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3d xpoint (11) 11
three-dimensional displays (7) 7
nonvolatile memory (6) 6
random access memory (6) 6
3d xpoint memory (4) 4
3d integration (3) 3
computer architecture (3) 3
engineering, electrical & electronic (3) 3
hohe dichte (3) 3
kernel (3) 3
nichtflüchtiger speicher (3) 3
nvm (3) 3
optimization (3) 3
performance evaluation (3) 3
persistent memory (3) 3
3d vertical reram (2) 2
bandwidth (2) 2
benchmarking (2) 2
etching characteristics (2) 2
flash memories (2) 2
graphics processing units (2) 2
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Journal Article
2018 IEEE 24th International Conference on Parallel and Distributed Systems (ICPADS), ISSN 1521-9097, 12/2018, Volume 2018-, pp. 1 - 10
Intel's Optane SSD recently came to the market as the pioneer of 3D XPoint based commercial devices. They have much lower latency (about 14 μs) and better... 
Performance evaluation | Three-dimensional displays | Nonvolatile memory | Random access memory | solid-state drive (SSD) | Bandwidth | 3D XPoint | Hardware | Virtualization | performance analysis | non-volatile memory (NVM) | virtualization
Conference Proceeding
2019 IEEE 35th International Conference on Data Engineering Workshops (ICDEW), 04/2019, pp. 300 - 305
3D XPoint will likely be the first commercially available main memory NVM solution targeting mainstream computer systems. Previous database studies on NVM... 
Evaluation | NVM | 3D XPoint
Conference Proceeding
Computers and Electrical Engineering, ISSN 0045-7906, 03/2019, Volume 74, pp. 47 - 58
Journal Article
Proceedings of the 21st international conference on parallel architectures and compilation techniques, ISSN 1089-795X, 09/2012, pp. 75 - 86
With multi-core processors now mainstream, the shift to many-core processors poses a new set of design challenges. In particular, the scalability of coherence... 
bus design | 3D integration | cache coherence | interconnect | Industries | Protocols | Three-dimensional displays | 3D Integration | Interconnect Permission | Two dimensional displays | Coherence | Benchmark testing | Delays | Bus Design | Cache Coherence | Bus design | Cache coherence | Interconnect
Conference Proceeding
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), 07/2018, pp. 223 - 227
3D XPoint memory is one of the new memory using phase change memory (PCM) and ovonic threshold switch (OTS) with 20 nm 3-dimensional cross array structure.... 
Signal Integrity | 3D XPoint Memory | Interconnection | Phase Change Memory | Ovonic Threshold Switch
Conference Proceeding
Proceedings of the International Conference on computer-aided design, ISSN 1092-3152, 11/2018, pp. 1 - 8
It is extremely challenging to deploy computing-intensive convolutional neural networks (CNNs) with rich parameters in mobile devices because of their limited... 
process-in-memory | lookup-based CNN | 3D vertical ReRAM | Convolutional codes | Training | Lookup-based CNN | Three-dimensional displays | Dictionaries | Quality of service | Mobile handsets | Hardware
Conference Proceeding
2018
The long stated vision of persistent memory is set to be realized with the release of 3D XPoint memory by Intel and Micron. Persistent memory, as the name... 
atomic durability | 3D XPoint memory | persistent memory
Dissertation
Supercomputing Frontiers and Innovations, ISSN 2409-6008, 2018, Volume 5, Issue 1, pp. 79 - 94
Journal Article
2019 IEEE 37th International Conference on Computer Design (ICCD), 11/2019, pp. 341 - 349
This paper investigates bandwidth-efficient DRAM caching for hybrid DRAM + 3D-XPoint memories. 3D-XPoint is becoming a viable alternative to DRAM as it enables... 
Alloy Cache | Optane DC Persistent Memory | 3D XPoint | DRAM | TIMBER Cache | DRAM Cache | Bandwidth Efficient
Conference Proceeding
Advanced Electronic Materials, ISSN 2199-160X, 09/2019, Volume 5, Issue 9, pp. 1800914 - n/a
The NAND flash memory serves as the key enabler of the flourishing of portable handheld information devices, such as the cellular phone. The recent upsurge in... 
