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Proceedings of SPIE - The International Society for Optical Engineering, ISSN 0277-786X, 2013, Volume 8681
Advanced thermal annealing processes used for transistor enhancing for the state of the art process nodes induce wafer grid deformations. RTA (Rapid Thermal... 
LSA | HOWA (High Order Wafer Alignment) | Overlay | POR (process of record) | Wafer alignment | RTA | Walking | Annealing | Alignment | Wafers | Distortion | Strategy | Logic | Sampling
Conference Proceeding
Proceedings of SPIE - The International Society for Optical Engineering, ISSN 0277-786X, 2013, Volume 8681
Metrology tools are increasingly challenged by the continuing decrease in the device dimensions, combined with complex disruptive materials and architectures.... 
OCD | Etch | CD-SEM | FinFET | 1X node | Hybrid metrology | Critical dimension | HVM | Contact | Progressions | Construction equipment | Metrology | Tools | Etching | Standards | Three dimensional
Conference Proceeding
Proceedings of SPIE - The International Society for Optical Engineering, ISSN 0277-786X, 2016, Volume 9778
Conference Proceeding
Proceedings of SPIE - The International Society for Optical Engineering, ISSN 0277-786X, 2016, Volume 9778
Conference Proceeding
Proceedings of SPIE - The International Society for Optical Engineering, ISSN 0277-786X, 2013, Volume 8682
The objective of this work was to study the trench and contact hole shrink mechanism in negative tone develop resist processes and its manufacturability... 
Illumination | Time link delay | Solvent developer | Post exposure bake | Negative tone develop | Approximation | Trenches | Mathematical analysis | Resists | Contact holes | Links | Diffusion | Delay
Conference Proceeding
Proceedings of SPIE - The International Society for Optical Engineering, ISSN 0277-786X, 2015, Volume 9424
Conference Proceeding
Proceedings of SPIE - The International Society for Optical Engineering, ISSN 0277-786X, 2015, Volume 9424
Conference Proceeding
Proceedings of SPIE - The International Society for Optical Engineering, ISSN 0277-786X, 2016, Volume 9778
Conference Proceeding
Proceedings of SPIE - The International Society for Optical Engineering, ISSN 0277-786X, 2014, Volume 9050
Conference Proceeding
Proceedings of SPIE - The International Society for Optical Engineering, ISSN 0277-786X, 2014, Volume 9050
Conference Proceeding
2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 04/2018, pp. 174 - 179
Wafers at FBEOL layers traditionally have higher stress and larger alignment signal variability. ASML's ATHENA sensor based scanners, commonly used to expose... 
Semiconductor device modeling | Alignment | Finite impulse response filters | Image color analysis | Lasers | Aluminum layer process | Wafer reject | Probes | Light sources | Periodic structures | Smash Sensor | Smash sensor
Conference Proceeding
11/2018
Approaches for providing a substrate having a planar metrology pad adjacent a set of fins of a fin field effect transistor (FinFET) device are disclosed.... 
TESTING | SEMICONDUCTOR DEVICES | MEASURING ELECTRIC VARIABLES | BASIC ELECTRIC ELEMENTS | MEASURING MAGNETIC VARIABLES | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | MEASURING | PHYSICS | ELECTRICITY
Patent
Proceedings of SPIE - The International Society for Optical Engineering, ISSN 0277-786X, 2017, Volume 10147
Conference Proceeding
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