UofT Libraries is getting a new library services platform in January 2021.
Learn more about the change.

Search Articles

X
Search Filters
Format Format
Format Format
X
Sort by Item Count (A-Z)
Filter by Count
Conference Proceeding (14987) 14987
Journal Article (8104) 8104
Newspaper Article (4867) 4867
Newsletter (1796) 1796
Magazine Article (1069) 1069
Book / eBook (238) 238
Book Chapter (213) 213
Dissertation (62) 62
Trade Publication Article (51) 51
Web Resource (32) 32
Book Review (29) 29
Government Document (29) 29
Reference (11) 11
Standard (8) 8
Publication (5) 5
Report (2) 2
Journal / eJournal (1) 1
more...
Subjects Subjects
Subjects Subjects
X
Sort by Item Count (A-Z)
Filter by Count
integrated circuit interconnections (18453) 18453
integrated circuits (9971) 9971
science & technology (5278) 5278
technology (5084) 5084
engineering (4694) 4694
engineering, electrical & electronic (4318) 4318
inventors (2752) 2752
semiconductors (2734) 2734
very large scale integration (2630) 2630
delay (2396) 2396
semiconductor chips (2278) 2278
silicon (2152) 2152
computer science (2096) 2096
packaging (1834) 1834
circuit simulation (1770) 1770
intellectual property (1753) 1753
routing (1693) 1693
circuit testing (1563) 1563
capacitance (1530) 1530
frequency (1504) 1504
voltage (1465) 1465
clocks (1453) 1453
field programmable gate arrays (1429) 1429
integrated circuit modeling (1426) 1426
copper (1407) 1407
wire (1405) 1405
transistors (1369) 1369
methods (1340) 1340
costs (1289) 1289
physical sciences (1287) 1287
crosstalk (1243) 1243
computer science, hardware & architecture (1220) 1220
wires (1204) 1204
cmos technology (1185) 1185
manufacturing (1164) 1164
physics (1146) 1146
switches (1138) 1138
optical interconnections (1125) 1125
research (1110) 1110
interconnections (1105) 1105
timing (1006) 1006
circuit faults (989) 989
electronics industry (986) 986
integrated circuit technology (966) 966
power system interconnection (951) 951
bandwidth (950) 950
semiconductor industry (950) 950
design and construction (946) 946
physics, applied (941) 941
analysis (940) 940
substrates (930) 930
interconnect (907) 907
impedance (906) 906
testing (906) 906
design engineering (905) 905
circuits (900) 900
materials science (892) 892
printed circuits (888) 888
coupling circuits (878) 878
hardware (859) 859
inductance (830) 830
materials science, multidisciplinary (813) 813
microelectronics (808) 808
computer architecture (800) 800
mathematical models (791) 791
random access memory (784) 784
algorithms (778) 778
usage (774) 774
fabrication (749) 749
wiring (748) 748
computational modeling (724) 724
circuit synthesis (722) 722
bonding (721) 721
radio frequency (719) 719
integrated circuit fabrication (707) 707
delay effects (706) 706
conductors (680) 680
equations (668) 668
energy consumption (667) 667
application specific integrated circuits (648) 648
analytical models (647) 647
electronics packaging (647) 647
microprocessors (646) 646
vlsi-schaltung (638) 638
computer simulation (620) 620
digital integrated circuits (618) 618
electronics (617) 617
verbindung integrierter schaltungen (613) 613
assembly (610) 610
stock exchanges (610) 610
studies (608) 608
electrodes (604) 604
algorithm design and analysis (601) 601
temperature (596) 596
logic circuits (595) 595
cmos (581) 581
equivalent circuits (574) 574
sensors (562) 562
design (559) 559
circuit design (556) 556
more...
Library Location Library Location
Library Location Library Location
X
Sort by Item Count (A-Z)
Filter by Count
Engineering & Comp. Sci. - Stacks (124) 124
UTL at Downsview - May be requested (65) 65
Online Resources - Online (36) 36
Collection Dvlpm't (Acquisitions) - Vendor file (33) 33
Collection Dvlpm't (Acquisitions) - Closed Orders (15) 15
Engineering & Comp. Sci. - May be requested in 6-10 wks (5) 5
Engineering & Comp. Sci. - Missing (3) 3
Aerospace - Stacks (2) 2
Collection Dvlpm't (Acquisitions) - Cancelled Order (2) 2
Gerstein Science - Stacks (2) 2
UofT at Mississauga - Stacks (2) 2
Architecture Landscape (Shore + Moffat) - Stacks (1) 1
Physics - Stacks (1) 1
Robarts - Stacks (1) 1
more...
Language Language
Language Language
X
Sort by Item Count (A-Z)
Filter by Count
English (31459) 31459
Japanese (42) 42
Chinese (28) 28
German (13) 13
Spanish (8) 8
French (5) 5
Portuguese (4) 4
Czech (2) 2
Italian (1) 1
Korean (1) 1
Russian (1) 1
Tahitian (1) 1
Ukrainian (1) 1
more...
Publication Date Publication Date
Click on a bar to filter by decade
Slide to change publication date range


