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Journal of Lightwave Technology, ISSN 0733-8724, 03/2015, Volume 33, Issue 6, pp. 1247 - 1254
This paper presents a 50 Gb/s per lane hybrid BiCMOS and silicon photonic integrated circuit for use in fiber optic communications. Fine pitch copper pillars... 
Integrated circuits | Integrated optics | Mach-Zehnder Modulator | Silicon photonics | Optical modulation | 50Gb/s | Optical waveguides | High-speed optical techniques | Mach-Zehnder modulator | 50 Gb/s | FUTURE | OPTICS | TELECOMMUNICATIONS | silicon photonics | ENGINEERING, ELECTRICAL & ELECTRONIC | Optical fibers | Lasers | Electronics | Silicon | Lanes | Devices | Channels | Photonics
Journal Article
電子情報通信学会技術研究報告. EMD, 機構デバイス, ISSN 0913-5685, 08/2013, Volume 113, pp. 117 - 122
Beyond... 
Journal Article
電子情報通信学会技術研究報告. CPM, 電子部品・材料, ISSN 0913-5685, 08/2013, Volume 113, pp. 117 - 122
Beyond... 
Journal Article
電子情報通信学会技術研究報告. LQE, レーザ・量子エレクトロニクス, ISSN 0913-5685, 08/2013, Volume 113, pp. 117 - 122
Beyond... 
Journal Article
電子情報通信学会技術研究報告. R, 信頼性, ISSN 0913-5685, 08/2013, Volume 113, pp. 117 - 122
Beyond... 
Journal Article
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, ISSN 0021-4922, 05/2005, Volume 44, Issue 5 B, pp. 3445 - 3448
We have developed write/read technologies for post-Blu-ray Disc (BD) with a capacity of 50 GB/layer. In this report, the authors propose a crosstalk... 
High track density | PRML | Cross-talk cancellation | 50GB | cross-talk cancellation | PHYSICS, APPLIED | high track density
Journal Article
電子情報通信学会技術研究報告. OPE, 光エレクトロニクス, ISSN 0913-5685, 08/2013, Volume 113, pp. 117 - 122
Beyond... 
Journal Article
Proceedings of SPIE, ISSN 0277-786X, 09/2003, Volume 5069, Issue 1, pp. 82 - 89
We have developed dual-layer write-once media with Te-O-Pd based recording films on Blu-ray (BD) format. Recording capacity was 50GB with dual layers on a disk... 
Telluride | BD 4x | High speed | Dual layers | Write-once | Blu-ray Disc | Te-O-Pd | 50GB
Conference Proceeding
電子情報通信学会技術研究報告. CPM, 電子部品・材料, ISSN 0913-5685, 09/2004, Volume 104, pp. 29 - 32
... 
Journal Article
電子情報通信学会技術研究報告. ICD, 集積回路, ISSN 0913-5685, 07/2004, Volume 104, pp. 1 - 6
... 
Journal Article
電子情報通信学会技術研究報告. MR, 磁気記録, ISSN 0913-5685, 02/2003, Volume 102, pp. 19 - 23
... 
Journal Article
電子情報通信学会技術研究報告. CPM, 電子部品・材料, ISSN 0913-5685, 02/2003, Volume 102, pp. 19 - 23
... 
Journal Article
Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710), 2003, pp. 59 - 62
In this work, standard multi-layer ceramic (Alumina) BGA packages were designed and fabricated to accommodate a 50Gb/s flip-chip multiplexing circuit built on... 
Germanium silicon alloys | Packaging | Frequency | BiCMOS integrated circuits | Ceramics | Coaxial components | Bonding | Soldering | Testing | Silicon germanium | Model-to-hardware correlation | Ceramic BGA | Specifications | 50Gb/s
Conference Proceeding
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