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Materials Letters, ISSN 0167-577X, 11/2013, Volume 110, pp. 13 - 15
This study reports the re-emergence of the classical Au and Pd embrittlement problems in micro joints in three-dimensional integrated circuits (3D ICs)... 
Interfaces | Metals and alloys | Microstructure | Intermetallic alloys and compounds | PHYSICS, APPLIED | METALLIZATION | KINETICS | MATERIALS SCIENCE, MULTIDISCIPLINARY | SOLDER JOINTS | Circuit components | Integrated circuits | Palladium | Semiconductor chips
Journal Article
IEEE Transactions on Microwave Theory and Techniques, ISSN 0018-9480, 06/2019, Volume 67, Issue 6, pp. 2197 - 2207
Journal Article
IEEE Transactions on Power Electronics, ISSN 0885-8993, 04/2013, Volume 28, Issue 4, pp. 1900 - 1913
Journal Article
IEEE Electron Device Letters, ISSN 0741-3106, 05/2016, Volume 37, Issue 5, pp. 625 - 628
This letter reports fabrication and testing of integrated circuits (ICs) with two levels of interconnect that consistently achieve greater than 1000 h of... 
Silicon carbide | Metals | Integrated circuit interconnections | Logic gates | JFETs | Integrated circuit reliability | Testing | JFET integrated circuits
Journal Article
IEEE Transactions on Microwave Theory and Techniques, ISSN 0018-9480, 03/2018, Volume 66, Issue 3, pp. 1201 - 1214
Journal Article
IEEE Transactions on Automatic Control, ISSN 0018-9286, 10/2010, Volume 55, Issue 10, pp. 2342 - 2347
Journal Article
IEEE Microwave and Wireless Components Letters, ISSN 1531-1309, 04/2018, Volume 28, Issue 4, pp. 281 - 283
This letter explores the inductance of interconnections including through-silicon vias (TSVs) and redistribution layers (RDLs) in 3-D stacked-chip packaging.... 
Inductance | Solid modeling | through-silicon vias (TSVs) | Error analysis | 3-D integrated circuits (ICs) | Metals | Integrated circuit interconnections | inductance model | redistribution layers (RDLs) | Through-silicon vias | Integrated circuit modeling | DENSITY | TSV | SILICON | VIAS | ENGINEERING, ELECTRICAL & ELECTRONIC
Journal Article
Proceedings of the Conference on design, automation and test in europe, ISSN 1530-1591, 04/2009, pp. 423 - 428
As industry moves towards many-core chips, networks-on-chip (NoCs) are emerging as the scalable fabric for interconnecting the cores. With power now the... 
Space technology | Network-on-a-chip | Integrated circuit interconnections | Bandwidth | Predictive models | Fabrics | Space exploration | Aerospace industry | Textile industry | Design optimization
Conference Proceeding
IEEE Transactions on Microwave Theory and Techniques, ISSN 0018-9480, 12/2018, Volume 66, Issue 12, pp. 5358 - 5364
Journal Article
IEEE Journal on Emerging and Selected Topics in Circuits and Systems, ISSN 2156-3357, 06/2012, Volume 2, Issue 2, pp. 228 - 239
Current commercial systems-on-chips (SoCs) designs integrate an increasingly large number of predesigned cores and their number is predicted to increase... 
Wireless communication | network-on-chip (NoC) | energy dissipation | Transmitting antennas | wireless interconnect | Metals | Integrated circuit interconnections | Bandwidth | Transceivers | System-on-a-chip | DESIGN | INTEGRATED ANTENNAS | SMALL-WORLD | wireless interconnet | NETWORKS-ON-CHIP | COMMUNICATION | ENGINEERING, ELECTRICAL & ELECTRONIC
Journal Article
IEEE Transactions on Electron Devices, ISSN 0018-9383, 09/2009, Volume 56, Issue 9, pp. 1822 - 1833
Journal Article
Journal of Lightwave Technology, ISSN 0733-8724, 10/2019, Volume 37, Issue 19, pp. 5140 - 5148
Today, the datacenter ecosystems are fueling the demand for novel transmitter (ΤΧ) technologies complying with the off-board, on-board, and chip-to-chip... 
Integrated circuit interconnections | photonic integrated circuits | Wavelength division multiplexing | optical transmitters | Engines | Photonics | Sockets | optical interconnections | Broadcasting | computing architectures | AWGR-based interconnections | Silicon | silicon photonics
Journal Article
IEEE Transactions on Semiconductor Manufacturing, ISSN 0894-6507, 08/2017, Volume 30, Issue 3, pp. 236 - 242
We developed and reported on a 3-D stacked CMOS image sensor (CIS) with a massive number of micro-bump interconnections placed at a narrow pitch between... 
Resistance | test circuit | Three-dimensional displays | Current measurement | Integrated circuit interconnections | CMOS image sensor (CIS) | global shutter | Transistors | Electrical resistance measurement | 3-D stacking | Substrates | micro bump
Journal Article
IEEE Microwave and Wireless Components Letters, ISSN 1531-1309, 02/2018, Volume 28, Issue 2, pp. 102 - 104
This letter presents a novel chip-to-chip interconnect technology for millimeter-wave and ultra-wideband applications. The technique relies on magnetic... 
Couplings | Wireless communication | ultra-wideband technology | Wires | Millimeter wave technology | Integrated circuit interconnections | Insertion loss | Current distribution | integrated circuit packaging | millimeter-wave integrated circuits | Bondwires | ENGINEERING, ELECTRICAL & ELECTRONIC
Journal Article
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