X
Search Filters
Format Format
Format Format
X
Sort by Item Count (A-Z)
Filter by Count
Conference Proceeding (29) 29
Patent (16) 16
Book Chapter (9) 9
Journal Article (4) 4
Web Resource (4) 4
Book / eBook (2) 2
Dissertation (1) 1
Magazine Article (1) 1
more...
Subjects Subjects
Subjects Subjects
X
Sort by Item Count (A-Z)
Filter by Count
soldering (15) 15
horology (14) 14
physics (14) 14
engineering (11) 11
automation and robotics (10) 10
electronic time-pieces (10) 10
electronics and microelectronics, instrumentation (10) 10
industrial and production engineering (10) 10
manufacturing, machines, tools (10) 10
quality control, reliability, safety and risk (10) 10
simulation and modeling (10) 10
inspection (6) 6
apertures (5) 5
manufacturing processes (5) 5
radio-controlled time-pieces (5) 5
assembly (4) 4
layout (4) 4
printing (4) 4
reliability (4) 4
solders (4) 4
springs (4) 4
temperature (4) 4
boards (3) 3
computer simulation (3) 3
costs (3) 3
electronic apparatus and appliances (3) 3
electronics (3) 3
electronics packaging (3) 3
manufacturing (3) 3
production (3) 3
production engineering (3) 3
seminars (3) 3
technology & engineering (3) 3
temperature measurement (3) 3
warpage (3) 3
area measurement (2) 2
automation (2) 2
capacitors (2) 2
co-planarity (2) 2
computational fluid dynamics (2) 2
copper (2) 2
data analysis (2) 2
electromechanical clocks or watches (2) 2
elektroniktechnologie (2) 2
equations (2) 2
force (2) 2
gratings (2) 2
in-situ x-ray characterization (2) 2
industrial engineering (2) 2
kostenoptimierung (2) 2
lead (2) 2
liquids (2) 2
machinery (2) 2
manufacturing industries (2) 2
mathematical model (2) 2
mathematical models (2) 2
metals (2) 2
neural networks (2) 2
noise figure (2) 2
optimized production technology (2) 2
ovens (2) 2
packaging (2) 2
performing operations (2) 2
predictive models (2) 2
process control (2) 2
prozessmodell (2) 2
prozessoptimierung (2) 2
prozesssimulation (2) 2
qualitätssicherung (2) 2
resistors (2) 2
robust stability (2) 2
semiconductor device measurement (2) 2
shaping clay or other ceramic compositions, slag, or mixturescontaining cementitious material, e.g. plaster (2) 2
size measurement (2) 2
surface finishing (2) 2
system safety (2) 2
testing (2) 2
thermal expansion (2) 2
tin (2) 2
transporting (2) 2
voids (2) 2
working cement, clay, or stone (2) 2
x-ray imaging (2) 2
accelerated aging (1) 1
acceleration (1) 1
additives (1) 1
alloys (1) 1
analysis of variance (1) 1
aparatos e instrumentos (1) 1
aparatos e instrumentos electrónicos (1) 1
artificial intelligence (1) 1
assemblies (1) 1
atmosphere (1) 1
automatic control (1) 1
automobile manufacture (1) 1
baugruppe (1) 1
beads (1) 1
bohrung (1) 1
boundary conditions (1) 1
bridges (1) 1
more...
Library Location Library Location
Language Language
Publication Date Publication Date
Click on a bar to filter by decade
Slide to change publication date range


tm - Technisches Messen, ISSN 0171-8096, 02/2020, Volume 87, Issue 2, pp. 130 - 141
Die Röntgeninspektionstechnik ist aus der Werkstoffanalytik und der physikalischen Fehlersuche nicht mehr wegzudenken. Besonders interessant für die... 
warpage | co-planarity | Verbiegung | Koplanarität | In-situ-Röntgencharakterisierung | In-situ X-ray characterization
Journal Article
2019 42nd International Spring Seminar on Electronics Technology (ISSE), 05/2019, pp. 1 - 6
Printed circuit boards (PCB)and SMD packages are made from different materials which coefficients of thermal expansion can differ much. Hence, under thermal... 
Temperature measurement | Current measurement | Electronic packaging thermal management | Copper | Soldering | Integrated circuit reliability
Conference Proceeding
2018 7th Electronic System-Integration Technology Conference (ESTC), 09/2018, pp. 1 - 6
The coplanarity difference between a substrate or printed circuit board and a SMD package is a very important characteristic. It depends on the warpage of... 
warpage | head-in-pillow | Reliability | coplanarity | reliability
Conference Proceeding
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC), 09/2014, pp. 1 - 6
The reliability of solder joints is an important part of the quality of SMT-Boards. Accelerated reliability tests (e.g. thermal shock or others) are a... 
