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Genome Medicine, ISSN 1756-994X, 12/2012, Volume 4, Issue 12, pp. 100 - 100
Background: Population screening for FMR1 mutations has been a topic of considerable discussion since the FMR1 gene was identified in 1991. Advances in... 
REPEAT PRIMED PCR | POPULATION | PREMUTATION | TREMOR/ATAXIA SYNDROME | GENE | INTERMEDIATE-SIZE | GENETICS & HEREDITY | FRAGILE-X-SYNDROME | SYNDROME CARRIER | EXPANDED ALLELES | FULL-MUTATION
Journal Article
Kidney International, ISSN 0085-2538, 12/2014, Volume 86, Issue 6, pp. 1174 - 1186
Journal Article
03/2006
Solder bump structures for semiconductor device packaging is provided. In one embodiment, a solder bump structure comprises a semiconductor substrate, the... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
02/2006
A method for fabricating a pad redistribution layer. First, at least one bonding pad exposed by a first passivation layer is provided. A diffusion barrier... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
03/2007
Solder bump structures for semiconductor device packaging is provided. In one embodiment, a solder bump structure comprises a semiconductor substrate, the... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
10/2006
A method for fabricating a pad redistribution layer. First, at least one bonding pad exposed by a first passivation layer is provided. A diffusion barrier... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
03/2006
Solder bump structures for semiconductor device packaging is provided. In one embodiment, a solder bump structure comprises a semiconductor substrate, the... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
01/2006
A method for fabricating a pad redistribution layer. First, at least one bonding pad exposed by a first passivation layer is provided. A diffusion barrier... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
12/2001, ISBN 9789264196759, 154
The multilateral trading system has delivered successive rounds of trade liberalisation and established mechanisms to protect the interests of trading nations.... 
Development | Trade | Sociologia | Ciência Social | Sociology | Sociología | Geral | Ciencias Sociales | General | Libros electronicos | Social Science | lcsh | Developing countries
eBook
06/2013
A water filtering device (3) is used for a filter element (4) to be mounted. An end of the filter element (4) having a water inlet (41) and a water outlet... 
TRANSPORTING | METALLURGY | CHEMISTRY | TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE | SEPARATION | PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL | PERFORMING OPERATIONS
Patent
El Mercurio, 08/2014
  "En Ecuador -de donde viene- predominan las carreras empresariales, que no era el área que me interesaba. Entonces pensé en buscar un lugar con carreras... 
Newspaper Article
Reforma, ISSN 1563-7697, 04/2003
  El reclamo podria parecer prematuro sino es que injusto. Hay, sin embargo, un contexto domestico que, en el peor de los casos, lo explicaria sino es que lo... 
Newspaper Article
Palabra, 04/2003
El reclamo podria parecer prematuro sino es que injusto. Hay, sin embargo, un contexto domestico que, en el peor de los casos, lo explicaria sino es que lo... 
Newspaper Article
Reforma (Mexico D.F., Mexico), ISSN 1563-7697, 04/2003, p. 10
Newspaper Article
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