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electricity (31) 31
casings or constructional details of electric apparatus (28) 28
electric techniques not otherwise provided for (28) 28
manufacture of assemblages of electrical components (28) 28
printed circuits (28) 28
calculating (16) 16
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counting (16) 16
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blasting (13) 13
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heat exchange in general (12) 12
heat-exchange apparatus, not provided for in another subclass,in which the heat-exchange media do not come into direct contact (12) 12
basic electric elements (9) 9
electric solid state devices not otherwise provided for (9) 9
semiconductor devices (9) 9
engineering, mechanical (8) 8
data center (7) 7
details of heat-exchange and heat-transfer apparatus, ofgeneral application (7) 7
mathematical models (6) 6
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air conditioning (4) 4
design engineering (4) 4
engineering, electrical & electronic (4) 4
proper orthogonal decomposition (4) 4
reduced order (4) 4
cooling (3) 3
dynamical systems (3) 3
energy efficiency (3) 3
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heat transfer (3) 3
mechanics (3) 3
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information technology (2) 2
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methods (2) 2
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reduction (2) 2
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accelerator (1) 1
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arbeitsbelastung (1) 1
artificial neural networks (1) 1
ausrüstungsausfall (1) 1
automotive cooling system (1) 1
automotive fan (1) 1
automotive radiator (1) 1
blowers (1) 1
building construction (1) 1
central processing unit (1) 1
circuits and systems (1) 1
cleaning of internal or external surfaces of heat-exchange orheat-transfer conduits, e.g. water tubes or boilers (1) 1
cnn (1) 1
cold rooms (1) 1
combined heating and refrigeration systems (1) 1
comparative analysis (1) 1
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computer centers (1) 1
computer centres (1) 1
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consumption (1) 1
control systems (1) 1
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cooling or freezing apparatus not covered by any othersubclass (1) 1
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coordinated optimization (1) 1
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doppelboden (1) 1
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electronic mail (1) 1
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elektrische energie (1) 1
energiebilanz (1) 1
energieverbrauch (1) 1
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energy dissipation (1) 1
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08/2018
A data center cooling system includes a modular heat sink and a working fluid. The modular heat sink includes an evaporator configured to thermally contact a... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | ELECTRICITY | PRINTED CIRCUITS
Patent
11/2017
A data center cooling system includes a modular heat sink and a working fluid. The modular heat sink includes an evaporator configured to thermally contact a... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | ELECTRICITY | PRINTED CIRCUITS
Patent
2012, 2012, ISBN 1441971238, Volume 9781441971241
In this chapter, the sustainable and reliable operations of the electronic equipment in data centers are shown to be possible through a reduced order modeling... 
Engineering | Circuits and Systems | Engineering Thermodynamics, Heat and Mass Transfer | Renewable and Green Energy | Building Construction
Book Chapter
04/2019
A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | COMPUTING | COUNTING | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | ELECTRICITY | CALCULATING | PRINTED CIRCUITS
Patent
03/2019
A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | COMPUTING | COUNTING | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | ELECTRICITY | CALCULATING | PRINTED CIRCUITS
Patent
ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013, 2013, Volume 2
Conference Proceeding
12/2018
A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | COMPUTING | COUNTING | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | ELECTRICITY | CALCULATING | PRINTED CIRCUITS
Patent
11/2018
A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | COMPUTING | COUNTING | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | ELECTRICITY | CALCULATING | PRINTED CIRCUITS
Patent
ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013, 2013, Volume 2
Conference Proceeding
ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013, 2013, Volume 2
Conference Proceeding
08/2018
A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | COMPUTING | COUNTING | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | ELECTRICITY | CALCULATING | PRINTED CIRCUITS
Patent
08/2018
A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | COMPUTING | COUNTING | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | ELECTRICITY | CALCULATING | PRINTED CIRCUITS
Patent
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