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Book
2007, 2nd ed., ISBN 9780874333022, viii, 396
Book
Acta Materialia, ISSN 1359-6454, 02/2020, Volume 185, pp. 300 - 308
The influence of solid solution strengthening on the evolution of the microstructure under cyclic dry sliding is still not fully rationalized. One reason is... 
Solid solution strengthening | Friction | Copper-manganese alloys | Tribology
Journal Article
Scientific Reports, ISSN 2045-2322, 2013, Volume 3, Issue 1, p. 1327
Precipitate size and number density are two key factors for tailoring the mechanical behavior of nanoscale precipitate-hardened alloys. However, during thermal... 
MICROSTRUCTURAL EVOLUTION | COPPER PRECIPITATION | STEEL | TEMPORAL EVOLUTION | MULTIDISCIPLINARY SCIENCES | ELECTRON-MICROSCOPY | ATOM-PROBE | Mechanical properties | Iron alloys | Ductility | Alloys | Dislocation | Manganese
Journal Article
Electrochimica Acta, ISSN 0013-4686, 07/2015, Volume 169, pp. 351 - 366
Copper corrosion, tarnishing, release and color stability were investigated in a series of candidate antimicrobial copper alloys Cu, Cu–5Sn, Cu–5Zn–5Al–1Sn,... 
antimicrobial | copper tarnishing | cuprite | dezincification | denickelification | ELECTROCHEMISTRY | CU-9.4NI-1.7FE ALLOY | STAINLESS-STEELS | CORROSION RATES | PATINATED COPPER | RESISTANT STAPHYLOCOCCUS-AUREUS | XZN ALLOYS | ELECTROCHEMICAL-BEHAVIOR | ANODIC-DISSOLUTION | AQUEOUS NACL SOLUTION | NICKEL-ALLOYS | Zinc compounds | Copper alloys | Corrosion and anti-corrosives
Journal Article
Journal of Alloys and Compounds, ISSN 0925-8388, 01/2019, Volume 773, p. 217
A composite foil is proposed to join three-dimensional Cf/SiC to Nb substrate, which is composed of Ti-Zr-Cu-Ni amorphous foil and Ti foil, in order to reduce... 
Temperature | Alloys | Shear strength | Brazing alloys | Foils | Formability | Modulus of elasticity | Elastic deformation | Dissolution | Substrates | Niobium | Metallic glasses | Composite materials | Solid solutions | Ambient temperature | Eutectoid composition | Nickel | Microstructure | Copper | Zirconium base alloys
Journal Article
International Journal of Fatigue, ISSN 0142-1123, 09/2017, Volume 102, pp. 1 - 8
Journal Article
Journal of Materials Processing Tech, ISSN 0924-0136, 2009, Volume 209, Issue 5, pp. 2746 - 2752
Dissimilar titanium/steel metals were successfully joined by diffusion bonding process with the help of a copper-based interlayer. The appropriate processing... 
Titanium | Steel | Microstructure | Diffusion bonding | Copper interlayer | STAINLESS-STEEL | MATERIALS SCIENCE, MULTIDISCIPLINARY | ENGINEERING, MANUFACTURING | ENGINEERING, INDUSTRIAL | Mechanical engineering | Analysis
Journal Article
Surface & Coatings Technology, ISSN 0257-8972, 01/2015, Volume 262, pp. 87 - 96
In this study, two types of blended alloys were processed by plasma transferred arc (PTA) hardfacing to form coatings. In the first case, a pre-alloyed Cu-Sn... 
Co-base alloy | Molybdenum | Metastable liquid phase separation | Cu-Sn alloy | Plasma transferred arc (PTA) | PHYSICS, APPLIED | FE ALLOYS | BEHAVIOR | COMPOSITES | MECHANICAL-PROPERTIES | MELTS | RESISTANCE | WEAR CHARACTERISTICS | MATERIALS SCIENCE, COATINGS & FILMS | Cobalt | Molybdenum alloys | Analysis | Cobalt base alloys | Phases | Segregations | Alloys | Copper base alloys | Copper | Coatings | Spheroids
Journal Article
Journal of Alloys and Compounds, ISSN 0925-8388, 08/2018, Volume 757, p. 333
In this paper, we show the first production of Cu-based electrode materials including self-assembled barrier layers which can prevent Cu-Si inter-diffusion... 
Solar cells | Self assembly | Mass production | Barrier layers | Silicon substrates | Copper base alloys | Crystallinity | Substrates | Electrodes | Pastes | Diffusion layers | Electrode materials | Photovoltaic cells | Diffusion barriers | Sintering | Tin | Silicon | Copper | Crystal structure | Structural analysis
Journal Article
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