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1. Full Text Improvement of bonding strength of a (Pb,Sn)Te–Cu contact manufactured in a low temperature SLID-bonding process
by Chuang, Chien-Hsun and Chuang, Tung-Han and Yeh, Wei-Ting and Hwang, Jenn-Dong
Journal of Alloys and Compounds, ISSN 0925-8388, 11/2014, Volume 613, pp. 46 - 54
A (Pb, Sn)Te thermoelectric (TE) material coated with a Ni barrier layer and a Ag reaction layer was bonded with a Ag-coated Cu electrode at low temperatures... 
(Pb, Sn)Te | Bonding strength | Intermetallic compounds | Solid–liquid interdiffusion bonding | (Pb Sn)Te | Solid-liquid interdiffusion bonding | INTERLAYER | THERMOELECTRIC-MATERIALS | (Pb,Sn)Te | AU/CU/AL2O3 | CU/TI/SI | MATERIALS SCIENCE, MULTIDISCIPLINARY | METALLURGY & METALLURGICAL ENGINEERING | ELECTRODES | CHEMISTRY, PHYSICAL | RELIABILITY EVALUATION | INTERFACIAL REACTION | TELLURIDE | Silver | Barrier layers | Modules | Intermetallics | Nickel | Adhesive bonding | Thermoelectricity
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2. Full Text Formation and homogenisation of Sn–Cu interconnects by self-propagated exothermic reactive bonding
by Zhu, Wenbo and Wang, Xiaoting and Liu, Changqing and Zhou, Zhaoxia and Wu, Fengshun
Materials and Design, ISSN 0264-1275, 07/2019, Volume 174, p. 107781
We produced Sn–Cu interconnects by self-propagated exothermic reactions using Al–Ni NanoFoil at ambient conditions, through the instantaneous localised heat... 
Sn–Cu interconnects | Exothermic reactive bonding | Al-Ni NanoFoil | Non-equilibrium metastable phases | Homogenisation | Interfacial reactions | AG | MATERIALS SCIENCE, MULTIDISCIPLINARY | SOLIDIFICATION | Sn-Cu interconnects | PHASE-FORMATION | HEAT | GROWTH-BEHAVIOR | NI | Non-equilibrium metastable pluses | CERAMICS
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3. Full Text Bonding-induced thermal conductance enhancement at inorganic heterointerfaces using nanomolecular monolayers
by O'Brien, Peter J and Shenogin, Sergei and Liu, Jianxiun and Chow, Philippe K and Laurencin, Danielle and Mutin, P. Hubert and Yamaguchi, Masashi and Keblinski, Pawel and Ramanath, Ganpati
Nature Materials, ISSN 1476-1122, 2013, Volume 12, Issue 2, pp. 118 - 122
Manipulating interfacial thermal transport is important for many technologies including nanoelectronics, solid-state lighting, energy generation and... 
INTERFACES | CHEMISTRY, PHYSICAL | PHYSICS, CONDENSED MATTER | TRANSPORT | PHYSICS, APPLIED | MATERIALS SCIENCE, MULTIDISCIPLINARY | Materials science | Interfacial bonding | Nanocomposites | Dielectric properties | Heat transfer | Dynamics | Nanomaterials | Thermal conductivity | Nanostructure | Dynamical systems | Nanoelectronics | Material chemistry | Chemical Sciences
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4. Full Text Quadruple H‑Bonding Cross-Linked Supramolecular Polymeric Materials as Substrates for Stretchable, Antitearing, and Self-Healable Thin Film Electrodes
by Yan, Xuzhou and Liu, Zhiyuan and Zhang, Qiuhong and Lopez, Jeffrey and Wang, Hui and Wu, Hung-Chin and Niu, Simiao and Yan, Hongping and Wang, Sihong and Lei, Ting and Li, Junheng and Qi, Dianpeng and Huang, Pingao and Huang, Jianping and Zhang, Yu and Wang, Yuanyuan and Li, Guanglin and Tok, Jeffery B.-H and Chen, Xiaodong and Bao, Zhenan
Journal of the American Chemical Society, ISSN 0002-7863, 04/2018, Volume 140, Issue 15, pp. 5280 - 5289
Herein, we report a de novo chemical design of supramolecular polymer materials (SPMs-1–3) by condensation polymerization, consisting of (i) soft polymeric... 
