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backside tsv-last (2) 2
copper (2) 2
copper plasticity (2) 2
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IEEE Transactions on Device and Materials Reliability, ISSN 1530-4388, 09/2016, Volume 16, Issue 3, pp. 402 - 412
The effects of copper permanent deformation during thermal cycles in backside through-silicon via (TSV)-last fabrication process are studied using an advanced... 
Backside TSV-last | Stress | Strain | three-dimensional integrated circuits (3D-IC) | through-silicon vias (TSVs) | performance | copper plasticity | TSV liner | Copper | Mathematical model | Reliability | Plastics | Through-silicon vias | reliability | Electronics industry
Journal Article
IEEE Transactions on Device and Materials Reliability, ISSN 1530-4388, 12/2019, Volume 19, Issue 4, pp. 642 - 653
Copper plastic deformation and liner viscoelastic flow effects on performance and reliability are studied for TSV-middle and backside TSV-last fabrication... 
Viscosity | TSV performance | reliability | metal thinning | backside TSV-last | Stress | Strain | through-silicon vias (TSVs) | copper plasticity | Three-dimensional integrated circuits (3D-IC) | TSV-middle | extrusion | Mathematical model | Copper | Plastics | liner viscoelasticity | Through-silicon vias
Journal Article
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