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by Wilson, Duncan and Ambler, Gareth and Lee, Keon-Joo and Lim, Jae-Sung and Shiozawa, Masayuki and Koga, Masatoshi and Li, Linxin and Lovelock, Caroline and Chabriat, Hugues and Hennerici, Michael and Wong, Yuen Kwun and Mak, Henry Ka Fung and Prats-Sánchez, Luis and Martínez-Domeño, Alejandro and Inamura, Shigeru and Yoshifuji, Kazuhisa and Arsava, Ethem Murat and Horstmann, Solveig and Purrucker, Jan and Lam, Bonnie Yin Ka and Wong, Adrian and Kim, Young Dae and Song, Tae-Jin and Schrooten, Maarten and Lemmens, Robin and Eppinger, Sebastian and Gattringer, Thomas and Uysal, Ender and Tanriverdi, Zeynep and Bornstein, Natan M and Assayag, Einor Ben and Hallevi, Hen and Tanaka, Jun and Hara, Hideo and Coutts, Shelagh B and Hert, Lisa and Polymeris, Alexandros and Seiffge, David J and Lyrer, Philippe and Algra, Ale and Kappelle, Jaap and Al-Shahi Salman, Rustam and Jäger, Hans R and Lip, Gregory Y H and Mattle, Heinrich P and Panos, Leonidas D and Mas, Jean-Louis and Legrand, Laurence and Karayiannis, Christopher and Phan, Thanh and Gunkel, Sarah and Christ, Nicolas and Abrigo, Jill and Leung, Thomas and Chu, Winnie and Chappell, Francesca and Makin, Stephen and Hayden, Derek and Williams, David J and Kooi, M Eline and van Dam-Nolen, Dianne H K and Barbato, Carmen and Browning, Simone and Wiegertjes, Kim and Tuladhar, Anil M and Maaijwee, Noortje and Guevarra, Christine and Yatawara, Chathuri and Mendyk, Anne-Marie and Delmaire, Christine and Köhler, Sebastian and van Oostenbrugge, Robert and Zhou, Ying and Xu, Chao and Hilal, Saima and Gyanwali, Bibek and Chen, Christopher and Lou, Min and Staals, Julie and Bordet, Régis and Kandiah, Nagaendran and de Leeuw, Frank-Erik and Simister, Robert and van der Lugt, Aad and Kelly, Peter J and Wardlaw, Joanna M and Soo, Yannie and Fluri, Felix and Srikanth, Velandai and Calvet, David and Jung, Simon and Kwa, Vincent I H and Engelter, Stefan T and Peters, Nils and Smith, Eric E and Yakushiji, Yusuke and Orken, Dilek Necioglu and Fazekas, Franz and Thijs, Vincent and Heo, Ji Hoe and ... and Microbleeds International Collaborative Network and Microbleeds Int Collaborative Net
Lancet neurology, ISSN 1474-4422, 2019, Volume 18, Issue 7, pp. 653 - 665
Cerebral microbleeds are a neuroimaging biomarker of stroke risk. A crucial clinical question is whether cerebral microbleeds indicate patients with recent... 
SMALL VESSEL DISEASE | DEMENTIA | WARFARIN | AMYLOID ANGIOPATHY | T2-ASTERISK-WEIGHTED MR-IMAGES | INTRACEREBRAL HEMORRHAGE | RECURRENT STROKE | CHINESE PATIENTS | ASSOCIATION | CLINICAL NEUROLOGY | ATRIAL-FIBRILLATION | Drugs | Studies | Neuroimaging | Anticoagulants | Stroke | Transient ischemic attack | Magnetic resonance imaging | Collaboration | Bias | Patients | Hemorrhage | Magnetic susceptibility
Journal Article
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 12/2017, Volume 2018-, pp. 1 - 4
Production of electronic devices and systems is not thinkable without measuring techniques to evaluate physical values for describing the state of those... 
Electronic publishing | Internet | Encyclopedias | Testing
Conference Proceeding
Stroke (1970), ISSN 0039-2499, 08/2020, Volume 51, Issue 8, pp. 2339 - 2346
BACKGROUND AND PURPOSE:Improving door-to-needle times (DNTs) for thrombolysis of acute ischemic stroke patients improves outcomes, but participation in DNT... 
