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IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, ISSN 0885-3010, 11/2019, pp. 1 - 1
A linear piezoelectric micromachined ultrasound transducer (PMUT) array was fabricated and integrated into a device for photoacoustic imaging of tissue... 
Electrodes | Optical fibers | Micro-Electromechanical Systems | Ultrasonic imaging | Transducers | Piezoelectric Micromachined Ultrasound Transducers | Photoacoustic imaging | PMUTs | Ultrasound Imaging | Optical arrays
Journal Article
MICROMACHINES, ISSN 2072-666X, 07/2019, Volume 10, Issue 7, p. 469
Journal Article
Applied Surface Science, ISSN 0169-4332, 2003, Volume 208, Issue 1, pp. 153 - 158
Journal Article
IEEE Transactions on Magnetics, ISSN 0018-9464, 02/2016, Volume 52, Issue 2
Journal Article
IEEE/ASME Transactions on Mechatronics, ISSN 1083-4435, 02/2018, Volume 23, Issue 1, pp. 452 - 458
Journal Article
Electrochimica Acta, ISSN 0013-4686, 2002, Volume 47, Issue 16, pp. 2583 - 2588
A new wet process for selective copper deposition on silicon surfaces is employed to achieve conformal metallization of silicon micromechanical devices. The... 
Micro-electromechanical systems | Adhesion | Galvanic displacement | Copper metallization | ELECTROCHEMISTRY | galvanic displacement | COPPER-FILMS | micro-electromechanical systems | DEPOSITION | ELECTROLESS CU | copper metallization | MEMS | adhesion
Journal Article
IEEE Electron Device Letters, ISSN 0741-3106, 05/2018, Volume 39, Issue 5, pp. 742 - 745
An integrated microwave detector at the X-band (8-12 GHz), based on a micro-electromechanical systems (MEMS) approach, is proposed in this letter. A six-port... 
Micromechanical devices | Microwave measurement | Coupler | MIM capacitor | Detectors | Microwave devices | micro-electromechanical systems (MEMS) | Frequency measurement | integrated detection
Journal Article
Journal Article
Guangxue Jingmi Gongcheng/Optics and Precision Engineering, ISSN 1004-924X, 06/2013, Volume 21, Issue 6, pp. 1440 - 1446
This paper reported on the microfabrication of alkali metal vapor cells based on the two-step low temperature anodic bonding for the chip-scale integration of... 
Micro-electromechanical System(MEMS) | Alkali metal packet | Chip-scale atomic device | Atomic vapor cell | Anodic bonding | Electric potential | Anodic | Alkali metals | Voltage | Chemical bonds | Devices | Rubidium | Bonding
Journal Article
Sensors & Actuators: A. Physical, ISSN 0924-4247, 2003, Volume 105, Issue 1, pp. 31 - 39
Journal Article
Sensors & Actuators: A. Physical, ISSN 0924-4247, 2011, Volume 167, Issue 2, pp. 389 - 397
Journal Article
Guti Lixue Xuebao/Acta Mechanica Solida Sinica, ISSN 0254-7805, 04/2013, Volume 34, Issue 2, pp. 109 - 116
Journal Article
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