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2001, Encyclopedia of mathematics and its applications, ISBN 0521660580, Volume 84, xxii, 490
Book
2007, Monographs and textbooks in pure and applied mathematics, ISBN 1584886056, Volume 289, xix, 861
Book
2014, 4th edition., ISBN 9781118745083, 447
Book
IEEE transactions on communications, ISSN 0090-6778, 11/2016, Volume 64, Issue 11, pp. 4879 - 4894
phantom cells | Stochastic processes | lean carrier | Interference | 5G cellular networks | X2 interface handover | stochastic geometry | C-plane/U-plane split | Computer architecture | Handover | network densification | Delays | Signal to noise ratio | handover | Engineering, Electrical & Electronic | Engineering | Telecommunications | Technology | Science & Technology | Usage | Research
Journal Article
1961, Series of undergraduate books in mathematics. Golden Gate books, 191
Book
2007, ISBN 0521875749, Volume 9780521875745, xiii, 318
Book
2016, ISBN 9783319237749, 537
eBook
Fatigue & fracture of engineering materials & structures, ISSN 8756-758X, 02/2014, Volume 37, Issue 2, pp. 132 - 145
out‐of‐plane constraint | fracture toughness | unified correlation | equivalent plastic strain | loading configuration | in‐plane constraint | in-plane constraint | out-of-plane constraint | Engineering | Materials Science | Technology | Materials Science, Multidisciplinary | Engineering, Mechanical | Science & Technology | Applied sciences | Metals. Metallurgy | Fractures | Exact sciences and technology | Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology | Geometry | Correlation analysis | Fracture toughness | Specimen geometry | Correlation | Fracture mechanics | Equivalence | Mathematical models | Plastic deformation | Plastic strain
Journal Article
1993, Jones and Bartlett books in mathematics., ISBN 9780867202984, xiii, 298
Book
2005, ISBN 0817643818, xii, 293
Book
International journal of computer vision, ISSN 0920-5691, 9/2014, Volume 109, Issue 3, pp. 252 - 286
Pattern Recognition | PnP | Plane | Computer Science | Computer Imaging, Vision, Pattern Recognition and Graphics | Image Processing and Computer Vision | Pose | Artificial Intelligence (incl. Robotics) | SfM | Homography | Computer Science, Artificial Intelligence | Technology | Science & Technology | Radiocommunications | Pattern recognition. Digital image processing. Computational geometry | Telecommunications and information theory | Mobile radiocommunication systems | Exact sciences and technology | Equipments and installations | Applied sciences | Software | Telecommunications | Computer systems and distributed systems. User interface | Artificial intelligence | Computer science; control theory; systems | Machine vision | Studies | Computer science | Estimating techniques | 3-D graphics | Computer vision | Planes | Run time (computers) | Transforms | Mathematical models | Estimates | Augmented reality | Three dimensional
Journal Article
Fatigue & fracture of engineering materials & structures, ISSN 8756-758X, 01/2013, Volume 36, Issue 1, pp. 14 - 24
creep | in‐plane and out‐of‐plane constraint parameters | crack‐front stress fields | Engineering | Materials Science | Technology | Materials Science, Multidisciplinary | Engineering, Mechanical | Science & Technology | Stress (Psychology) | Mechanical engineering | Analysis | Cracks | Materials science | Stress analysis | Numerical analysis | Materials creep | Stresses | Specimen geometry | Stress concentration | Fracture mechanics | Mathematical analysis | Mathematical models | Creep (materials) | Three dimensional
Journal Article
2011, MAA guides, ISBN 9780883853535, Volume no. forty-six, xv, 193
Book
Journal of algebraic geometry, ISSN 1056-3911, 2018, Volume 27, Issue 4, pp. 583 - 592
Journal Article
Fatigue & fracture of engineering materials & structures, ISSN 8756-758X, 02/2016, Volume 39, Issue 2, pp. 251 - 263
equivalent creep strain | specimens | out‐of‐plane creep constraint | finite element | in‐plane creep constraint | out-of-plane creep constraint | in-plane creep constraint | Engineering | Materials Science | Technology | Materials Science, Multidisciplinary | Engineering, Mechanical | Science & Technology | Materials creep | Finite element analysis | Crack propagation | Stresses | Specimen geometry | Fracture mechanics | Equivalence | Mathematical analysis | Austenitic stainless steels | Creep (materials) | Structural steels | Three dimensional
Journal Article
1981, Universitext., ISBN 0387905529, xiii, 333
Book
18.
Full Text
Multiple mixed-mode cracks in a magneto-electro-elastic half-plane under in-plane loading
Engineering fracture mechanics, ISSN 0013-7944, 06/2020, Volume 232, p. 107009
Journal Article
IEEE transactions on applied superconductivity, ISSN 1051-8223, 06/2011, Volume 21, Issue 3, pp. 1892 - 1895
Electrodes | Geometry | quench | Bubbles | Electric breakdown | {\rm LN}_{2} | Heating | Bridge circuits | Breakdown | High temperature superconductors | Nitrogen | FCL | Quench | Engineering | Physical Sciences | Technology | Engineering, Electrical & Electronic | Physics | Science & Technology | Physics, Applied | Superconducting devices | Electric power plants | Electrical engineering. Electrical power engineering | Miscellaneous | Electrical power engineering | Exact sciences and technology | Electronics | Applied sciences | Electromagnets | Various equipment and components | Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices | High temperature | CURRENT LIMITERS | DESIGN | CRYOGENIC FLUIDS | ELECTRODES | NITROGEN | MATERIALS SCIENCE | HEATERS | DIELECTRIC MATERIALS | SUPERCONDUCTORS | BREAKDOWN | BUBBLES | GEOMETRY
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