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2018 IEEE 24th International Conference on Parallel and Distributed Systems (ICPADS), ISSN 1521-9097, 12/2018, Volume 2018-, pp. 771 - 778
The emerging edge computing is poised to move computing and intelligence to the network's edge so as to be close to the data sources for fast responses and... 
accelerator | Microcontrollers | Multicore processing | Instruction sets | Emulation | heterogeneous multicore | Graphics processing units | embedded system | QEMU | Libraries
Conference Proceeding
2019 International Symposium on VLSI Design, Automation and Test (VLSI-DAT), 04/2019, pp. 1 - 4
As the deep convolutional neural network (DCNN) has achieved success in many artificial intelligence areas, most of the major commercial and academic research... 
Convolutional codes | Computational modeling | Data models | Hardware | Timing | Arrays
Conference Proceeding
2018 International SoC Design Conference (ISOCC), 11/2018, pp. 15 - 16
Thermal issues are gaining critical in system-on-a-chip. We propose a two-stage thermal analysis approach using big and little matrix operations with a matrix... 
steady-state thermal analysis | Program processors | Supernodal LU (SuperLU) | Thermal analysis | Steady-state | System-on-chip | Sparse matrices | Matrix decomposition | Iterative methods | successive over-relaxation approach (SOR) | Successive over-relaxation approach (SOR) | Steady-state thermal analysis
Conference Proceeding
09/2017
A thermal simulation device is applied to a transaction-level designed chip which includes a plurality of intellectual properties. The thermal simulation... 
COMPUTING | COUNTING | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | CALCULATING
Patent
2018 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), ISSN 1092-3152, 11/2018, pp. 1 - 8
High temperature or temperature non-uniformity have become a serious threat to performance and reliability of highperformance integrated circuits (ICs).... 
Heating systems | Analytical models | Runtime | Thermal analysis | Partitioning algorithms | Mathematical model | Integrated circuit modeling
Conference Proceeding
International System on Chip Conference, ISSN 2164-1676, 12/2017, Volume 2017-, pp. 316 - 321
Conference Proceeding
International System on Chip Conference, ISSN 2164-1676, 12/2017, Volume 2017-, pp. 346 - 350
Conference Proceeding
06/2017
A thermal simulation device is applied to a transaction-level designed chip which includes a plurality of intellectual properties. The thermal simulation... 
COMPUTING | COUNTING | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | CALCULATING
Patent
06/2017
A thermal simulation device is applied to a transaction-level designed chip which includes a plurality of blocks. The thermal simulation device includes a... 
COMPUTING | COUNTING | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | CALCULATING
Patent
05/2017
A cover for an electronic device includes a transparent portion and a non-transparent portion beside the transparent portion. The transparent portion defines a... 
MISCELLANEOUS APPLICATIONS OF MATERIALS | OTHER WORKING OF METAL | STORING | CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS | USE OF MATERIALS AS ADHESIVES | PUBLIC ADDRESS SYSTEMS | LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS | COUNTING | PACKAGES | TECHNICAL SUBJECTS COVERED BY FORMER USPC | GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC | MACHINE TOOLS | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE | COMBINED OPERATIONS | CONVEYING | CHEMISTRY | ELECTRIC DIGITAL DATA PROCESSING | MISCELLANEOUS COMPOSITIONS | CALCULATING | HANDLING THIN OR FILAMENTARY MATERIAL | TRANSPORTING | METAL-WORKING NOT OTHERWISE PROVIDED FOR | DYES | PACKAGING ELEMENTS | GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS | COMPUTING | UNIVERSAL MACHINE TOOLS | TELEPHONIC COMMUNICATION | ADHESIVES | PAINTS | TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS | METALLURGY | ELECTRIC COMMUNICATION TECHNIQUE | ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR | PACKING | POLISHES | NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL | PHYSICS | NATURAL RESINS | TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION | PERFORMING OPERATIONS | ELECTRICITY | DEAF-AID SETS
Patent
05/2017
A cover for an electronic device includes a main portion and a border portion beside the main portion. The border portion includes a transparent substrate and... 
ELECTRIC COMMUNICATION TECHNIQUE | PUBLIC ADDRESS SYSTEMS | LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS | COMPUTING | COUNTING | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | CALCULATING | ELECTRICITY | DEAF-AID SETS
Patent
12/2018
Disclosed is a timing estimation method applied to a function verification model. In the timing estimation method, the function verification model issues a... 
COMPUTING | COUNTING | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | CALCULATING
Patent
12/2018
Disclosed are a timing estimation method and a simulator. The method is applied to a function verification model. In the method, the model issues a first... 
COMPUTING | COUNTING | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | CALCULATING
Patent
02/2017
An electronic device includes a speaker, and a cover covering the speaker. The cover includes a transparent main portion, and a non-transparent border portion.... 
ELECTRIC COMMUNICATION TECHNIQUE | PUBLIC ADDRESS SYSTEMS | LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS | ELECTRICITY | DEAF-AID SETS
Patent
07/2019
A memory transaction-level modeling method and a memory transaction-level modeling system are provided. The memory transaction-level modeling method is used... 
INFORMATION STORAGE | STATIC STORES | COMPUTING | COUNTING | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | CALCULATING
Patent
2016 International Symposium on VLSI Design, Automation and Test (VLSI-DAT), 04/2016, pp. 1 - 4
Since 3D graphic applications have reached mobile devices and known a tremendous expansion, graphic processors' power consumption has become a major challenge... 
Adaptation models | Energy consumption | Three-dimensional displays | Graphics processing units | Computer architecture | Benchmark testing | Hardware | Automation | Architecture | Run time (computers) | Very large scale integration | Processors | Three dimensional models | Three dimensional
Conference Proceeding
05/2019
An embodiment of a thermal estimation device including a temperature model generator, a temperature gradient calculator, and a thermal sensing analyzer is... 
COMPUTING | COUNTING | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | CALCULATING
Patent
06/2018
Disclosed are a timing estimation method and a simulator. The method is applied to a function verification model. In the method, the model issues a first... 
COMPUTING | COUNTING | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | CALCULATING
Patent
04/2019
A scheduling method is provided. The method includes: recording a next instruction and a ready state of each thread group in a scoreboard; determining whether... 
COMPUTING | COUNTING | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | CALCULATING
Patent
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