2010, International series on advances in solid state electronics and technology, ISBN 9789814273329, xix, 291
Book
2007, 2nd ed., Wiley Series in Microwave and Optical Engineering, ISBN 0471780464, Volume 185, xix, 407
... have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper... 
Components, Circuits, Devices and Systems | Integrated circuits | Computer simulation | Semiconductors | Very large scale integration | Very high speed integrated circuits | Mathematical models | Junctions | Defects
Book
2013, Devices, circuits, and systems, ISBN 9781466516038, xiv, 209
"The book is designed to achieve two goals. It assembles the latest research in the field of photonics interconnects technology and exposes the reader to the... 
TECHNOLOGY & ENGINEERING / Lasers & Photonics | Optical interconnects | COMPUTERS / Networking / General | TECHNOLOGY & ENGINEERING / Electronics / Circuits / General | Interconnects (Integrated circuit technology) | Photonics
Book
1994, Wiley series in microwave and optical engineering., ISBN 0471571229, xx, 622
Book
IBM journal of research and development, ISSN 0018-8646, 2008, Volume 52, Issue 6, pp. 611 - 622
Three-dimensional (3D) integration using through-silicon vias (TSVs) and low-volume lead-free solder interconnects allows the formation of high signal bandwidth, fine pitch, and short-distance interconnections in stacked dies... 
Computer Science, Information Systems | Technology | Computer Science | Computer Science, Theory & Methods | Computer Science, Hardware & Architecture | Computer Science, Software Engineering | Science & Technology | Three-dimensional display systems | Technology application | Usage | Computer software industry | Integrated circuits | Silicon wafers | Metallurgy | 3-D graphics
Journal Article
2007, ISBN 0387281533, 318
Reviewing various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available... 
Integrated circuits | Integrated circuits industry | Electronics and Microelectronics, Instrumentation | Optical and Electronic Materials | Engineering | Circuits and Systems | Engineering Design | Interconnects (Integrated circuit technology) | Microelectronic packaging
eBook
1995, Kluwer international series in engineering and computer science, ISBN 9780792394839, Volume SECS 301., xvi, 286
Book
IEEE transactions on components, packaging, and manufacturing technology (2011), ISSN 2156-3950, 10/2017, Volume 7, Issue 10, pp. 1634 - 1643
Journal Article
IEEE transactions on components, packaging, and manufacturing technology (2011), ISSN 2156-3950, 03/2016, Volume 6, Issue 3, pp. 400 - 406
... (IF) is the most frustrating. This paper describes the challenging and most important area of an IF detection and health monitoring that focuses toward NFF situation in electronics interconnections... 
Vibrations | Fault diagnosis | Fault detection | Atmospheric modeling | Wires | Integrated circuit interconnections | intermittent fault detection | Circuit faults | Monitoring | NFF | and intermittent fault detection | fault detection | Engineering | Materials Science | Technology | Materials Science, Multidisciplinary | Engineering, Electrical & Electronic | Engineering, Manufacturing | Science & Technology
Journal Article
Applied Physics Letters, ISSN 0003-6951, 05/2009, Volume 94, Issue 19, pp. 191104 - 191104-3
... m wavelength for the inspection and localization of electrical failures in large-scale integrated circuits with multilayered interconnection structures... 
Physical Sciences | Physics | Science & Technology | Physics, Applied
Journal Article
2006, 2nd ed., ISBN 9781574446746, 520
Book
2015 IEEE Power & Energy Society General Meeting, ISSN 1932-5517, 07/2015, pp. 1 - 1
.... It is postulated that radial DC systems are best suited for limitedsize local DC grids. Radial topology enables robust and fast protection selectivity using only local signals and exploiting the advantages of hybrid DC circuit breakers... 
Robustness | Topology | Circuit breakers | Circuit faults | Integrated circuit modeling | Integrated circuit interconnections | Faults | Offshore | Computer simulation | Converters | Control systems | Firewalls
Conference Proceeding
2020, ISBN 9781785616648, 320
Although existing nanometer CMOS technology is expected to remain dominant for the next decade, new non-classical devices are being developed as the potential... 
Interconnects (Integrated circuit technology)
Book
No results were found for your search.

Cannot display more than 1000 results, please narrow the terms of your search.