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Materials Science & Engineering R, ISSN 0927-796X, 2007, Volume 58, Issue 1, pp. 1 - 75
Journal Article
Materials and Design, ISSN 0264-1275, 07/2019, Volume 174, p. 107781
We produced Sn–Cu interconnects by self-propagated exothermic reactions using Al–Ni NanoFoil at ambient conditions, through the instantaneous localised heat... 
Sn–Cu interconnects | Exothermic reactive bonding | Al-Ni NanoFoil | Non-equilibrium metastable phases | Homogenisation | Interfacial reactions | AG | MATERIALS SCIENCE, MULTIDISCIPLINARY | SOLIDIFICATION | Sn-Cu interconnects | PHASE-FORMATION | HEAT | GROWTH-BEHAVIOR | NI | Non-equilibrium metastable pluses | CERAMICS
Journal Article
IEEE Transactions on Electron Devices, ISSN 0018-9383, 06/2016, Volume 63, Issue 6, pp. 2488 - 2496
Journal Article
Electrochimica Acta, ISSN 0013-4686, 2008, Volume 54, Issue 2, pp. 793 - 800
(Mn,Co) O Spinel is a promising coating for SOFC interconnect applications due to its high conductivity and good chromium retention capability. Electroplating... 
Interconnect | Charge and discharge | Off-time | SOFC | Pulse plating | SPINEL PROTECTION LAYERS | ELECTROCHEMISTRY | HYDROGEN EVOLUTION REACTION | CU ALLOYS | FERRITIC STAINLESS-STEEL | ELECTROCHEMICAL DEPOSITION | COPPER | MULTILAYERS | NICKEL | COATINGS | ELECTRODEPOSITION | Structure | Mechanical engineering | Cobalt | Crystals | Alloys
Journal Article
Annual Review of Materials Research, ISSN 1531-7331, 08/2009, Volume 39, Issue 1, pp. 231 - 254
Journal Article
Solid State Ionics, ISSN 0167-2738, 2011, Volume 192, Issue 1, pp. 561 - 564
The Mn–Co serial spinel is a promising coating material for solid oxide fuel cell (SOFC) metallic interconnects. The Cu–Mn–Co spinel powder was obtained by... 
Interconnect | Dip-coating | Cu–Mn–Co spinel | SOFC | Cu-Mn-Co spinel | PHYSICS, CONDENSED MATTER | CATHODES | DEPOSITION | CHEMISTRY, PHYSICAL | CHROMIUM VAPORIZATION | BARE | METALLIC INTERCONNECTS | ALLOYS | OXIDE FUEL-CELL | Solid oxide fuel cells | Spinel | Ferritic stainless steels | Dip coatings | Copper | Protective coatings | Sintering (powder metallurgy) | Manganese
Journal Article
Microelectronic Engineering, ISSN 0167-9317, 03/2017, Volume 172, pp. 8 - 12
For Cu interconnect in Si-based microelectronic devices, seedless electrodeposition of Cu thin films directly on Ti diffusion barrier was investigated in Cl... 
Electrodeposition | Cu thin film | Additive | Cl−-free electrolyte | Surface morphology | free electrolyte | PHYSICS, APPLIED | DEPOSITION | COPPER ELECTRODEPOSITION | NANOSCIENCE & NANOTECHNOLOGY | ADSORPTION | TITANIUM | ENGINEERING, ELECTRICAL & ELECTRONIC | ADHESION | Cl--free electrolyte | PEG | MICROVIA | NUCLEATION | OPTICS | POLYETHYLENE-GLYCOL
Journal Article
Journal of Electronic Materials, ISSN 0361-5235, 1/2019, Volume 48, Issue 1, pp. 92 - 98
Journal Article
Microelectronics Reliability, ISSN 0026-2714, 2004, Volume 44, Issue 3, pp. 365 - 380
In the past few years, copper has been widely used as interconnect metallization for advanced ultralarge-scale integration (ULSI) circuits. Due to the unique... 
THIN-FILMS | ISSUES | PHYSICS, APPLIED | EVOLUTION | ELECTROMIGRATION LIFETIME | TANTALUM | CU INTERCONNECTS | DIFFUSION BARRIER | NANOSCIENCE & NANOTECHNOLOGY | MECHANISMS | LINER | ENGINEERING, ELECTRICAL & ELECTRONIC
Journal Article
Journal of Alloys and Compounds, ISSN 0925-8388, 2010, Volume 504, Issue 2, pp. 535 - 541
Journal Article
IEEE Electron Device Letters, ISSN 0741-3106, 12/2012, Volume 33, Issue 12, pp. 1747 - 1749
In this letter, an evolution of high-density (>; 10 6 cm-2) bonded Cu-Cu interconnects of 6-μm pitch is successfully demonstrated using wafer-on-wafer... 
hermetic seal | Cu-Cu bonding | Bonding processes | 3-D integrated circuit (IC) | Integrated circuit interconnections | Seals | fine pitch | wafer-to-wafer (W2W) | Reliability | Copper | Three-dimensional integrated circuits | Passivation | ENGINEERING, ELECTRICAL & ELECTRONIC
Journal Article