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Energy Procedia, ISSN 1876-6102, 11/2016, Volume 98, pp. 86 - 97
Intermetallic compounds (IMC) in soldered interconnections influence the reliability of PV modules. Thus, the microstructure of solar cell interconnections and... 
Intermetallic compounds | Interconnection | Intermetallic phase growth | Photovoltaic module | Reliability | Soldering | Activation energy
Journal Article
Solar Energy Materials and Solar Cells, ISSN 0927-0248, 01/2017, Volume 159, pp. 370 - 388
The microstructure and intermetallic phase growth in solder joints of photovoltaic modules are investigated because of their significance for interconnection... 
Photovoltaic module | Intermetallic compounds | Interconnection | Soldering | THERMAL FATIGUE | LONG-TERM | PHYSICS, APPLIED | ENERGY & FUELS | MATERIALS SCIENCE, MULTIDISCIPLINARY | SILICON | SILVER | RELIABILITY | MECHANICAL-PROPERTIES | LEAD-FREE SOLDERS | PB-FREE SOLDER | Grain boundaries | Analysis | Solar energy
Journal Article
Journal Article
Energy Procedia, ISSN 1876-6102, 11/2016, Volume 98, pp. 125 - 135
Aluminium, thermally evaporated with physical vapor deposition (PVD), is considered a cost efficient rear metallization for crystalline silicon heterojunction... 
Physical vapor deposition | Electrically conductive adhesive | Aluminium | Photovoltaic module | Interconnection | Bismuth-tin solder
Journal Article
Solar Energy Materials and Solar Cells, ISSN 0927-0248, 01/2017, Volume 159, p. 370
The microstructure and intermetallic phase growth in solder joints of photovoltaic modules are investigated because of their significance for interconnection... 
Grain boundaries | Solar cells | Tin compounds | Ribbons | Intermetallic compounds | Busbars | Computer simulation | Metallizing | Intermetallics | Intermetallic phases | Interconnections | Tin base alloys | Thickness | Diffusion layers | Photovoltaic cells | Microscopy | Chemical bonds | Kinetics | Microstructure | Thermal cycling | Growth kinetics | Coarsening | Tapes (metallic) | Photovoltaics
Journal Article
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