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electricity (48) 48
basic electric elements (42) 42
electric solid state devices not otherwise provided for (40) 40
semiconductor devices (40) 40
casings or constructional details of electric apparatus (25) 25
electric techniques not otherwise provided for (25) 25
manufacture of assemblages of electrical components (25) 25
printed circuits (25) 25
physics (10) 10
optical elements, systems, or apparatus (9) 9
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devices or arrangements related to tyres (8) 8
performing operations (8) 8
repairing, or connecting valves to, inflatable elastic bodiesin general (8) 8
transporting (8) 8
tyre changing or repairing (8) 8
tyre inflation (8) 8
vehicle tyres (8) 8
vehicles in general (8) 8
resonators, lines, or other devices of the waveguide type (2) 2
waveguides (2) 2
blasting (1) 1
calculating (1) 1
computing (1) 1
counting (1) 1
details of heat-exchange and heat-transfer apparatus, ofgeneral application (1) 1
electric digital data processing (1) 1
heat exchange in general (1) 1
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12/2018
A microelectronic package includes an interposer with through-silicon vias that is formed from a semiconductor substrate and one or more semiconductor dies... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
07/2018
A microelectronic package includes an interposer with through-silicon vias that is formed from a semiconductor substrate and one or more semiconductor dies... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
08/2014
A microelectronic package includes an interposer with through-silicon vias that is formed from a semiconductor substrate and one or more semiconductor dies... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
06/2014
Ein mikroelektronisches Bauelement mit Gehäuse enthält ein Zwischenelement mit Siliziumdurchführungen, das aus einem Halbleitersubstrat hergestellt ist, und... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
06/2014
A microelectronic package includes an interposer with through-silicon vias that is formed from a semiconductor substrate and one or more semiconductor dies... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
06/2014
A microelectronic package includes an interposer with through-silicon vias that is formed from a semiconductor substrate and one or more semiconductor dies... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
12/2019
Integrated component packages and methods of assembling integrated component packages are provided. The integrated component package can comprise a bump pitch... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
11/2019
Embedded air gap transmission lines and methods of fabrication are provided. An apparatus having an air gap transmission line can include a first conductive... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
03/2018
Embodiments of the present provide an integrated circuit system, which includes an interposer having a plurality of electrical conductive vias running through... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
10/2019
Integrated component packages and methods of assembling integrated component packages are provided. The integrated component package can comprise a bump pitch... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
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