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1. Casting copper-base alloys
by Sadayappan, Kumar and Whiting, Laurence V and Sahu, Sudhari and Sahoo, Mahi and American Foundrymen's Society
2016, 3rd edition., ISBN 0874334462, x, 341 pages
Copper founding | Copper castings
Book
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2. Casting copper-base alloys
American Foundry Society
2007, 2nd ed., ISBN 9780874333022, viii, 396
Copper founding | Copper castings
Book
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3. Casting copper-base alloys
American Foundrymen's Society
1984, v, 250
Copper founding | Copper castings
Book
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4. Copper and copper base alloys
by Wilkins, Richard Alfred and Bunn, Edward Schaible
1943, ix, 355
Copper alloys | Copper
Book
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5. Repair by welding of cast copper-base alloys
by Nolan, M.J
1968, 23
Welding | Copper alloys
Book
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6. The mode of solidification of copper-base alloys
by Edwards, J.O and Couture, A
1966, 24
Copper alloys | Solidification
Book
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7. Copper and copper base alloys
: the physical and mechanical properties of copper and its commercial alloys in wrought form
by Wilkins, Richard Alfred, 1896 and Bunn, Edward Schaible, 1906
1943, 1st ed., ix, 355 p. incl. illus., tables, diagrs.
Copper | Copper alloys
Book
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8. Test bars for sand-cast copper-base alloys for ISO (ISO/TC26/WG3)
by Edwards, J.O
1974, 19
Test bars | Copper alloys
Book
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9. Simultaneous polargraphic determination of small amounts of bismuth and lead in copper-base alloys
by McMaster, C.H
1964, 13
Copper alloys | Bismuth | Lead
Book
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10. Full Text A nanoscale co-precipitation approach for property enhancement of Fe-base alloys
by Zhang, Zhongwu and Liu, Chain Tsuan and Miller, Michael K and Wang, Xun-Li and Wen, Yuren and Fujita, Takeshi and Hirata, Akihiko and Chen, Mingwei and Chen, Guang and Chin, Bryan A
Scientific Reports, ISSN 2045-2322, 2013, Volume 3, Issue 1, p. 1327
Precipitate size and number density are two key factors for tailoring the mechanical behavior of nanoscale precipitate-hardened alloys. However, during thermal... 
FERRITIC STEEL | IRRADIATION | MICROSTRUCTURAL EVOLUTION | COPPER PRECIPITATION | TEMPORAL EVOLUTION | MULTIDISCIPLINARY SCIENCES | ELECTRON-MICROSCOPY | ATOM-PROBE | Mechanical properties | Iron alloys | Ductility | Alloys | Dislocation | Manganese
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11. Full Text Tarnishing and Cu Ion release in Selected Copper-Base Alloys: Implications towards Antimicrobial Functionality
by Horton, D.J and Ha, H and Foster, L.L and Bindig, H.J and Scully, J.R
Electrochimica Acta, ISSN 0013-4686, 07/2015, Volume 169, pp. 351 - 366
Copper corrosion, tarnishing, release and color stability were investigated in a series of candidate antimicrobial copper alloys Cu, Cu–5Sn, Cu–5Zn–5Al–1Sn,... 
antimicrobial | copper tarnishing | cuprite | dezincification | denickelification | ELECTROCHEMISTRY | CU-9.4NI-1.7FE ALLOY | STAINLESS-STEELS | CORROSION RATES | PATINATED COPPER | RESISTANT STAPHYLOCOCCUS-AUREUS | XZN ALLOYS | ELECTROCHEMICAL-BEHAVIOR | ANODIC-DISSOLUTION | AQUEOUS NACL SOLUTION | NICKEL-ALLOYS | Zinc compounds | Copper alloys | Corrosion and anti-corrosives
Journal Article
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12. In-situ stabilized β-Ti in Ti-base alloys to enhance C^sub f^/SiC-Nb heterogenous joint
by Yan Sun and Jie Zhang and Mingliang Yuan and Dixing Bai and Chunfeng Liu
Journal of Alloys and Compounds, ISSN 0925-8388, 01/2019, Volume 773, p. 217
A composite foil is proposed to join three-dimensional Cf/SiC to Nb substrate, which is composed of Ti-Zr-Cu-Ni amorphous foil and Ti foil, in order to reduce... 
Temperature | Alloys | Shear strength | Brazing alloys | Foils | Formability | Modulus of elasticity | Elastic deformation | Dissolution | Substrates | Niobium | Metallic glasses | Composite materials | Solid solutions | Ambient temperature | Eutectoid composition | Nickel | Microstructure | Copper | Zirconium base alloys
Journal Article
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13. Copper and copper-base powder alloys
: a literature survey of recent technical advances
Metal Powder Industries Federation. Copper Committee
1976, 464
Copper | Powder metallurgy | Copper alloys
Book
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14. Spectrophotometric determination of arsenic in concentrates and copper-base alloys by the molybdenum blue method after separations by iron collection and xanthate extraction
by Donaldson, Elsie M
1976, 17
Spectrophotometric determination | Arsenic | Copper alloys
Book
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15. Full Text A cyclic slip irreversibility based model for fatigue crack initiation of nickel base alloys
by Ho, H.S and Risbet, M and Feaugas, X
International Journal of Fatigue, ISSN 0142-1123, 09/2017, Volume 102, pp. 1 - 8
The opportunity to define a microscopic law of fatigue crack initiation using Manson-Coffin law formulated in terms of cyclic slip irreversibility deduced from... 
