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IEEE Transactions on Power Electronics, ISSN 0885-8993, 01/2020, Volume 35, Issue 1, pp. 826 - 834
This paper proposed a method for one step fabricating the continuously variable multi-permeability (CVMP) toroid core by applying a specific gradient sintering... 
Magnetic flux density | Inductance | multi-permeability | efficiency | core loss density | Magnetic cores | toroid core | DC-DC power converters | Magnetic materials | Permeability | Inductors | Constant flux
Journal Article
Journal of Alloys and Compounds, ISSN 0925-8388, 03/2019, Volume 777, p. 578
In order to overcome interfacial delamination of pressureless sintered nanosilver as die attachment on the ENIG finish, we tried to clarify the densification... 
Grain boundaries | Gold | Silver | Densification | Submerging | Sintering | Electron back scatter | Nickel | Diffusion | Delamination | Substrates | Loose powder sintering
Journal Article
Crystal Growth and Design, ISSN 1528-7483, 11/2007, Volume 7, Issue 11, pp. 2332 - 2342
Using nonsubstituted 1,2,4-triazole and the second bridging ligands as coligands, a series of three-dimensional metal–organic frameworks based on different... 
MATERIALS SCIENCE, MULTIDISCIPLINARY | CRYSTAL-STRUCTURES | STRUCTURAL-CHARACTERIZATION | CRYSTALLOGRAPHY | CHEMISTRY, MULTIDISCIPLINARY | SECONDARY BUILDING UNITS | HYDROTHERMAL SYNTHESIS | COPPER(II) COMPLEXES | METAL-ORGANIC FRAMEWORKS | TRIANGULAR TRINUCLEAR | MAGNETIC-PROPERTIES | COORDINATION POLYMERS | SORPTION PROPERTIES
Journal Article
Journal of Magnetism and Magnetic Materials, ISSN 0304-8853, 05/2018, Volume 454, p. 6
The microstructures, magnetic and electronic performance of NiZnCu ferrites have been investigated at temperature from 850 °C to 1000 °C. X-ray diffraction... 
Zinc ferrites | Power loss | Scanning electron microscopy | Temperature | Core loss | Magnetic resonance | X-ray diffraction | Permeability | Magnetic saturation | Density | Ferrites | Diffraction patterns | Inductance | Direct current | Magnetic permeability | Sintering | Microstructure | Magnetic properties
Journal Article
Materials Letters, ISSN 0167-577X, 10/2018, Volume 228, p. 327
It is significant to attach power devices on low-cost copper (Cu) substrates by pressureless silver-sintering in air. The Cu surface in direct-bond-copper... 
Nanoparticles | Silver | Electronic devices | Sintering | Shear strength | Bonding strength | Surface roughness | Shrinkage | Copper | Adhesion | Substrates | Loose powder sintering
Journal Article
International Journal of Adhesion and Adhesives, ISSN 0143-7496, 11/2019, p. 102488
Journal Article
Proceedings of the Royal Society B: Biological Sciences, ISSN 0962-8452, 09/2018, Volume 285, Issue 1886, p. 20181515
Journal Article
Polymer, ISSN 0032-3861, 08/2014, Volume 55, Issue 16, p. 4232
Silicones are widely used for electrical insulation due to their high dielectric strength and thermal stability. However, recent studies revealed insufficient... 
Hydrogen | Analysis | Elastomers | Power electronics | Silicones | Electric properties | Fibers | Bonds
Journal Article
IEEE Transactions on Power Electronics, ISSN 0885-8993, 11/2019, Volume 34, Issue 11, pp. 11026 - 11035
Journal Article
The Journal of Physical Chemistry B, ISSN 1520-6106, 09/2005, Volume 109, Issue 34, pp. 16230 - 16243
This feature article concerns Pt surfaces modified (decorated) by ruthenium as model fuel cell electrocatalysts for electrooxidation processes. This work... 
