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Chemical Society Reviews, ISSN 0306-0012, 06/2018, Volume 47, Issue 11, pp. 4017 - 4072
DNA metallization has witnessed tremendous growth and development, from the initial simple synthesis aimed at manufacturing conductive metal nanowires to the... 
FLUORESCENT SILVER NANOCLUSTERS | TEMPLATED COPPER NANOPARTICLES | PHOTOINDUCED ELECTRON-TRANSFER | ULTRASENSITIVE MICRORNA DETECTION | TURN-ON DETECTION | ENHANCED RAMAN-SCATTERING | SINGLE-STRANDED-DNA | ELECTRICALLY CONDUCTIVE GOLD | CHEMISTRY, MULTIDISCIPLINARY | LABEL-FREE DETECTION | HIGH-PERFORMANCE SUPERCAPACITOR
Journal Article
Chemical Society (Great Britain). Chemical Society Reviews, ISSN 0306-0012, 01/2018, Volume 47, Issue 11, pp. 4017 - 4072
DNA metallization has witnessed tremendous growth and development, from the initial simple synthesis aimed at manufacturing conductive metal nanowires to the... 
Metallizing | Nanomaterials | Nanostructure | Gene sequencing | Organic chemistry | Biomedical materials | Synthesis | Energy conversion | Catalysis | Nanowires | Nanotechnology | Deoxyribonucleic acid--DNA | Biomedical engineering | Energy storage
Journal Article
Progress in Photovoltaics: Research and Applications, ISSN 1062-7995, 08/2013, Volume 21, Issue 5, pp. 876 - 883
ABSTRACT Rear sides of crystalline silicon solar cells are usually covered with aluminum on which it is difficult to solder. To ease soldering, we present a... 
intermetallic compound growth | long‐term stability | metallization | peel force | solar cells | long-term stability | CU SUBSTRATE | PHYSICS, APPLIED | MECHANISM | ENERGY & FUELS | MATERIALS SCIENCE, MULTIDISCIPLINARY | UNDER-BUMP-METALLIZATION | FAILURE | COUPLES | CHIP SOLDER JOINTS | KINETICS | GROWTH | INTERFACIAL REACTIONS | SN-3.5AG SOLDER | Solar cells | Solar batteries | Silicon | Copper
Journal Article
Advanced Materials, ISSN 0935-9648, 11/2004, Volume 16, Issue 22, pp. 2024 - 2028
Depositing metal layers onto a self‐assembled monolayer (SAM) is achieved using a new technique. Au(111) bearing a 4,4′‐dithiodipyridine SAM is immersed into a... 
Palladium | Metallization | Self‐assembled monolayers | Electrochemical fabrication | GOLD ELECTRODES | MATERIALS SCIENCE, MULTIDISCIPLINARY | AU ELECTRODES | PHOTOEMISSION | ALKANETHIOLS | SURFACE | INTERFACES | COPPER ELECTRODEPOSITION | METAL-DEPOSITION | ETHANETHIOL | UNDERPOTENTIAL DEPOSITION
Journal Article
Energy Procedia, ISSN 1876-6102, 11/2016, Volume 98, pp. 12 - 22
We present the results of a survey on the future of metallization and interconnection. The survey was carried out at the 6 Metallization Workshop that took... 
Silver | Metallization | Interconnection | Solar Modules | Future of Metallization | Copper | Solar Cells
Journal Article
IEEE Transactions on Electron Devices, ISSN 0018-9383, 05/2019, Volume 66, Issue 5, pp. 2339 - 2345
We address RC scaling trends and predict the performance benefits of advanced metallization options with respect to conventional Cu/low-... 
Resistance | chamfering | Metallization | damascene | Conductivity | Capacitance | Market research | Dielectrics | resistivity | via | PHYSICS, APPLIED | resistance | ENGINEERING, ELECTRICAL & ELECTRONIC | Metallizing | Chamfering | Copper | Air gaps
Journal Article
by Koike, J and Wada, M
Applied Physics Letters, ISSN 0003-6951, 07/2005, Volume 87, Issue 4, pp. 041911 - 041911-3
Advancement of semiconductor devices requires the realization of an ultrathin diffusion barrier layer between Cu interconnect and insulating layers. The... 