scaling | 3D Xpoint | resistive switching memory | vertical NAND flash | architecture | MIGRATION | PHYSICS, APPLIED | PERFORMANCE | RETENTION | MATERIALS SCIENCE, MULTIDISCIPLINARY | NANOSCIENCE & NANOTECHNOLOGY | GE2SB2TE5 | FLASH MEMORY | PHASE-CHANGE MATERIALS | CHANNEL | RESISTANCE | ETCHING CHARACTERISTICS | FORMING-FREE
Journal Article
Proceedings of the 30th on symposium on parallelism in algorithms and architectures, 07/2018, pp. 95 - 98
The infamous memory-processor bottleneck has motivated the search for logic-in-memory architectures. In this paper, we demonstrate how the transitive closure... 
matrix multiplication | 3d xpoint | rram | computation-in-memory | in-memory computing | logic-in-memory | transitive closure
Conference Proceeding
2018 IEEE 7th Non-Volatile Memory Systems and Applications Symposium (NVMSA), 08/2018, pp. 19 - 24
Recent high performance computer architecture has deeper memory hierarchy including 3D stacking memory and non-volatile memory. In order to achieve higher... 
Performance evaluation | Shape | NVM | 3D-XPoint | Graphics processing units | Random access memory | Stencil | memory hierarchy | Temporal Blocking | Algorithm | GPGPU | CUDA | Memory management | Arrays | Kernel
Conference Proceeding
2018 26th Euromicro International Conference on Parallel, Distributed and Network-based Processing (PDP), 03/2018, pp. 249 - 254
Intel announced to launch a Xeon with high-latency main memory based on 3D Xpoint in 2018. This paper presents the performance evaluation of sparse matrix... 
SpMV | NVM | 3D Xpoint | Random access memory | Throughput | Benchmarking | Sparse matrices | HPCG | Three-dimensional displays | Sensitivity | Bandwidth | Workload characterization | Sparse matrix | Kernel | Graph500
Conference Proceeding
Proceedings of the 2nd International Conference on high performance compilation, computing and communications, 03/2018, pp. 27 - 34
The launch of DIMM type 3D XPoint is planned in 2018, and machines that have such devices as large main memory will be commodity in the near future. It is... 
benchmarking | multithread | 3D Xpoint | DRAM cache memory | manycore | performance evaluation | nonvolatile memory | Performance evaluation | Multithread | Nonvolatile memory | Benchmarking | Manycore
Conference Proceeding
2019 IEEE International Symposium on Circuits and Systems (ISCAS), ISSN 2158-1525, 05/2019, pp. 1 - 5
Self-determining resource control (SDRC) of hierarchical non-volatile memories is proposed for the multi-tenant data center storage. Proposed SDRC adjusts the... 
NAND flash memory | Multi-tenant data center storage | Memory resource control | PRAM | Flash memories | Optimization | Data centers | Three-dimensional displays | Nonvolatile memory | Microprocessors | MRAM | Computer architecture | 3D XPoint | Storage class memory
Conference Proceeding
2017 IEEE 6th Non-Volatile Memory Systems and Applications Symposium (NVMSA), 08/2017, pp. 1 - 5
Next generation memory technologies, which we denote as new memory, have both nonvolatile and byte addressable properties. These characteristics are expected... 
Power demand | System launch | Nonvolatile memory | Instruction sets | Power management | Random access memory | Booting | 3D XPoint | Persistent computing | Image restoration | Kernel
Conference Proceeding
2016 IEEE 8th International Memory Workshop (IMW), 05/2016, pp. 1 - 4
Ultra-low latency, high endurance SSDs are poised to enter the market, based on 3D XPoint™ memory. Here we show that for these new SSDs and modern platforms,... 
Three-dimensional displays | Linux | Random access memory | Media | Time measurement | Synthetic aperture sonar | Optimization | solid state disk | memory | systems | 3D XPoint | performance optimization | storage | persistent memory | Platforms | Rest | Durability | Markets | Workshops | Endurance | Three dimensional
Conference Proceeding
04/2018, ISBN 9780262037532
Reckless financing for expansion by its new management led ECD to file for bankruptcy in February 2012. That failure also ended Ovshinsky’s solar power effort.... 
History of Science and Technology | Ovonyx | BASF | 3D Xpoint memory | ECD bankruptcy | Ovshinsky Innovation
Book Chapter
Proceedings of the 27th International Conference on parallel architectures and compilation techniques, ISSN 1089-795X, 11/2018, pp. 1 - 12
The advance of DRAM manufacturing technology slows down, whereas the density and performance needs of DRAM continue to increase. This desire has motivated the... 
asymmetric latency memory | hardware managed migration | 3D stacked memory | Asymmetric latency memory | Hardware managed migration
Conference Proceeding
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