X
Search Filters
Format Format
Format Format
X
Sort by Item Count (A-Z)
Filter by Count
Journal Article (4604) 4604
Dissertation (1351) 1351
Magazine Article (110) 110
Publication (109) 109
Book Review (68) 68
Conference Proceeding (38) 38
Book Chapter (16) 16
Government Document (2) 2
Reference (1) 1
more...
Subjects Subjects
Subjects Subjects
X
Sort by Item Count (A-Z)
Filter by Count
chips (2026) 2026
design engineering (441) 441
チップ (421) 421
chip (414) 414
index medicus (358) 358
chip-chip (347) 347
chip formation (274) 274
技術 (261) 261
circuits (254) 254
devices (246) 246
mathematical models (237) 237
computer programs (236) 236
hardware (232) 232
システム (209) 209
algorithms (206) 206
computer simulation (191) 191
humans (172) 172
mathematical analysis (171) 171
software (168) 168
biochemistry & molecular biology (160) 160
modules (159) 159
実装 (158) 158
control systems (155) 155
field programmable gate arrays (153) 153
設計 (149) 149
electronics (142) 142
回路 (142) 142
chemistry, analytical (141) 141
cmos (140) 140
circuit design (136) 136
chromatin immunoprecipitation (131) 131
chemistry, multidisciplinary (130) 130
microfluidic chip (130) 130
networks (128) 128
gene expression (125) 125
animals (124) 124
optimization (119) 119
cutting (116) 116
切削 (116) 116
開発 (114) 114
electric potential (113) 113
simulation (113) 113
system on chip (113) 113
評価 (112) 112
voltage (111) 111
high speed (109) 109
digital (107) 107
flip chip (107) 107
集積 (106) 106
on-chip (105) 105
特集 (100) 100
vlsi (99) 99
genomics (97) 97
semiconductors (97) 97
sensors (97) 97
cutting force (96) 96
network-on-chip (96) 96
flip-chip (93) 93
architecture (92) 92
using (92) 92
research (91) 91
chromatin (90) 90
研究 (90) 90
analysis (89) 89
dna (89) 89
gene-expression (89) 89
proteins (89) 89
digital signal processing (88) 88
power consumption (85) 85
検討 (85) 85
オンチップ (83) 83
特性 (82) 82
解析 (82) 82
binding sites (80) 80
genetics & heredity (80) 80
monitoring (80) 80
microfluidics (79) 79
transcription (79) 79
光 (79) 79
communication systems (77) 77
genes (77) 77
microprocessors (76) 76
system (76) 76
systems (76) 76
電子 (76) 76
real time (75) 75
tools (75) 75
channels (74) 74
integrated (74) 74
切りくず (74) 74
platforms (73) 73
transcription factors - metabolism (72) 72
加工 (71) 71
genome (70) 70
oligonucleotide array sequence analysis (69) 69
材料 (69) 69
buses (67) 67
機構 (67) 67
biotechnology & applied microbiology (66) 66
cell biology (66) 66
more...
Language Language
Publication Date Publication Date
Click on a bar to filter by decade
Slide to change publication date range


by Jiang, LH and Li, YX and Liu, Q
PROGRESS IN BIOCHEMISTRY AND BIOPHYSICS, ISSN 1000-3282, 09/2010, Volume 37, Issue 9, pp. 996 - 1005
Uncovering the underlying regulatory mechanism has become a major research in bioinformatics studies. The availability of various kinds of high-throughput... 
PROTEIN | BIOCHEMISTRY & MOLECULAR BIOLOGY | TRANSCRIPTION | TF knock out expression data | SACCHAROMYCES-CEREVISIAE | GENOME | gene regulatory networks | MODULES | BIOPHYSICS | SEQUENCE | GROWTH | ChIP-chip | COMPUTATIONAL DISCOVERY | BINDING | MICROARRAY DATA
Journal Article
エレクトロニクス実装学会誌, ISSN 1343-9677, 2007, Volume 10, Issue 7, pp. 546 - 556
The three-dimensional (3D) chip stacking LSI under development in ASET uses new SIP (systemin-a-package) packaging technologies to realize high-density and... 
System in Package (SIP) | Chip-on-Chip (COC) | Temperature Cycling Test (TCT) | Underfill Resin | Ultrasonic Flip-Chip Bonding (UFB) | Finite Element Method (FEM) | Au Bump | Three-Dimensional (3D) Chip Stacking LSI | Cu Through-Chip-Via (TCV)
Journal Article
YAKUGAKU ZASSHI-JOURNAL OF THE PHARMACEUTICAL SOCIETY OF JAPAN, ISSN 0031-6903, 2008, Volume 128, pp. 92 - 93
In conducting our Percellome toxicogenomics research(Kanno et al., 2006), which enables us to elucidate the chemical toxicological properties or the mechanisms... 