Geometry | Temperature measurement | Layout | Force | Reliability | Soldering | Standards
Conference Proceeding
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 12/2013, pp. 292 - 297
The reliability of solder joints is one important part of the quality of SMT-Boards. The paper presents a reliability study named R1. The base of the study is... 
Shape | Environmentally friendly manufacturing techniques | Layout | Metals | Reliability | Soldering | Substrates | Solders | Conferences | Alloys | Reliability analysis | Lead free | Failure | Analysis of variance | Electronics packaging
Conference Proceeding
2018 7th Electronic System-Integration Technology Conference (ESTC), 09/2018, pp. 1 - 6
All integrated circuit (IC) packages types designed and buildup using different materials with at least little but partly very different thermal expansion... 
Temperature measurement | Thermal expansion | in-situ X-Ray characterization | warpage | co-planarity | Compounds | Soldering | X-ray imaging | Field programmable gate arrays | Strain
Conference Proceeding
20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015, 01/2016
Conference Proceeding
2015 38th International Spring Seminar on Electronics Technology (ISSE), ISSN 2161-2528, 05/2015, Volume 2015-, pp. 218 - 222
In this paper an investigation on vacuum vapour phase soldering processes is presented. The purpose is to identify influencing factors of the solder profile... 
Insulated gate bipolar transistors | Seminars | Liquids | Apertures | Inspection | Soldering | Springs | Voids | Tombstones | Solders | Boards | Vapour | Chip carriers | Beads
Conference Proceeding
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Conference Proceedings, 09/2015, pp. 1 - 6
Analysis of solder penetration, shape and electrical continuity assessed using wave soldering simulations for a lead-free SnAgCu (SAC) solder, along with... 
Wave soldering | Solders | Boards | Computational fluid dynamics | Computer simulation | Printed circuits | Circuit boards | Mathematical models
Journal Article
2015 European Microelectronics Packaging Conference (EMPC), 09/2015, pp. 1 - 6
Analysis of solder penetration, shape and electrical continuity assessed using wave soldering simulations for a lead-free SnAgCu (SAC) solder, along with... 
Viscosity | Liquids | Computational fluid dynamics | Boundary conditions | Copper | Soldering
Conference Proceeding
Proceedings of the International Spring Seminar on Electronics Technology, ISSN 2161-2528, 09/2016, Volume 2016-, pp. 226 - 231
Conference Proceeding
2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME), 09/2010, pp. 33 - 38
The solder paste printing is one important part of the manufacturing process. More than 50% of all defects of SMT-boards are caused by the printing process.... 
Printing | Apertures | Cleaning | Mathematical model | Equations | Electronics packaging | Six sigma
Conference Proceeding
2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME), 09/2009, pp. 25 - 30
The coplanarity between the substrate (or printed board) and the SMD-package is a very important characteristic. This coplanarity depends on the warpage of the... 
Soldering
Conference Proceeding
2009 32nd International Spring Seminar on Electronics Technology, ISSN 2161-2528, 05/2009, pp. 1 - 5
The coplanarity between the substrate (or printed board) and the SMD-package is a very important characteristic. This coplanarity depends on the warpage of the... 
Temperature | Ovens | Infrared heating | Packaging | Lead | Size measurement | Time measurement | Gratings | Acceleration | Soldering
Conference Proceeding
IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013, 2013, Volume 1, pp. 690 - 698
Conference Proceeding
01/2010, ISBN 9781280619670
Annotation In electronics manufacture, the expanding range of products and the smaller-and-smaller scale of increasingly integrated components is producing a... 
Web Resource
01/2010, ISBN 9781280619670
Annotation In electronics manufacture, the expanding range of products and the smaller-and-smaller scale of increasingly integrated components is producing a... 
Web Resource
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME), 10/2013, pp. 277 - 282
The aim of this paper is to present the most recent results obtained after conducting a complex experiment designed with the help of the Design of Experiments... 
solder void | solder joint | Layout | Apertures | Inspection | DoE | gas occlusions | Soldering | Surface finishing | Standards | X-ray imaging | Voids | Design engineering | Solders | Statistical analysis | Boards | X-rays | Chip formation | Formations
Conference Proceeding
No results were found for your search.

Cannot display more than 1000 results, please narrow the terms of your search.