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PLoS Computational Biology, ISSN 1553-734X, 10/2014, Volume 10, Issue 10
  Folding of the chromosomal fibre in interphase nuclei is an important element in the regulation of gene expression. For instance, physical contacts between... 
Proteins | Data processing | Genomes | Gene expression | Chromosomes | Experiments | Cohesion | Mathematical models | Models | Modelling | Folding
Journal Article
06/2018
A system and method are provided which use a machine learning algorithm to obtain a learned annotation of objects in one or more scales of a multiscale image.... 
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL | PRESENTATION OF DATA | HANDLING RECORD CARRIERS | COMPUTING | COUNTING | PHYSICS | CALCULATING | RECORD CARRIERS | RECOGNITION OF DATA
Patent
Microelectronics Reliability, ISSN 0026-2714, 2004, Volume 44, Issue 12, pp. 2011 - 2017
More than 65% of IC failures are related to thermal and mechanical problems. For wafer backend processes, thermo-mechanical failure is one of the major... 
PHYSICS, APPLIED | ENGINEERING, ELECTRICAL & ELECTRONIC
Journal Article
Microelectronics Reliability, ISSN 0026-2714, 2007, Volume 47, Issue 2, pp. 290 - 294
Among various materials, polymers are widely used in microelectronics as different product constituents, such as encapsulants, conductive or non-conductive... 
NANOSCIENCE & NANOTECHNOLOGY | PHYSICS, APPLIED | ENGINEERING, ELECTRICAL & ELECTRONIC | Polymers | Polymer industry
Journal Article
British Journal of Ophthalmology, ISSN 0007-1161, 08/1999, Volume 83, Issue 8, p. 914
AIMS To describe two phenotypic variations of autosomal recessive retinal dystrophy occurring in a consanguineous family in a pseudodominant pattern, resulting... 
Macular degeneration | Genotype & phenotype | Mutation | Patients | Adaptation
Journal Article
Microelectronics Reliability, ISSN 0026-2714, 2009, Volume 49, Issue 3, pp. 331 - 339
In this work experimental results of thermal cycling tests on HVQFN-packages mounted on printed circuit boards are combined with finite element analyses.... 
NANOSCIENCE & NANOTECHNOLOGY | PHYSICS, APPLIED | FATIGUE LIFE | ENGINEERING, ELECTRICAL & ELECTRONIC | Circuit printing | Printed circuits | Fatigue testing machines | Materials | Fatigue | Environmental testing | Universities and colleges
Journal Article
Microelectronics Reliability, ISSN 0026-2714, 2006, Volume 46, Issue 9, pp. 1679 - 1684
The mechanical response at the interface between the silicon, low-k and copper layer of the wafer is simulated herein under the loading of the... 
NANOSCIENCE & NANOTECHNOLOGY | PHYSICS, APPLIED | ENGINEERING, ELECTRICAL & ELECTRONIC | Thin films | Analysis | Questions and answers | Silicon | Dielectric films | Laminated materials | Production processes
Journal Article
Plant Disease, ISSN 0191-2917, 08/2005, Volume 89, Issue 8, pp. 822 - 827
Extensive surveys of native weed populations in peach orchards heavily infected with Plum pox virus strain D (PPV-D) in the Niagara Region quarantine area,... 
Host range | host range | PLANT SCIENCES
Journal Article
Heart, ISSN 0007-1161, 07/2001, Volume 86, Issue 1, p. 91
Aim: To describe the clinical and genetic aspects of a retinal dystrophy that combines central areolar choroidal dystrophy (CACD) and autosomal dominantly... 
Journal Article
Microelectronics Reliability, ISSN 0026-2714, 2003, Volume 43, Issue 5, pp. 765 - 774
During the manufacturing, testing and service, thermally induced deformations and stresses will occur in IC devices and packages, which may cause various kinds... 
PHYSICS, APPLIED | ENGINEERING, ELECTRICAL & ELECTRONIC
Journal Article
Microelectronics Reliability, ISSN 0026-2714, 2008, Volume 48, Issue 6, pp. 833 - 842
Since recent years, micro-electronic industry changed the basic materials from Al/SiO to Cu/low- in IC interconnect structure. As a consequence, new... 
LOW-DIELECTRIC-CONSTANT | DELAMINATION | FRACTURE | PHYSICS, APPLIED | FILMS | NANOSCIENCE & NANOTECHNOLOGY | INTERCONNECTS | MICROELECTRONICS | CHALLENGES | CRACKS | ENGINEERING, ELECTRICAL & ELECTRONIC
Journal Article
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings, 12/2015, pp. 75 - 78
The use of copper-based dual gauge leadframe design is proven effective in the thermal, electrical, and reliability of power devices housed in a Surface Mount... 
Design engineering | Conferences | Semiconductors | Packages | Design analysis | Gages | Heat sinks | Gauges
Conference Proceeding
Journal Article
1994, ISBN 9780315926684
Nonlinear optical techniques have been used to investigate the symmetry properties of interfaces between media comprising at least one Group IV semiconductor.... 
Physics Theses | Optics
Dissertation
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