CHEMISTRY, MULTIDISCIPLINARY | COMPOSITE | TOUGH | Electrodes | Cross-Linking Reagents - chemistry | Macromolecular Substances - chemistry | Hydrogen Bonding | Polymers - chemical synthesis | Molecular Conformation | Polymers - chemistry | Cross-Linking Reagents - chemical synthesis | Macromolecular Substances - chemical synthesis | Thin films | Usage | Mechanical properties | Electromyography | Research | Dielectric films | Chemical properties | Polymers | Hydrogen bonding
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5. Full Text Interfacial bonding of Flax fibre/Poly( l-lactide) bio-composites
by Le Duigou, Antoine and Davies, Peter and Baley, Christophe
Composites Science and Technology, ISSN 0266-3538, 2010, Volume 70, Issue 2, pp. 231 - 239
The use of glass fibre reinforced polyester composites raises many health and safety and environmental questions. One alternative is the development of high... 
B. Interfacial properties | A. Biopolymer | D. Microbond test | A. Flax fibre | A. Biocomposite | TESTS | PART I | MATERIALS SCIENCE, COMPOSITES | Interfacial properties | UNIDIRECTIONAL COMPOSITES | THERMAL-STRESSES | FIBER | ADHESION | RESIDUAL-STRESSES | Flax fibre | Biopolymer | Biocomposite | POLYMER COMPOSITES | Microbond test | THERMOPLASTIC COMPOSITES
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6. Full Text Analyzing effects of surface roughness, voids, and particle–matrix interfacial bonding on the failure response of a heterogeneous adhesive
by Liang, Bowen and Nagarajan, Anand and Ahmadian, Hossein and Soghrati, Soheil
Computer Methods in Applied Mechanics and Engineering, ISSN 0045-7825, 04/2019, Volume 346, pp. 410 - 439
An automated computational framework is introduced to link the microstructure to the micromechanical behavior of a heterogeneous adhesive composed of an epoxy... 
Cohesive damage | Surface roughness | Heterogeneous adhesive | Finite element | Microstructure reconstruction | ELASTIC PROPERTIES | UNIDIRECTIONAL COMPOSITE MICROSTRUCTURES | GLASS FILLED EPOXIES | DAMAGE MODEL | MATHEMATICS, INTERDISCIPLINARY APPLICATIONS | MECHANICS | ENGINEERING, MULTIDISCIPLINARY | COHESIVE FAILURE | MESH GENERATION | LAP JOINTS | REPRESENTATIVE VOLUME ELEMENTS | MECHANICAL-BEHAVIOR | FINITE-ELEMENT-METHOD | Interfacial bonding | Damage assessment | Computer simulation | Image reconstruction | Silicon dioxide | Finite element method | Adhesive strength | Algorithms | Adhesives | Computed tomography | Mathematical analysis | Bonding strength | Iterative methods | Microstructure | Three dimensional models | Failure | Surface roughness effects | Mesh generation
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7. Full Text Bonding in cementitious materials with asphalt-coated particles: Part I – The interfacial transition zone
by Brand, Alexander S and Roesler, Jeffery R
Construction and Building Materials, ISSN 0950-0618, 01/2017, Volume 130, pp. 171 - 181
Reclaimed asphalt pavement (RAP), when used as a coarse aggregate, has been shown to reduce bulk concrete strength and modulus. Part I of this study quantifies... 
Backscattered electron microscopy | Image analysis | Concrete | Reclaimed asphalt pavement | Calcium hydroxide | Interfacial transition zone | MATERIALS SCIENCE, MULTIDISCIPLINARY | MECHANICAL-PROPERTIES | ENGINEERING, CIVIL | CONSTRUCTION & BUILDING TECHNOLOGY | PASTE | AGGREGATE | PORTLAND-CEMENT | IMAGE-ANALYSIS | ORGANIC-COMPOUNDS | PAVEMENT | MILLED BITUMINOUS CONCRETE | MICROSTRUCTURE | Mechanical properties | Pavements | Asphalt | Analysis | Cement
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8. Full Text Bonding in cementitious materials with asphalt-coated particles: Part II – Cement-asphalt chemical interactions
by Brand, Alexander S and Roesler, Jeffery R
Construction and Building Materials, ISSN 0950-0618, 01/2017, Volume 130, pp. 182 - 192
Reclaimed asphalt pavement (RAP), when used as an aggregate in concrete, will reduce bulk concrete strength and modulus. While Part I of this study... 
