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materials science, multidisciplinary (34) 34
metalloorganic nanoparticles (34) 34
silver (21) 21
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physics, applied (19) 19
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metals (9) 9
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electronic packaging (7) 7
joints (7) 7
material science (7) 7
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chemistry, multidisciplinary (4) 4
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ag nanoparticles (2) 2
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Applied Physics Letters, ISSN 0003-6951, 10/2010, Volume 97, Issue 15, pp. 153117 - 153117-3
We achieve robust bonding of Cu wires to Cu pads on polyimide with silver nanopaste cured at 373 K. The paste is prepared by simply condensing Ag nanoparticle... 
CONDUCTIVE ADHESIVES | PHYSICS, APPLIED | METALLOORGANIC NANOPARTICLES | SPECTROSCOPY | METALS | BEHAVIOR | THERMAL-DECOMPOSITION | TECHNOLOGY | NANOWIRES | SILVER NANOPARTICLES | SURFACE CHARACTERIZATION
Journal Article
Journal of Materials Processing Tech, ISSN 0924-0136, 01/2015, Volume 215, Issue 1, pp. 299 - 308
Journal Article
Journal of Solid State Chemistry, ISSN 0022-4596, 06/2012, Volume 190, pp. 80 - 84
In this study MoO nanoparticles were prepared in porous Vycor glass by impregnation–decomposition cycles (IDC) with molybdenum(VI) 2-ethylhexanoate. X-ray... 
Nanoparticles | α-MoO3 | Structural evolution | Size effect | THIN-FILMS | NANOCRYSTALS | OPTICAL-PROPERTIES | CHEMISTRY, PHYSICAL | RAMAN | CHEMISTRY, INORGANIC & NUCLEAR | SPECTROSCOPY | TEMPERATURE | alpha-MoO3 | CONFINEMENT | ABSORPTION | METALLOORGANIC DECOMPOSITION | MORPHOLOGY | Quantum confinement | Red shift | Images | Evolution | Doppler effect | Tuning | Crystal structure
Journal Article
Materials Transactions, ISSN 1345-9678, 12/2008, Volume 49, Issue 12, pp. 2875 - 2880
We investigated a new bonding utilizing micro-scaled silver-oxide (Ag2O) particles. The results of our investigations revealed that bonding between electrodes... 
Reduction | Epitaxial growth | Bonding technique | Nanoparticle | Silver oxide | bonding technique | silver oxide | METALS | epitaxial growth | MATERIALS SCIENCE, MULTIDISCIPLINARY | METALLURGY & METALLURGICAL ENGINEERING | nanoparticle | reduction | AG METALLOORGANIC NANOPARTICLES | TECHNOLOGY
Journal Article
Materials Transactions, ISSN 1345-9678, 2015, Volume 56, Issue 7, pp. 992 - 996
A paste containing CuO particles and polyethylene glycol 1000 as a reducing solvent has been applied to joining pure Cu in electronic applications, and the... 
Copper joint | Reduction | Copper oxide | Copper nanoparticles | copper oxide | copper nanoparticles | copper joint | IN-SITU FORMATION | METALLOORGANIC NANOPARTICLES | TEMPERATURE | MATERIALS SCIENCE, MULTIDISCIPLINARY | METALLURGY & METALLURGICAL ENGINEERING | reduction | AG2O | SILVER NANOPARTICLES
Journal Article
Materials Transactions, ISSN 1345-9678, 2015, Volume 56, Issue 7, pp. 1030 - 1036
The effects of reducing solvent on copper, nickel, and aluminum joining using silver nanoparticles derived from a silver oxide paste was investigated by... 
