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Microelectronics International, ISSN 1356-5362, 10/2018, Volume 35, Issue 4, pp. 231 - 243
Purpose The purpose of this paper is to demonstrate a novel 3D system-in-package (SiP) approach. This new packaging approach is based on stacked silicon... 
Gas sensor system | PM sensor | LED module | System-in-package (SiP) | MATERIALS SCIENCE, MULTIDISCIPLINARY | SILICON | ENGINEERING, ELECTRICAL & ELECTRONIC | Microelectromechanical systems | Silicon wafers | Semiconductors | Light emitting diodes | Form factors | Design engineering | Lighting | Assembling | Packaging | Silicon | Sensors | Miniaturization | Gas sensors | Packaging design
Journal Article
IEEE Electron Device Letters, ISSN 0741-3106, 07/2015, Volume 36, Issue 7, pp. 702 - 704
Journal Article
Microelectronics Reliability, ISSN 0026-2714, 08/2016, Volume 63, pp. 76 - 81
Solid-state lightings (SSL) rapidly penetrate the global illumination market because of the energy efficiency and the reliability. The energy efficiency can be... 
Finite element analysis | Response surface methodology | Chip package interaction | LED package reliability | PHYSICS, APPLIED | NANOSCIENCE & NANOTECHNOLOGY | ENGINEERING, ELECTRICAL & ELECTRONIC | Packaging | Light-emitting diodes | Energy efficiency
Journal Article
Microelectronics International, ISSN 1356-5362, 05/2015, Volume 32, Issue 2, pp. 63 - 72
Purpose – This study aims to provide a flexible and cost-effective solution of 3D heterogeneous integration for applications such as micro-electro-mechanical... 
Engineering | Electrical & electronic engineering | LED | MEMS | Silicon submount | System in package | PLATFORM | MATERIALS SCIENCE, MULTIDISCIPLINARY | ENGINEERING, ELECTRICAL & ELECTRONIC | Design | Microelectromechanical systems | Aluminum | Lighting | Light | Packaging | Package design | Sensors
Journal Article
Crystals, ISSN 2073-4352, 01/2019, Volume 9, Issue 1, p. 21
The Scattered Photon Extraction (SPE) based on the concept of TIR lens combined with remote phosphor is proven to be one of the effective solutions for... 
Remote phosphor | Spatial color uniformity | Light extraction efficiency | White LEDs | light extraction efficiency | white LEDs | YAG-CE PHOSPHOR | MATERIALS SCIENCE, MULTIDISCIPLINARY | OPTICAL-PROPERTIES | spatial color uniformity | CRYSTALLOGRAPHY | remote phosphor | LUMINOUS FLUX
Journal Article
2017, 1st ed., ISBN 1118750020, 372
A practical introduction to state-of-the-art freeform optics design for LED packages and applications By affording designers the freedom to create complex,... 
Lasers & Photonics | TECHNOLOGY & ENGINEERING | Light emitting diodes | LED lighting
eBook
by Yao, Q
Lighting Research & Technology, ISSN 1477-1535, 11/2016, Volume 48, Issue 7, pp. 844 - 856
This paper studies spectrum optimization of four-package LEDs to improve performance of light sources with respect to properties such as luminous efficacy and... 
SYSTEM | CONSTRUCTION & BUILDING TECHNOLOGY | OPTICS | Luminosity | Light emitting diodes | Effectiveness | Luminous efficacy | Rendering | Color | Mathematical models | Inverse | Optimization | Colour
Journal Article
Microelectronics Reliability, ISSN 0026-2714, 07/2016, Volume 62, pp. 39 - 44
Commercial claims for LED-based products in terms of lumen maintenance are fully based on TM-21 extrapolations using LM-80 data. This paper indicates that... 
Degradation | Lifetime | LEDs | Lumen decay | PHYSICS, APPLIED | DEGRADATION MECHANISMS | NANOSCIENCE & NANOTECHNOLOGY | ENGINEERING, ELECTRICAL & ELECTRONIC | Light-emitting diodes | Analysis | Warranties | Extrapolation | Lumens | Statistical analysis | Packages | Microelectronics | Maintenance
Journal Article
IEEE Electron Device Letters, ISSN 0741-3106, 05/2014, Volume 35, Issue 5, pp. 575 - 577
A novel, blue light-emitting diode (LED) packaging structure with improved light and thermal characteristics is presented. The package includes a TiO 2 -doped... 
Encapsulation | Light-emitting diode (LED) | silicone lens | TiO₂-doped silicone | dual-layer graded refractive index | Refractive index | Materials | Light emitting diodes | Junctions | dispensing technology | Lenses
Journal Article
by Zhou, Z and Wang, H and Zhang, J and Su, J and Ge, P
Lighting Research & Technology, ISSN 1477-1535, 5/2018, Volume 50, Issue 3, pp. 482 - 488
Existing white light LED technology uses a blue light LED chip to stimulate a phosphor powder to form white light. The phosphor layer on the surface directly... 
