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iodate-based slurries (11) 11
kinetics (9) 9
materials science, coatings & films (6) 6
potassium iodate (5) 5
chemical-mechanical planarization (4) 4
electrochemistry (4) 4
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polieren (2) 2
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low-kappa dielectrics (1) 1
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MRS bulletin, ISSN 0883-7694, 10/2002, Volume 27, Issue 10, pp. 752 - 760
The formulation of slurries for chemical–mechanical planarization (CMP) is currently considered more of an art than a science, due to the lack of understanding of the wafer, slurry, and pad interactions involved... 
Technical Feature | Nanoparticles | Chemical-mechanical planarization | Chemical-mechanical polishing | Low-κ dielectrics | Slurry design | CMP | low-kappa dielectrics | slurry design | PHYSICS, APPLIED | chemical-mechanical planarization | MECHANISM | MATERIALS SCIENCE, MULTIDISCIPLINARY | FORCE MEASUREMENTS | IODATE-BASED SLURRIES | ALUMINA | chemical-mechanical polishing | ADHESION | nanoparticles | POTASSIUM IODATE | KINETICS | WEAR | PARTICLE-SIZE | SILICA
Journal Article
CIRP Annals - Manufacturing Technology, ISSN 0007-8506, 2007, Volume 56, Issue 2, pp. 581 - 604
Because it is key to understanding the performance of material removal processes and resultant workpiece quality, the measurement of temperature during... 
Measurement | Material Removal | Temperature | GRINDING TEMPERATURE | THERMAL FIELD | HEAT-TRANSFER | INSERTED THERMOCOUPLES | IODATE-BASED SLURRIES | measurement | DISTORTION | TWIST DRILL | SILICON-NITRIDE | INFRARED RADIATION PYROMETER | material removal | CUTTING-TOOL TEMPERATURES | temperature | ENGINEERING, MANUFACTURING | ENGINEERING, INDUSTRIAL
Journal Article
CIRP Annals - Manufacturing Technology, ISSN 0007-8506, 2003, Volume 52, Issue 2, pp. 611 - 633
Polishing processes are critical to high value production processes such as IC manufacturing. The fundamental material removal mechanisms, howeve, are poorly... 
Lapping | planarization | polishing | Polishing | Planarization | LUBRICATION | WAFER | FLUID FILM | lapping | IODATE-BASED SLURRIES | MODEL | PRESSURE | TEMPERATURE | KINETICS | ENGINEERING, MANUFACTURING | ENGINEERING, INDUSTRIAL | SURFACES
Journal Article
Electrochemical and Solid-State Letters, ISSN 1099-0062, 2010, Volume 13, Issue 11, pp. H385 - H387
Ru chemical mechanical planarization (CMP) was studied in slurries containing titania and potassium bromate at different pH values, showing that the Ru removal rate is enhanced at pH 2 or less... 
ELECTROCHEMISTRY | SODIUM PERIODATE | ELECTRODEPOSITED RUTHENIUM | KINETICS | MATERIALS SCIENCE, MULTIDISCIPLINARY | CHEMICAL-MECHANICAL PLANARIZATION | RUCMP | IODATE-BASED SLURRIES | MODEL | CERIC AMMONIUM-NITRATE | ALUMINA
Journal Article
Journal of the Electrochemical Society, ISSN 0013-4651, 06/2001, Volume 148, Issue 6, pp. G355 - G358
A model of chemical mechanical polishing is presented which quantitatively correlates the polishing rate with the slurry concentrations of both chemicals and abrasives... 
ELECTROCHEMISTRY | IODATE-BASED SLURRIES | POTASSIUM IODATE | KINETICS | MATERIALS SCIENCE, COATINGS & FILMS
Journal Article
Journal of the Electrochemical Society, ISSN 0013-4651, 02/2003, Volume 150, Issue 2, pp. G96 - G102
Chemical mechanical planarization (CMP) is the primary method of wafer-scale planarization used in the manufacture of advanced integrated circuits. Preston's... 
THIN-FILMS | ELECTROCHEMISTRY | ALUMINUM | PRESSURE | POTASSIUM IODATE | ROLES | KINETICS | CHEMICAL-MECHANICAL PLANARIZATION | IODATE-BASED SLURRIES | MATERIAL REMOVAL RATE | AL | MATERIALS SCIENCE, COATINGS & FILMS
Journal Article
Journal of the Electrochemical Society, ISSN 0013-4651, 05/2002, Volume 149, Issue 5, pp. G305 - G308
A model of chemical mechanical polishing is extended to include the effects of polishing pressure and speed on the polishing rate. The result predicts both... 
ELECTROCHEMISTRY | IODATE-BASED SLURRIES | KINETICS | MATERIALS SCIENCE, COATINGS & FILMS
Journal Article
Thin Solid Films, ISSN 0040-6090, 2004, Volume 460, Issue 1, pp. 306 - 314
Some recent micro-optical applications require die planarity on the scale of a fraction of wavelength of light. A novel chemical mechanical polishing (CMP)... 
Global planarity | Chemical mechanical polishing | Dishing | chemical mechanical polishing | PHYSICS, CONDENSED MATTER | PHYSICS, APPLIED | KINETICS | MATERIALS SCIENCE, MULTIDISCIPLINARY | dishing | IODATE-BASED SLURRIES | global planarity | MATERIALS SCIENCE, COATINGS & FILMS
Journal Article
Journal Article
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