Joining | Transmission electron microscopy | Nanoparticle | Sintering | Interface | Silver oxide | joining | silver oxide | IN-SITU FORMATION | sintering | METALLOORGANIC NANOPARTICLES | MATERIALS SCIENCE, MULTIDISCIPLINARY | METALLURGY & METALLURGICAL ENGINEERING | nanoparticle | transmission electron microscopy | JOINTS | interface | AG2O
Journal Article
Materials Science and Technology, ISSN 0267-0836, 09/2017, Volume 33, Issue 14, pp. 1618 - 1625
A metal-metal bonding technique is described that uses nanoparticles composed of silver and copper. Colloid solutions of nanoparticles with an Ag content of... 
filler | silver | nanoparticles | Copper | metal-metal bonding | metal–metal bonding | DEPRESSION | METALLOORGANIC NANOPARTICLES | BEHAVIOR | MATERIALS SCIENCE, MULTIDISCIPLINARY | METALLURGY & METALLURGICAL ENGINEERING | OXIDE NANOPARTICLES | PASTE | MELTING TEMPERATURE | SOLDER
Journal Article
Materials Transactions, ISSN 1345-9678, 2012, Volume 53, Issue 12, pp. 2085 - 2090
Journal Article
Japanese Journal of Applied Physics, ISSN 0021-4922, 12/2009, Volume 48, Issue 12, p. 125004
In this paper, we report on low temperature bonding using silver nanoparticles stabilized by short-chain alkylamines with different numbers carbon between 8 to... 
PHYSICS, APPLIED | METALLOORGANIC NANOPARTICLES | CLUSTERS | ELECTRONICS
Journal Article
JOURNAL OF THE JAPAN INSTITUTE OF METALS AND MATERIALS, ISSN 0021-4876, 07/2014, Volume 78, Issue 7, pp. 280 - 285
The bondability of copper joints formed using a mixed paste of silver oxide (Ag2O) and copper oxide (CuO) that contained reducing solvents was evaluated in... 
copper oxide | silver oxide | nanoparticles | copper joint | sintering | METALLOORGANIC NANOPARTICLES | METALLURGY & METALLURGICAL ENGINEERING | SILVER | ion migration
Journal Article
Journal of Alloys and Compounds, ISSN 0925-8388, 2012, Volume 514, pp. 6 - 19
Journal Article
Materials Letters, ISSN 0167-577X, 12/2015, Volume 161, pp. 231 - 233
Recently, the sintering behavior of nanoparticles has attracted significant interest for high-power devices. However, nanoparticle pastes are relatively... 
Sintered joint | High-temperature joining process | Microscale Ag particle paste | Joint strength | PHYSICS, APPLIED | METALLOORGANIC NANOPARTICLES | TEMPERATURE | MATERIALS SCIENCE, MULTIDISCIPLINARY | Sintering | Pastes | Nanoparticles | Discs | Silver | Organic materials | Shear strength | Devices
Journal Article
Scripta Materialia, ISSN 1359-6462, 07/2016, Volume 120, pp. 80 - 84
Journal Article
Microelectronics Reliability, ISSN 0026-2714, 12/2015, Volume 55, Issue 12, pp. 2524 - 2531
Nano-silver paste has become an alternative lead-free (Pb-free) die attach material for microelectronic packaging, compared to traditional solders and adhesive... 
Bonding strength | Thermal aging | Nano-silver paste | Interface reaction | Bare copper plate | PHYSICS, APPLIED | METALLOORGANIC NANOPARTICLES | BEHAVIOR | NANOSCIENCE & NANOTECHNOLOGY | INTERCONNECTION | ENGINEERING, ELECTRICAL & ELECTRONIC | DIE ATTACH MATERIALS | CARBOXYLATE | PASTE | Sintering | Electrical conductivity
Journal Article
Journal of Materials Chemistry, ISSN 0959-9428, 10/2011, Volume 21, Issue 40, pp. 15981 - 15986
There is an increasing interest in developing a low temperature interconnection process using nanoparticles. Some studies focus on bonding using Ag... 
COPPER NANOPARTICLES | METALLOORGANIC NANOPARTICLES | PARTICLES | MECHANISM | MATERIALS SCIENCE, MULTIDISCIPLINARY | SIZE | CHEMISTRY, PHYSICAL | POLYMER COMPOSITES | NANOWIRES | SILVER NANOPARTICLES | LEAD
Journal Article
Materials Science & Engineering A, ISSN 0921-5093, 10/2015, Volume 645, pp. 264 - 272
Journal Article
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