Bond improvement | Concrete | Interfacial bond test | Reclaimed asphalt pavement | Surface free energy | Interfacial transition zone | MODIFIED CONCRETE | SURFACE FREE-ENERGY | PERFORMANCE | MATERIALS SCIENCE, MULTIDISCIPLINARY | COMPOSITES | MECHANICAL-PROPERTIES | MIXTURES | TIRE RUBBER | ENGINEERING, CIVIL | CONSTRUCTION & BUILDING TECHNOLOGY | SPECTROSCOPY | PASTE | AGGREGATE | Mechanical properties | Pavements | Asphalt | Porosity | Analysis | Cement
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9. Full Text Accelerated Metastable Solid–liquid Interdiffusion Bonding with High Thermal Stability and Power Handling
by Huang, Ting-Chia and Smet, Vanessa and Kawamoto, Satomi and Pulugurtha, Markondeya R and Tummala, Rao R
Journal of Electronic Materials, ISSN 0361-5235, 1/2018, Volume 47, Issue 1, pp. 368 - 377
Emerging high-performance systems are driving the need for advanced packaging solutions such as 3-D integrated circuits (ICs) and 2.5-D system integration with... 
Solid State Physics | Materials Science | interfacial reaction | Optical and Electronic Materials | Electronics and Microelectronics, Instrumentation | Intermetallics | Characterization and Evaluation of Materials | solid liquid interdiffusion bonding | electromigration | PHOSPHORUS | PHYSICS, APPLIED | MATERIALS SCIENCE, MULTIDISCIPLINARY | INTERCONNECTION | ENGINEERING, ELECTRICAL & ELECTRONIC | INTERMETALLIC COMPOUND | NICKEL | KINETICS | GROWTH | INTERFACIAL REACTIONS | DIFFUSION | AG-CU SOLDERS | Intermetallic compounds | Materials | Electrodiffusion | Semiconductor preparation | Structure | Properties | Methods | Test vehicles | Solders | Phase transformations | Metastable phases | Barrier layers | Design for manufacturability | Circuit reliability | Bonded joints | Bond strength | Interdiffusion | Interconnections | Thermal stability | Integrated circuits | Electromigration | Diffusion layers | Diffusion barriers | Bonding strength | Tin | Nickel | Manufacturability | Materials research | Copper
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10. Full Text Interfacial chemical bonding-mediated ionic resistive switching
by Moon, Hyeongjoo and Zade, Vishal and Kang, Hung-Sen and Han, Jin-Woo and Lee, Eunseok and Hwang, Cheol Seong and Lee, Min Hwan
Scientific Reports, ISSN 2045-2322, 12/2017, Volume 7, Issue 1, pp. 1264 - 10
In this paper, we present a unique resistive switching (RS) mechanism study of Pt/TiO2/Pt cell, one of the most widely studied RS system, by focusing on the... 
TRANSITION | MEMORY | MULTIDISCIPLINARY SCIENCES | ATOMIC-FORCE SPECTROSCOPY | THIN-FILM STRUCTURES | FILAMENT | TOTAL-ENERGY CALCULATIONS | MECHANISMS | BIPOLAR | INITIO MOLECULAR-DYNAMICS | WAVE BASIS-SET | Chemical bonds | Atomic force microscopy | Interfacial bonding
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11. Full Text The impact of weak interfacial bonding strength on mechanical properties of metal matrix – Ceramic reinforced composites
by Jarząbek, Dariusz M
Composite Structures, ISSN 0263-8223, 10/2018, Volume 201, pp. 352 - 362
In this work the influence of weak interface between particles and matrix on mechanical properties of metal matrix – ceramic reinforced composites is studied.... 
Metal matrix composites | Cohesive elements | Silicon carbide | Tensile strength | Electrodeposited nickel | Interfacial bonding strength | DELAMINATION | MATERIALS SCIENCE, COMPOSITES | MODEL | DAMAGE | PREDICTION | Mechanical properties | Computer-generated environments | Computer simulation | Analysis | Carbides
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12. Full Text Effects of Ni–W(Au) coated Cu microcones on the bonding interfaces
by Hu, Fengtian and Hu, Anmin and Wang, Haozhe and Yang, Shan and Li, Ming
Applied Surface Science, ISSN 0169-4332, 10/2015, Volume 353, pp. 774 - 780
Nickel-based alloys are being studied a lot currently in an effort to develop stable barrier films between solder and copper substrate. In this paper,... 