PHYSICS, APPLIED | FILMS | COPPER | RESISTIVITY | GRAIN-GROWTH | MASS-SPECTROMETRY | CONSTITUENTS | SIO2
Journal Article
Applied Physics Letters, ISSN 0003-6951, 2009, Volume 94, Issue 7, p. 72109
The kinetics of the switching process in Cu-SiO2-based electrochemical metallization memory cells was investigated as a function of the switching voltage and... 
iridium | electrochemical electrodes | platinum | PHYSICS, APPLIED | random-access storage | silicon compounds | copper | integrated circuit metallisation | thin films
Journal Article
Journal of the Electrochemical Society, ISSN 0013-4651, 2009, Volume 156, Issue 9, pp. D351 - D359
Electrodeposition of copper in the presence of a multicomponent additives mixture, consisting of an inhibitor [e.g., poly(ethylene glycol)] and an accelerator... 
ELECTROCHEMISTRY | adsorption | DEPOSITION | SUPERCONFORMAL ELECTRODEPOSITION | MODEL | ADDITIVES | integrated circuit metallisation | integrated circuit interconnections | TRENCHES | BUMP FORMATION | PEG | SPECTROSCOPY | SPS | copper | electrical conductivity | electrodeposition | POLYETHYLENE-GLYCOL | MATERIALS SCIENCE, COATINGS & FILMS
Journal Article
POLIMERY, ISSN 0032-2725, 03/2017, Volume 62, Issue 3, pp. 163 - 169
This article is a review of the literature related to the electroless metallization of plastics. The basic methods of electroless metallization by:... 
POLYMER SCIENCE | metallization precursors | SURFACE MODIFICATION | POLYMER SURFACES | EPOXY-RESIN | copper deposition | GALVANIC METALLIZATION | EXCIMER-LASER | REDUCING AGENT | organometallic complexes | electroless metallization | METAL-DEPOSITION | surface layer modification | ACETYLACETONATE FILMS | SELECTIVE METALLIZATION
Journal Article
IEEE Electron Device Letters, ISSN 0741-3106, 09/2017, Volume 38, Issue 9, pp. 1244 - 1247
In this letter, low-temperature characterization of Cu-Cu:silica programmable metallization cells (PMC) is presented. Our results show that the PMC device is... 
Temperature | direct tunneling | silica | Switches | PMC | RRAM | low temperature | Resistance | Temperature measurement | CBRAM | Tunneling | Copper | Junctions | RANDOM-ACCESS MEMORY | ENGINEERING, ELECTRICAL & ELECTRONIC
Journal Article
Scripta Materialia, ISSN 1359-6462, 02/2020, Volume 176, pp. 23 - 27
This paper is focused on the study of copper thick film metallization on AlN. The copper metallization was realized by Thick Printed Copper (TPC) technology.... 
Nitrides | Metallizations | Ceramics | Electrical properties | Copper | SUBSTRATE | MATERIALS SCIENCE, MULTIDISCIPLINARY | METALLURGY & METALLURGICAL ENGINEERING | NANOSCIENCE & NANOTECHNOLOGY | MICROSTRUCTURE | Electrical engineering | Aluminum compounds | X-ray spectroscopy | Analysis | Electric properties
Journal Article
Journal of Applied Physics, ISSN 0021-8979, 10/2004, Volume 96, Issue 8, pp. 4518 - 4524
Journal Article
Polimery/Polymers, ISSN 0032-2725, 2015, Volume 60, Issue 7-8, pp. 492 - 500
In this work experimental results of a research aimed to provide the assessment of the ability of chemical modification to prepare polylactide (PLA) surface... 
Polylactide | Chemical modification | Autocatalytic metallization | POLYMERS | POLYMER SCIENCE | SURFACE MODIFICATION | COPPER | ROUGHNESS | autocatalytic metallization | FUNCTIONALIZATION | ADHESION | ELECTROLESS DEPOSITION | DEGRADATION | POLYCARBONATE | polylactide | POLYIMIDE | chemical modification
Journal Article
Journal of Materials Science: Materials in Electronics, ISSN 0957-4522, 02/2019, Volume 30, Issue 3, pp. 2342 - 2350
Journal Article