Volume 4, Issue 2, pp. 161 - 168
In integrated circuit (IC) packaging, when epoxy‐molding compound (EMC) is filled in the mold cavity and cured in the mold, adhesion occurs in the interface... 
mold adhesion force | defrosting period | EMC | Mold adhesion force | Defrosting period | ENGINEERING, CHEMICAL
Journal Article
Materials Science Forum, ISSN 0255-5476, 08/2008, Volume 594, pp. 261 - 272
In rapid prototyping (RP) technologies, curing of UV-curable photopolymers is mainly achieved by the application of laser scanning with limited fabrication... 
Journal Article
Materials Science Forum, ISSN 0255-5476, 01/2008, Volume 594, pp. 261 - 272
In rapid prototyping (RP) technologies, curing of UV-curable photopolymers is mainly achieved by the application of laser scanning with limited fabrication... 
Journal Article
2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), ISSN 2150-5934, 10/2013, pp. 310 - 314
Air trap (Void) in a molded underfill package always exists. It is an annoying problem and needs further investigation. In this research, the mold filing... 
Viscosity | Atmospheric modeling | Simulation | Filling | Mathematical model | Resins | Equations
Conference Proceeding
Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao, ISSN 0257-9731, 10/2008, Volume 29, Issue 5, pp. 373 - 379
The amorphous silicon thin film transistors (a-Si TFT) is particularly advantageous to the production of large screen displays and facilitates mass production.... 
Photo leakage current; hydrogenated amorphous silicon thin film transistors | PHOTOCONDUCTIVITY | STATES | photo leakage current | A-SI-H | METASTABLE DEFECTS | hydrogenated amorphous silicon thin film transistors | ENGINEERING, MECHANICAL
Journal Article
Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao, ISSN 0257-9731, 10/2008, Volume 29, Issue 5, pp. 429 - 433
The simulation and design of continuous multiple-station roll forming process for the U-section steel bar has been accomplished by the application of CAE... 
Roll forming mold design | Continuous multiple station | DEFORMTM | DEFORM (TM) | ENGINEERING, MECHANICAL | continuous multiple station
Journal Article
Journal of Electronic Packaging, Transactions of the ASME, ISSN 1043-7398, 12/2002, Volume 124, Issue 4, pp. 371 - 373
A two-plunger-type dilatometer was designed and fabricated to measure cure-induced volume changes of epoxy molding compound (EMC). The device is suitable for... 
ENGINEERING, MECHANICAL | ENGINEERING, ELECTRICAL & ELECTRONIC | Measurement | Epoxy compounds
Journal Article
IEEE Transactions on Components and Packaging Technologies, ISSN 1521-3331, 12/2000, Volume 23, Issue 4, pp. 684 - 692
Journal Article
2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), ISSN 2150-5934, 10/2011, pp. 280 - 283
In the IC packaging process, epoxy molding compound (EMC) was filling the mold cavity and cured in the mold. At the same time, adhesion may occur in the... 
Encapsulation | Adhesives | Force | IC package | Corner effect | Cavity fillet | Electromagnetic compatibility | Cavity resonators | Cleaning | Adhesion effects | Surface treatment
Conference Proceeding
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, ISSN 2150-5934, 10/2010, pp. 1 - 4
Wafer level packaging is the technique that encapsulates integrated circuit on the wafer directly and different from the traditional IC package. Comparing with... 
Semiconductor device modeling | Encapsulation | Integrated circuits | Mathematical model | Compounds | Finite element methods | Equations
Conference Proceeding
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