PT ELECTRODE | SINGLE-CRYSTAL ELECTRODES | PLATINUM-ELECTRODES | CARBON-MONOXIDE | ORGANOMETALLIC CHEMISTRY | SMALL ORGANIC-MOLECULES | METHANOL OXIDATION | CHEMISTRY, PHYSICAL | SCANNING-TUNNELING-MICROSCOPY | RUTHENIUM SUBMONOLAYERS | ELECTROCHEMICAL NMR | Material chemistry | Chemical Sciences
Journal Article
IEEE Transactions on Electron Devices, ISSN 0018-9383, 01/2017, Volume 64, Issue 1, p. 494
Journal Article
IEEE Transactions on Power Electronics, ISSN 0885-8993, 08/2019, Volume 34, Issue 8, pp. 7121 - 7125
Die attach by low-temperature silver sintering has been widely used in power electronics packaging. Most of the reported work was done on direct-bond-copper... 
Silver | Gold | pressureless silver sintering | Die attach | Multichip modules | Switches | power module | Nickel | nickel (Ni) plating | Bonding | Substrates | Modules | Shear strength | Metallizing | Organic chemistry | Outgassing | Partial pressure | Low cost | Nickel plating | Sintering | Electronic packaging | Bonding strength | Packaging | Oxidation
Journal Article
Applied Surface Science, ISSN 0169-4332, 10/2019, Volume 490, pp. 403 - 410
The application of multiscale silver paste and bare copper could be a more economical way for power electronics. In this paper, bonding mechanism of die... 
Sintered silver film | Ag-Cu2O bond | Bare copper substrate | Oxide layer | Ag aggregation | Ag-Cu | O bond | OXIDATION | PHYSICS, CONDENSED MATTER | PHYSICS, APPLIED | PARTICLES | CHEMISTRY, PHYSICAL | STRENGTH | JOINTS | LOW-TEMPERATURE | MECHANICAL-PROPERTIES | NANO | DIE-ATTACH | PASTE | MATERIALS SCIENCE, COATINGS & FILMS | Copper products | Grain boundaries | Silver | Metal bonding | Analysis | Sintering | Power electronics
Journal Article
Journal of Materials Processing Technology, ISSN 0924-0136, 05/2018, Volume 255, p. 644
We achieved robust bonding of a large area power chip (>100 mm^sup 2^) with sintered Ag joint produced by the electrical current assisted sintering (ECAS)... 
Low currents | Composite materials | Semiconductors | Electrical properties | Thermal resistance | Sintering | Electronic packaging | Electronics | Transistors | Density
Journal Article
Physical Chemistry Chemical Physics : PCCP, ISSN 1463-9076, 01/2019, Volume 21, Issue 38, pp. 21381 - 21388
In multiferroics, electromagnons have been recognized as a noticeable topic due to their indispensable role in magnetoelectric, magnetodielectric, and... 
Nanoparticles | Antiferromagnetism | Phase boundaries | Bismuth compounds | Ferromagnetism | Phase transitions | Weight | Ferromagnetic phases | Magnetic properties
Journal Article
Materials & Design, ISSN 0264-1275, 02/2018, Volume 140, pp. 64 - 72
Nanosilver sintering is expected to overcome the limitation of relatively high production cost and become widely available for the die bonding of power... 
Silver microparticles | Bare copper | Pressure-free bonding | Silver nanoparticles | Air sintering | OXIDATION | NANOPARTICLES | CARBOXYLATE | ATTACH | MATERIALS SCIENCE, MULTIDISCIPLINARY | JOINTS
Journal Article
Materials Letters, ISSN 0167-577X, 08/2014, Volume 128, pp. 42 - 45
We achieve robust bonding of large area power chip (≥100 mm ) based on pressureless sintering of silver particles at low temperature, i.e., 250 °C. The... 
Die attachment | Microstructures | Pressureless sintering | Diffusion bonding | Silver nanoparticles | PHYSICS, APPLIED | MATERIALS SCIENCE, MULTIDISCIPLINARY | Packaging | Sintering | Electric properties
Journal Article
Materials Letters, ISSN 0167-577X, 11/2017, Volume 206, p. 1
The inhibition effect and mechanism of adding palladium particles to nano-silver paste on the migration of silver in high temperature is reported. The... 
Nanoparticles | Palladium base alloys | Silver | Silver oxides | Sintering | Migration | Oxidation | Silver base alloys
Journal Article
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