LIGHT-EMITTING-DIODES | WHITE | CONSTRUCTION & BUILDING TECHNOLOGY | OPTICS | White light | Luminous efficacy | Effectiveness | Rendering | Light emitting diodes | Color temperature | Electric power distribution
Journal Article
International Journal of Precision Engineering and Manufacturing, ISSN 2234-7593, 2013, Volume 14, Issue 6, pp. 1113 - 1116
A new concept, 'hybrid LED package system (HLP system)', is proposed as a simpler LED manufacturing process that unifies two steps of the process, the package... 
Hybrid LED package | Micro machining | Taguchi method | ENGINEERING, MANUFACTURING | ENGINEERING, MECHANICAL | ENHANCEMENT
Journal Article
IEEE Photonics Technology Letters, ISSN 1041-1135, 02/2013, Volume 25, Issue 3, pp. 246 - 249
In this letter, it is found through both experiments and Monte Carlo ray-tracing simulations that the working distances would influence the correlated color... 
Monte Carlo methods | Phosphors | Optimized production technology | Color | Detectors | Ray tracing | Light emitting diodes | phosphor | light-emitting diode (LED) | near-/mid-field effect | Color mixing | PHYSICS, APPLIED | OPTICS | SCATTERING | ENGINEERING, ELECTRICAL & ELECTRONIC
Journal Article
Bandaoti Guangdian/Semiconductor Optoelectronics, ISSN 1001-5868, 08/2013, Volume 34, Issue 4, pp. 621 - 625
Journal Article
Microelectronics Reliability, ISSN 0026-2714, 11/2017, Volume 78, pp. 294 - 298
Mid-power LED packages are now widely used in many indoor illumination applications due to several advantages. Temperature stress, humidity stress and current... 
Mid-power LED package | Temperature stress | Current stress | Humidity stress | Color shift | LIGHT-EMITTING-DIODES | PHYSICS, APPLIED | DEGRADATION MECHANISMS | NANOSCIENCE & NANOTECHNOLOGY | FAILURE | ENGINEERING, ELECTRICAL & ELECTRONIC
Journal Article
Microelectronics Reliability, ISSN 0026-2714, 01/2016, Volume 56, pp. 53 - 60
In this paper, the cost of a light emitting diode (LED) package is lowered by using a silicon substrate as the base attached to the chip, in contrast to the... 
COB package | LED package | Thermal resistance | Silicon sub-mount | MODULE | PHYSICS, APPLIED | PERFORMANCE | NANOSCIENCE & NANOTECHNOLOGY | ENGINEERING, ELECTRICAL & ELECTRONIC | Light-emitting diodes | Silicon | Printed circuits | Packages | Cob | Silicon substrates | Circuit boards | Heat transfer
Journal Article
Microelectronics Reliability, ISSN 0026-2714, 07/2017, Volume 74, pp. 179 - 185
According to the requirements on minimizing the package size, guaranteeing the performance uniformity and improving the manufacturing efficiency in LEDs, a... 
Chip scale packages | Thermal/luminescence characterization | Degradation mechanisms | Multicolor phosphors | Phosphor-converted white LED | LIGHT-EMITTING-DIODES | PHYSICS, APPLIED | NANOSCIENCE & NANOTECHNOLOGY | RELIABILITY | SPECTRAL POWER DISTRIBUTION | ENGINEERING, ELECTRICAL & ELECTRONIC | Light-emitting diodes | Analysis
Journal Article
Microelectronics Reliability, ISSN 0026-2714, 09/2014, Volume 54, Issue 9-10, pp. 2028 - 2033
This paper investigates the effect of void percentage in the solder layer on the shear strength and thermal property of DA3547 packages by SAC soldering... 
Thermal properties | Simulation | Soldering | Flip–chip LED | Flip-chip LED | LIGHT-EMITTING-DIODES | PHYSICS, APPLIED | BUMPS | NANOSCIENCE & NANOTECHNOLOGY | QUANTUM-WELLS | ENGINEERING, ELECTRICAL & ELECTRONIC | Light-emitting diodes | Analysis | Pastes | Voids | Solders | Shear tests | Mathematical analysis | Packages | Shear strength
Journal Article
Journal of Micromechanics and Microengineering, ISSN 0960-1317, 05/2015, Volume 25, Issue 5, pp. 55017 - 10
Miniaturization of solid state lighting (SSL) luminaires as well as reduction of packaging and assembly costs are of prime interest for the SSL lighting... 
flexible interconnects | LED | MEMS | polyimide | solid state lighting | wafer level packaging | PHYSICS, APPLIED | NANOSCIENCE & NANOTECHNOLOGY | ENGINEERING, ELECTRICAL & ELECTRONIC | MODULE | INSTRUMENTS & INSTRUMENTATION | SUBSTRATE | TSV | Design engineering | Packages | Lighting | Illumination | Silicon | Assembly | Polyimide resins | Three dimensional
Journal Article
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