Stroke (Disease) | Canada | Neurosciences | Hospitals | Alberta | Patient outcomes | Saskatchewan | Stroke patients
Journal Article
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 09/2019, pp. 1 - 5
Electronic devices becomes more and more mechanical flexible [1]. Additive manufacturing, e.g. printing of functional layers is one solution to build up such... 
open form | heterogenous integration | Reliability | Copper | Soldering | Flexible electronics | Substrates | Stress | bendable
Conference Proceeding
tm - Technisches Messen, ISSN 0171-8096, 02/2020, Volume 87, Issue 2, pp. 130 - 141
Die Röntgeninspektionstechnik ist aus der Werkstoffanalytik und der physikalischen Fehlersuche nicht mehr wegzudenken. Besonders interessant für die... 
warpage | co-planarity | Verbiegung | Koplanarität | In-situ-Röntgencharakterisierung | In-situ X-ray characterization
Journal Article
Canadian Journal of Cardiology, ISSN 0828-282X, 07/2018, Volume 34, Issue 7, pp. 889 - 896
Stroke is a leading cause of adult disability and the fourth leading cause of death in Canada. Most strokes are ischemic and functional outcome is highly... 
TELEMEDICINE | NEUROLOGISTS | NETWORK | PROJECT | CARDIAC & CARDIOVASCULAR SYSTEMS | ACUTE ISCHEMIC-STROKE | TELESTROKE | THROMBOLYSIS | RELIABILITY | EXPERIENCE | CARE | Disease Management | Humans | Telemedicine - methods | Stroke - therapy | Quality Control
Journal Article
2018 7th Electronic System-Integration Technology Conference (ESTC), 09/2018, pp. 1 - 7
In recent years, the market volume for power electronics has grown steadily and the development was assisted by innovative packaging technologies. Increased... 
Heating systems | Semiconductor device measurement | nondestructive inspection | silver sintering | thermal coupling | void | Inspection | Power electronics | Ceramics | thermography | Junctions | Substrates | power electronics
Conference Proceeding
2018 7th Electronic System-Integration Technology Conference (ESTC), 09/2018, pp. 1 - 4
Ultrathin sensors are used in a wide range of applications. In the current work an ultrathin sensor for Active Magnetic Bearings (AMB) has to be realized.... 
Temperature sensors | Magnetic sensors | flexible | open form | Silicon | ultrathin | Reliability | Soldering | Substrates | bendable
Conference Proceeding
by Wilson, Duncan and Ambler, Gareth and Lee, Keon-Joo and Lim, Jae-Sung and Shiozawa, Masayuki and Koga, Masatoshi and Li, Linxin and Lovelock, Caroline and Chabriat, Hugues and Hennerici, Michael and Wong, Yuen Kwun and Mak, Henry Ka Fung and Prats-Sánchez, Luis and Martínez-Domeño, Alejano and Inamura, Shigeru and Yoshifuji, Kazuhisa and Arsava, Ethem Murat and Horstmann, Solveig and Purrucker, Jan and Lam, Bonnie Yin Ka and Wong, Aian and Kim, Young Dae and Song, Tae-Jin and Schrooten, Maarten and Lemmens, Robin and Eppinger, Sebastian and Gattringer, Thomas and Uysal, Ender and Tanriverdi, Zeynep and Bornstein, Natan M and Assayag, Einor Ben and Hallevi, Hen and Tanaka, Jun and Hara, Hideo and Coutts, Shelagh B and Hert, Lisa and Polymeris, Alexanos and Seiffge, David J and Lyrer, Philippe and Algra, Ale and Kappelle, Jaap and Al-Shahi Salman, Rustam and Jäger, Hans R and Lip, Gregory Y. H and Mattle, Heinrich P and Panos, Leonidas D and Mas, Jean-Louis and Legrand, Laurence and Karayiannis, Christopher and Phan, Thanh and Gunkel, Sarah and Christ, Nicolas and Abrigo, Jill and Leung, Thomas and Chu, Winnie and Chappell, Francesca and Makin, Stephen and Hayden, Derek and Williams, David J and Kooi, M. Eline and van Dam-Nolen, Dianne H. K and Barbato, Carmen and Browning, Simone and Wiegertjes, Kim and Tuladhar, Anil M and Maaijwee, Noortje and Guevarra, Christine and Yatawara, Chathuri