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08/2013
Electronic circuitry comprising operational circuits of active switching type requiring timing signals, and conductive means for distributing said timing... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | COMPUTING | COUNTING | PHYSICS | ELECTRIC DIGITAL DATA PROCESSING | ELECTRICITY | BASIC ELECTRONIC CIRCUITRY | PULSE TECHNIQUE | CALCULATING
Patent
02/2016
A method of making a logic gate array includes providing a substrate; forming an array of first conductive lines with plurality of first pads disposed on each... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | ELECTRICITY | PRINTED CIRCUITS
Patent
10/2015
A method of making a logic gate array includes providing a substrate; forming an array of first conductive lines with plurality of first gaps disposed on each... 
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS | ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR | ELECTRICITY | PRINTED CIRCUITS
Patent
07/2015
The present disclosure includes novel techniques to provide wafer level fan-outs in electronic circuit packages housing one or more circuit devices, at least... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
04/2015
An assembler receives a circuit device and a mass of conductive material such as a diode, metal material, etc. The assembler bonds a first facing of a circuit... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
07/2014
A circuit package includes: electronic circuitry, electrically conductive material forming multiple leads, and multiple connections between the electronic... 
SEMICONDUCTOR DEVICES | BASIC ELECTRIC ELEMENTS | ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | ELECTRICITY
Patent
Patent
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