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electricity (31) 31
casings or constructional details of electric apparatus (28) 28
electric techniques not otherwise provided for (28) 28
manufacture of assemblages of electrical components (28) 28
printed circuits (28) 28
calculating (16) 16
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counting (16) 16
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blasting (13) 13
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lighting (13) 13
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heat exchange in general (12) 12
heat-exchange apparatus, not provided for in another subclass,in which the heat-exchange media do not come into direct contact (12) 12
basic electric elements (9) 9
electric solid state devices not otherwise provided for (9) 9
semiconductor devices (9) 9
engineering, mechanical (8) 8
data center (7) 7
details of heat-exchange and heat-transfer apparatus, ofgeneral application (7) 7
mathematical models (6) 6
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air conditioning (4) 4
design engineering (4) 4
engineering, electrical & electronic (4) 4
proper orthogonal decomposition (4) 4
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dynamical systems (3) 3
energy efficiency (3) 3
flow (3) 3
fluid dynamics (3) 3
heat transfer (3) 3
mechanics (3) 3
thermal management (3) 3
analysis (2) 2
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information technology (2) 2
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accelerator (1) 1
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arbeitsbelastung (1) 1
artificial neural networks (1) 1
ausrüstungsausfall (1) 1
automotive cooling system (1) 1
automotive fan (1) 1
automotive radiator (1) 1
blowers (1) 1
building construction (1) 1
central processing unit (1) 1
circuits and systems (1) 1
cleaning of internal or external surfaces of heat-exchange orheat-transfer conduits, e.g. water tubes or boilers (1) 1
cnn (1) 1
cold rooms (1) 1
combined heating and refrigeration systems (1) 1
comparative analysis (1) 1
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computer centers (1) 1
computer centres (1) 1
concurrency (1) 1
consumption (1) 1
control systems (1) 1
convective systems (1) 1
cooling or freezing apparatus not covered by any othersubclass (1) 1
cooling system (1) 1
coordinated optimization (1) 1
crac modeling (1) 1
data engineering (1) 1
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data processing service centers (1) 1
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doppelboden (1) 1
dynamics (1) 1
electronic mail (1) 1
electronics cooling (1) 1
elektrische energie (1) 1
energiebilanz (1) 1
energieverbrauch (1) 1
energy consumption (1) 1
energy dissipation (1) 1
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03/2019
A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | COMPUTING | COUNTING | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | ELECTRICITY | CALCULATING | PRINTED CIRCUITS
Patent
12/2018
A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | COMPUTING | COUNTING | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | ELECTRICITY | CALCULATING | PRINTED CIRCUITS
Patent
11/2018
A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | COMPUTING | COUNTING | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | ELECTRICITY | CALCULATING | PRINTED CIRCUITS
Patent
08/2018
A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | COMPUTING | COUNTING | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | ELECTRICITY | CALCULATING | PRINTED CIRCUITS
Patent
08/2018
A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | COMPUTING | COUNTING | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | ELECTRICITY | CALCULATING | PRINTED CIRCUITS
Patent
08/2018
A data center cooling system includes a modular heat sink and a working fluid. The modular heat sink includes an evaporator configured to thermally contact a... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | ELECTRICITY | PRINTED CIRCUITS
Patent
05/2018
A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | COMPUTING | COUNTING | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | ELECTRICITY | CALCULATING | PRINTED CIRCUITS
Patent
11/2017
A data center cooling system includes a modular heat sink and a working fluid. The modular heat sink includes an evaporator configured to thermally contact a... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | ELECTRICITY | PRINTED CIRCUITS
Patent
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