and Mendyk, Anne-Marie and Delmaire, Christine and Köhler, Sebastian and van Oostenbrugge, Robert and Zhou, Ying and Xu, Chao and Hilal, Saima and Gyanwali, Bibek and Chen, Christopher and Lou, Min and Staals, Julie and Bordet, R. gis and Kandiah, Nagaenan and de Leeuw, Frank-Erik and Simister, Robert and van der Lugt, Aad and Kelly, Peter J and Wardlaw, Joanna M and Soo, Yannie and Fluri, Felix and Srikanth, Velandai and Calvet, David and Jung, Simon and Kwa, Vincent I. H and Engelter, Stefan T and Peters, Nils and Smith, Eric E and Yakushiji, Yusuke and Orken, Dilek Necioglu and Fazekas, Franz and Thijs, Vincent and Heo, Ji Hoe and ...
Lancet neurology, ISSN 1474-4422, 07/2019, Volume 18, Issue 7, pp. 653 - 665
Background: Cerebral microbleeds are a neuroimaging biomarker of stroke risk. A crucial clinical question is whether cerebral microbleeds indicate patients... 
yes
Journal Article
2018 7th Electronic System-Integration Technology Conference (ESTC), 09/2018, pp. 1 - 6
All integrated circuit (IC) packages types designed and buildup using different materials with at least little but partly very different thermal expansion... 
Temperature measurement | Thermal expansion | in-situ X-Ray characterization | warpage | co-planarity | Compounds | Soldering | X-ray imaging | Field programmable gate arrays | Strain
Conference Proceeding
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 06/2018, pp. 8 - 13
The growing market volume of power electronics during the past years leads to innovative packaging technologies and enhanced requirements on productivity and... 
Heating systems | Strips | DCB | void | non-destructive inspection | DBC | Inspection | Ceramics | thermography | Substrates | power electronics | Temperature measurement | component | Packaging
Conference Proceeding
20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015, 01/2016
Conference Proceeding
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Conference Proceedings, 09/2015, pp. 1 - 6
Current developments in power electronics are driving the need for higher operating temperatures. At temperatures above 200 degree C conventional solders can... 
Voids | Electric power generation | Solders | X-rays | Electronics | Diffusion | Soldering | Operating temperature
Journal Article
2015 European Microelectronics Packaging Conference (EMPC), 09/2015, pp. 1 - 6
Current developments in power electronics are driving the need for higher operating temperatures. At temperatures above 200 °C conventional solders can no... 
Europe | Packaging | Calibration | Microelectronics | Soldering | X-ray imaging | Videos
Conference Proceeding
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), ISSN 0569-5503, 05/2016, Volume 2016-, pp. 1228 - 1234
Conference Proceeding
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC), 09/2014, pp. 1 - 6
In power electronics there is currently a development to higher operating temperatures of up to 300 °C. This was made possible by an improved availability of... 
Temperature measurement | Liquids | Cooling | Soldering | Substrates | Chemicals | Videos
Conference Proceeding
Proceedings of SPIE - The International Society for Optical Engineering, ISSN 0277-786X, 2014, Volume 9254
Conference Proceeding
08/2018
Röntgendetektor miteinem Röntgenstrahlung (R) direkt in elektrische Ladungsträger wandelnden ersten Röntgensensor (1),einer elektrisch mit dem ersten... 
TESTING | ELECTRIC COMMUNICATION TECHNIQUE | MEASURING | PHYSICS | MEASUREMENT OF NUCLEAR OR X-RADIATION | PICTORIAL COMMUNICATION, e.g. TELEVISION | ELECTRICITY
Patent
20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015, 01/2016
Conference Proceeding
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