Manson-Coffin fatigue crack initiation law | Atomic force microscopy (AFM) | Low-cycle fatigue | Ni-base superalloy | Cyclic slip plastic irreversibility | 316L | BEHAVIOR | MATERIALS SCIENCE, MULTIDISCIPLINARY | DEFORMATION | ENGINEERING, MECHANICAL | ATOMIC-FORCE MICROSCOPY | COPPER SINGLE-CRYSTALS | SURFACE | STRESS | STRAIN | MICROSTRUCTURE | LIFE | Fatigue | Nickel | Fatigue testing machines | Materials | Alloys | Atomic force microscopy | Analysis | Heat resistant alloys | Mechanical engineering | Engineering Sciences
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16. Full Text Solid state diffusion bonding of titanium to steel using a copper base alloy as interlayer
by Elrefaey, A and Tillmann, W
Journal of Materials Processing Tech, ISSN 0924-0136, 2009, Volume 209, Issue 5, pp. 2746 - 2752
Dissimilar titanium/steel metals were successfully joined by diffusion bonding process with the help of a copper-based interlayer. The appropriate processing... 
Titanium | Steel | Microstructure | Diffusion bonding | Copper interlayer | STAINLESS-STEEL | MATERIALS SCIENCE, MULTIDISCIPLINARY | ENGINEERING, MANUFACTURING | ENGINEERING, INDUSTRIAL | Mechanical engineering | Analysis
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17. Full Text Liquid phase separation microstructure and properties of mixed Cu-Sn and Co-base alloys without or with molybdenum addition processed by plasma transferred arc hardfacing
by Hou, Qing Yu and Ding, Ting Ting and Huang, Zhen Yi and Wang, Ping and Luo, Lai Ma and Wu, Yu Cheng
Surface & Coatings Technology, ISSN 0257-8972, 01/2015, Volume 262, pp. 87 - 96
In this study, two types of blended alloys were processed by plasma transferred arc (PTA) hardfacing to form coatings. In the first case, a pre-alloyed Cu-Sn... 
Co-base alloy | Molybdenum | Metastable liquid phase separation | Cu-Sn alloy | Plasma transferred arc (PTA) | PHYSICS, APPLIED | FE ALLOYS | BEHAVIOR | COMPOSITES | MECHANICAL-PROPERTIES | MELTS | RESISTANCE | WEAR CHARACTERISTICS | MATERIALS SCIENCE, COATINGS & FILMS | Cobalt | Molybdenum alloys | Analysis | Cobalt base alloys | Phases | Segregations | Alloys | Copper base alloys | Copper | Coatings | Spheroids
Journal Article
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18. The hot-tearing of copper-base casting alloys
by Couture, A and Edwards, J.O
1966, 45
Casting | Copper alloys
Book
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19. Full Text Ordering in Gold-Base Alloys for Low-Level Slide Contacts
by Generalova, K N and Ryaposov, I V and Shatsov, A A
Metal Science and Heat Treatment, ISSN 0026-0673, 5/2016, Volume 58, Issue 1, pp. 120 - 124
The microstructure and ordering are studied in gold-base alloys ZlM-80 and ZlKh-05 for low-level slide contacts. It is shown that heating in the range of 300 –... 
distribution law | Materials Science, general | ordering | Engineering Thermodynamics, Heat and Mass Transfer | low-level slide contacts | Material Science | Metallic Materials | gold alloys with copper | equimolar alloy | chromium and nickel | hexagonal and orthorhombic structures | Mechanics | Characterization and Evaluation of Materials | mechanical and physical properties | Mechanical and physical properties | Gold alloys with copper | Ordering | Equimolar alloy | Low-level slide contacts | Hexagonal and orthorhombic structures | Chromium and nickel | Distribution law | BEHAVIOR | METALLURGY & METALLURGICAL ENGINEERING | Alloys | Specialty metals industry | Heat treatment | Recrystallization | Order disorder | Microstructure | Contact | Fragmentation
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20. Atmospherically sintered copper-base alloy application film with self-assembled barrier layer on silicon substrate for silicon photovoltaics
by Shuichiro Adachi and Takeshi Nojiri and Takahiko Kato and Seiichi Watanabe and Masato Yoshida
Journal of Alloys and Compounds, ISSN 0925-8388, 08/2018, Volume 757, p. 333
In this paper, we show the first production of Cu-based electrode materials including self-assembled barrier layers which can prevent Cu-Si inter-diffusion... 
Solar cells | Self assembly | Mass production | Barrier layers | Silicon substrates | Copper base alloys | Crystallinity | Substrates | Electrodes | Pastes | Diffusion layers | Electrode materials | Photovoltaic cells | Diffusion barriers | Sintering | Tin | Silicon | Copper | Crystal structure | Structural analysis
Journal Article
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