Diffusion barrier layer | Interfacial reaction | High-temperature anticorrosion | Ni–W alloys coating | Cu microcones | Ni-W alloys coating | PHYSICS, CONDENSED MATTER | PHYSICS, APPLIED | CHEMISTRY, PHYSICAL | NI-W ALLOYS | P FILMS | RESISTANCE | SN | ELECTRODEPOSITION | High temperature anticorrosion | MORPHOLOGY | MATERIALS SCIENCE, COATINGS & FILMS | Corrosion prevention | Scanning electron microscopy | Nickel base alloys | COATINGS | INTERFACES | Nickel | BONDING | NICKEL ALLOYS (50 TO 99 NI) | Coating | CORROSION PROTECTION | Interface reactions | Copper
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13. Full Text One-step bonding of Ni electrode to n-type PbTe — A step towards fabrication of thermoelectric generators
by Ferreres, Xavier Reales and Aminorroaya Yamini, Sima and Nancarrow, Mitchell and Zhang, Chao
Materials & Design, ISSN 0264-1275, 10/2016, Volume 107, pp. 90 - 97
PbTe-based thermoelectric materials are good candidates for harvesting waste heat at mid-range temperatures due to their high thermoelectric efficiencies.... 
Nickel | Thermoelectric module | One-step sintering | PbTe | Interface | LEAD-TELLURIDE | THERMAL-EXPANSION | PERFORMANCE | MATERIALS SCIENCE, MULTIDISCIPLINARY | POWER | COSB3 | FOIL | INTERFACIAL REACTION | MODULES | SURFACE | Electrodes | Thermoelectric materials | Lead tellurides | Lead base alloys | Interphase | Intermetallics | Bonding
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14. Full Text Reliability Investigation of Cu/In TLP Bonding
by Lee, Jong-Bum and Hwang, How-Yuan and Rhee, Min-Woo
Journal of Electronic Materials, ISSN 0361-5235, 1/2015, Volume 44, Issue 1, pp. 435 - 441
Die-attach bonding was evaluated using a transient liquid phase (TLP) bonding method on a Cu/In, Au/In and Cu-Sn3Ag metal stack. TLP bonding is a relatively... 
Solid State Physics | Transient liquid phase bonding | interfacial microstructure | rugged electronics | Optical and Electronic Materials | Electronics and Microelectronics, Instrumentation | Characterization and Evaluation of Materials | die-attach bonding | high-temperature storage test | Material Science | temperature cycle test | PHYSICS, APPLIED | MATERIALS SCIENCE, MULTIDISCIPLINARY | DIFFUSION | INTERMETALLIC PHASE-FORMATION | ENGINEERING, ELECTRICAL & ELECTRONIC | Chemical bonds | Intermetallic compounds | Properties | Structure | Analysis | Bond strength | Reliability engineering | Liquids | Phase transitions
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15. Full Text Controlling Interfacial Dynamics: Covalent Bonding versus Physical Adsorption in Polymer Nanocomposites
by Holt, Adam P and Bocharova, Vera and Cheng, Shiwang and Kisliuk, Alexander M and White, B. Tyler and Saito, Tomonori and Uhrig, David and Mahalik, J. P and Kumar, Rajeev and Imel, Adam E and Etampawala, Thusitha and Martin, Halie and Sikes, Nicole and Sumpter, Bobby G and Dadmun, Mark D and Sokolov, Alexei P and Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States). Center for Nanophase Materials Sciences (CNMS)
ACS Nano, ISSN 1936-0851, 07/2016, Volume 10, Issue 7, pp. 6843 - 6852
It is generally believed that the strength of the polymer–nanoparticle interaction controls the modification of near-interface segmental mobility in polymer... 
self-consistent field theory | segmental dynamics | glass transition | interfacial dynamics | polymer-grafted nanoparticles | polymer nanocomposites | MOLECULAR-DYNAMICS | FRAGILITY | MATERIALS SCIENCE, MULTIDISCIPLINARY | CHEMISTRY, PHYSICAL | NANOSCIENCE & NANOTECHNOLOGY | MODEL | CHEMISTRY, MULTIDISCIPLINARY | GLASS-TRANSITION | IMMOBILIZED POLYMER | MOTION | FILMS | SURFACE | LAYER | NANOSCIENCE AND NANOTECHNOLOGY | INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY | MATERIALS SCIENCE
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16. Full Text Bonding measurement —Strength and fracture mechanics approaches
by ANUNMANA, Chuchai and WANSOM, Wiroj
Dental Materials Journal, ISSN 0287-4547, 2017, Volume 36, Issue 4, pp. 497 - 502
This study investigated the effect of cross-sectional areas on interfacial fracture toughness and bond strength of bilayered dental ceramics. Zirconia core... 
Zirconia | Interfacial toughness | Fractography | Microtensile |