ChIP on chip | toxicogenomics | percellome | 5-azacytidine | PHARMACOLOGY & PHARMACY | epigenetics
Journal Article
電子情報通信学会技術研究報告. SDM, シリコン材料・デバイス, ISSN 0913-5685, 01/2013, Volume 112, pp. 25 - 30
高密度チップ集積技術の要素技術となる低コストの有機樹脂を用いた Chlp間接続再配線の微細化において,有機樹脂中のハロゲンイオンや加水分解により生成される有機酸を起因としたCu配線の酸化・腐食を完全に防止する事が課題である.特に, L/S=3/3μm以下になると信頼性が著しく低下するため,... 
Journal Article
by Wang, SL and Huang, B and Zhou, Y and Sun, ZR
PROGRESS IN BIOCHEMISTRY AND BIOPHYSICS, ISSN 1000-3282, 03/2006, Volume 33, Issue 3, pp. 254 - 261
In order to research the molecular pathogenesis of hepatocellular carcinoma (HCC), firstly, gene expression profile data of HCC, which dealt with t-test... 
transcription factor | BIOPHYSICS | transcriptional regulation | BIOCHEMISTRY & MOLECULAR BIOLOGY | NETWORK MOTIFS | LIVER | gene expression profile | motif | EXPRESSION | DISCOVERY | GENOME | ChIP-chip experiment
Journal Article
電子情報通信学会技術研究報告. ICD, 集積回路, ISSN 0913-5685, 09/2009, Volume 109, pp. 15 - 18
... 
Journal Article
電子情報通信学会技術研究報告. SDM, シリコン材料・デバイス, ISSN 0913-5685, 01/2011, Volume 110, pp. 13 - 18
コンプライアントバンプ技術を用いて、CoC(Chip on... 
Journal Article
エレクトロニクス実装学会誌, ISSN 1343-9677, 2009, Volume 12, Issue 6, pp. 542 - 550
Journal Article
エレクトロニクス実装学会誌, ISSN 1343-9677, 2005, Volume 8, Issue 4, pp. 308 - 317
A three-dimensional (3D) chip stacking LSI under development at ASET uses new SiP (System-ina-Package) packaging technologies to realize high-density and... 
Cu-Sn | Chip-on-Chip (COC) | Cu Through-Via (TV) | Cu Bump Bonding (CBB) | Interconnection | Inter Metallic Compound (IMC) | Three-Dimensional (3D) Chip Stacking LSI | System-in-a-Package (SiP)
Journal Article
Process Automation Instrumentation/Zidonghua Yibiao, ISSN 1000-0380, 12/2013, Volume 34, Issue 12, pp. 87 - 90
To satisfy the requirements of modern industrial applications and overcome the problems existing in traditional pressure transmitters, the pressure transmitter... 
Chips
Journal Article
Computer Measurement & Control, ISSN 1671-4598, 12/2013, Volume 21, Issue 12, pp. 3309 - 3332
Cochlear chip is different from the general integrated chip) (Wireless Communications, Passivity, Source Synchronous and relatively low requirement for the... 
Chips
Journal Article
Gongkuang Zidonghua-Industry and Mine Automation, ISSN 1671-251X, 11/2013, Volume 39, Issue 11, pp. 95 - 97
For difficulty of monitoring status of energy consumption of crane by use of wired transmission technology, a design scheme of monitoring node of energy... 
Chips
Journal Article
Bandaoti Jishu (Semiconductor Technology), ISSN 1003-353X, 09/2013, Volume 38, Issue 9, pp. 691 - 701
The underfill flow domain in flip-chip packaging can be regarded as a porous medium flow domain. It is critical to gain the permeability of the porous medium.... 
Chips
Journal Article
Bandaoti Jishu (Semiconductor Technology), ISSN 1003-353X, 09/2013, Volume 38, Issue 9, pp. 656 - 660
Communication switches based on GaAs PHEMT were designed and implemented. Positive voltage controlled switch circuit based on GaAs FET were analyzed,... 
Chips
Journal Article
電子情報通信学会技術研究報告. ICD, 集積回路, ISSN 0913-5685, 01/2003, Volume 102, pp. 43 - 46
富士通はチップオンチップ構造でパッドピッチ40μmを超音波フリップチップエ法にて接合する技術を開発.超音波フリップチップ工法は短時間接続,低温接続,金属間接続等の特徴がある. FUJITSU has developed a Ultra-sonic Flip-chip interconnection... 
Journal Article
電子情報通信学会技術研究報告. CPM, 電子部品・材料, ISSN 0913-5685, 08/2007, Volume 107, pp. 45 - 48
... 
Journal Article
電子情報通信学会技術研究報告. EMD, 機構デバイス, ISSN 0913-5685, 08/2007, Volume 107, pp. 45 - 48
... 
Journal Article
電子情報通信学会技術研究報告. LQE, レーザ・量子エレクトロニクス, ISSN 0913-5685, 08/2007, Volume 107, pp. 45 - 48
... 
Journal Article
No results were found for your search.

Cannot display more than 1000 results, please narrow the terms of your search.