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Structure and bonding, ISSN 0081-5993, 1966
Journal
Journal of applied physics, ISSN 1089-7550, 02/2006, Volume 99, Issue 3, pp. 031101 - 031101-28
Wafer bonding with intermediate polymer adhesives is an important fabrication technique for advanced microelectronic and microelectromechanical systems, such as three-dimensional integrated circuits... 
Physical Sciences | Physics | Science & Technology | Physics, Applied | Chemical bonds | Usage | Semiconductor wafers | Chemical properties | Analysis | Complementary metal oxide semiconductors
Journal Article
2013, ISBN 1461457602, 254
Copper wire bonding is now replacing gold across the electronics industry, but its metallurgical aspects are highly specialized... 
Metal bonding | Wire bonding (Electronic packaging) | Structural control (Engineering) | Optical materials | Copper wire
eBook
eBook
Chemical Society reviews, ISSN 1460-4744, 2014, Volume 43, Issue 14, pp. 5106 - 5139
... [TM] through donor–acceptor interactions are discussed together with an analysis of the bonding situation with modern quantum chemical methods... 
Physical Sciences | Chemistry | Chemistry, Multidisciplinary | Science & Technology | Lewis acid | Electronic structure | Transition metals | Donors (electronic) | Chemical bonds | Ligands | Coordination compounds | Bonding
Journal Article