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2015, 1st ed. 2015., ISBN 3319186752
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then... 
Electrical engineering | Chemistry | Semiconductors | Electrochemistry | Mechanical engineering | Biomedical engineering
Web Resource
12/2015, 1st ed. 2015, ISBN 3319186752, 423
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then... 
Three-dimensional integrated circuits | Electronics & communications engineering | Biomedical engineering | Biomedical Engineering | Electrochemistry | Chemistry | Mechanical Engineering | Semiconductors | Electrical Engineering
eBook
Journal of Electronic Packaging, Transactions of the ASME, ISSN 1043-7398, 2012, Volume 134, Issue 2, p. 20903
Thermal conduction and mechanical stresses in through silicon via (TSV) structures in three dimensional system in package (3D SiP) under device operation... 
SIMULATION | SOLDER BUMPS | ENGINEERING, MECHANICAL | ENGINEERING, ELECTRICAL & ELECTRONIC | Thermal properties | Electronic packaging | Mechanical properties | Semiconductor wafers | Silicon | Research | Thermal stresses
Journal Article
ECS Transactions, ISSN 1938-5862, 2015, Volume 64, Issue 40, pp. 1 - 8
Conference Proceeding
IEICE transactions on electronics, ISSN 0916-8524, 12/2001, Volume 84, Issue 12, pp. 1763 - 1770
The three-dimensional chip-stacked CSP, which started with a flash/SRAM combination memory for cellular phones, was the forerunner from which 3D system... 
CSP | cellular phone | SIP | stacked CSP | 3D package | ENGINEERING, ELECTRICAL & ELECTRONIC
Journal Article
IEICE Transactions on Electronics, ISSN 0916-8524, 2001, Volume E84-C, Issue 12, pp. 1763 - 1770
Journal Article
01/2015, ISBN 3319186752
Book Chapter
01/2015, ISBN 3319186752
Book Chapter
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, ISSN 2150-5934, 10/2010, pp. 1 - 2
In the NEDO "Dream Chip Project", ASET has been entrusted a project for developing, "Functionally Innovative 3D-Integrated Circuit". In the five year project... 
Performance evaluation | Cooling | Stacking | Three dimensional displays | Bonding | Through-silicon vias | Integrated circuit modeling
Conference Proceeding
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011, 2011
Conference Proceeding
by Kada, M
2009 IEEE International Conference on 3D System Integration, 09/2009, pp. 1 - 6
In the NEDO ldquoDream Chip Projectrdquo, ASET has been entrusted a project for developing, ldquoHigh-Density 3D-Integration Technology for Multifunctional... 
Wiring | Analytical models | Energy consumption | Circuit simulation | Delay effects | Electromagnetic fields | Engines | Three-dimensional integrated circuits | Magnetic circuits | Field programmable gate arrays
Conference Proceeding
01/2015, ISBN 3319186752
Book Chapter
Journal of The Japan Institute of Electronics Packaging, ISSN 1343-9677, 2002, Volume 5, Issue 2, pp. 185 - 187
Journal Article
05/2007
PROBLEM TO BE SOLVED: To achieve a module for optical apparatus which has the structure capable of effectively preventing the damage of its micro-lens in its... 
SEMICONDUCTOR DEVICES | OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS | ELECTRIC COMMUNICATION TECHNIQUE | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | PHYSICS | OPTICS | PICTORIAL COMMUNICATION, e.g. TELEVISION | ELECTRICITY
Patent
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011, 2011, Volume 1, pp. 325 - 328
Conference Proceeding
Book Chapter
2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), ISSN 2150-5934, 10/2011, pp. 377 - 380
In the late 1990s, the technology that is stacked multiple silicon chips on the package was developed [1]. Then SiP (System in Package) constructed with CPU... 
Computational modeling | Silicon | Three dimensional displays | Through-silicon vias | Heat sinks | Stress | Heat transfer
Conference Proceeding
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