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Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering, ISSN 0912-0289, 2018, Volume 84, Issue 6, pp. 507 - 510
Journal Article
精密工学会誌, ISSN 0912-0289, 2018, Volume 84, Issue 6, pp. 507 - 510
Journal Article
Surface and Interface Analysis, ISSN 0142-2421, 06/2008, Volume 40, Issue 6‐7, pp. 1007 - 1010
Improvement of thickness variation of the AT cut quartz crystal wafer is very important to advance the performance of the quartz resonator and to improve the... 
numerically controlled | atmospheric pressure plasma | AT cut quartz crystal wafer | ultraprecision machining | etching | Etching | Atmospheric pressure plasma | Numerically controlled | At cut quartz crystal wafer | Ultraprecision machining | CHEMISTRY, PHYSICAL | FABRICATION | VAPORIZATION | MIRROR
Journal Article
Key Engineering Materials, ISSN 1013-9826, 02/2009, Volume 407-408, pp. 343 - 346
Thickness uniformity of an AT-cut quartz crystal wafer is essential requirement for higher productivity of quartz resonator in the sense of reducing the... 
Atmospheric pressure plasma | Quartz crystal wafer | Plasma CVM | Ultraprecision machining
Journal Article
Japanese Journal of Applied Physics, Part 2: Letters, ISSN 0021-4922, 2005, Volume 44, Issue 16-19, pp. L539 - L542
Nanofocused X-ray beams are necessary for nanometer-scale spatial microscopy analysis. X-ray focusing using a Kirkpatrick-Baez setup with two total reflection... 
MSI | Focusing mirror | Diffraction limited focusing | Hard x-ray | Kirkpatrick-baez mirrors | RADSI | Nanofocusing | Plasma CVM | EEM | focusing mirror | CELLS | PHYSICS, APPLIED | Kirkpatrick-Baez mirrors | nanofocusing | MICROPROBE | diffraction limited focusing | plasma CVM | LEVEL ACCURACY | FABRICATION | X-ray | OPTICS
Journal Article
Japanese journal of applied physics. Pt. 2, Letters, ISSN 0021-4922, 07/1998, Volume 37, Issue 7B, pp. L894 - L896
We have developed a device for the fabrication of optical surfaces on the basis of plasma chemical vaporization machining (CVM). In this device,... 
PHYSICS, APPLIED | roughness | fabrication | computer control | polishing | plasma CVM | optics | silica glass | ATMOSPHERIC-PRESSURE | atmospheric pressure
Journal Article
Journal of Physics D: Applied Physics, ISSN 0022-3727, 03/2014, Volume 47, Issue 11, pp. 1 - 6
Photolithography techniques have been used to enable the low-cost and high-speed transfer of a pattern onto a silicon wafer. However, owing to the high... 
numerically controlled | atmospheric pressure plasma | pulse width modulation | plasma CVM | figuring | PHYSICS, APPLIED | FABRICATION | Form accuracy | Scanning | Semiconductors | Electric power | Modulation | Machining | Pulse duration modulation | Vaporization
Journal Article
Review of Scientific Instruments, ISSN 0034-6748, 12/2000, Volume 71, Issue 12, pp. 4627 - 4632
Conventional machining processes, such as turning, grinding, or lapping are still applied for many materials including functional ones. But those processes are... 
INSTRUMENTS & INSTRUMENTATION | PHYSICS, APPLIED
Journal Article
精密工学会誌, ISSN 0912-0289, 2000, Volume 66, Issue 8, pp. 1280 - 1285
Conventional machining processes, such as turning, grinding, or lapping are still applied for many materials including functional ones. But those processes are... 
silicon wafer | atmospheric pressure plasma | Plasma CVM | radical | rotary electrode
Journal Article
Procedia CIRP, ISSN 2212-8271, 2012, Volume 3, Issue 1, pp. 335 - 339
Chemical figuring and finishing techniques using atmospheric pressure plasma were proposed for realizing damage free processing of a reaction sintered SiC... 
Figuring | Plasma CVM | Sintered SiC
Journal Article
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering, ISSN 0912-0289, 2003, Volume 69, Issue 5, pp. 721 - 725
Journal Article
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering, ISSN 0912-0289, 2000, Volume 66, Issue 8, pp. 1280 - 1285
Journal Article
Japanese Journal of Applied Physics, Part 2: Letters, ISSN 0021-4922, 07/1998, Volume 37, Issue 7, pp. L894 - L896
Journal Article
精密工学会誌, ISSN 0912-0289, 05/2003, Volume 69, pp. 721 - 725
The trial manufacture of the ultra-thin SOI (Silicon on Insulator) wafer has already been carried out by numerically controlled plasma CVM (Chemical... 
Journal Article
ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014, 01/2015, pp. 275 - 278
Conference Proceeding
精密工学会誌, ISSN 0912-0289, 2001, Volume 67, Issue 2, pp. 295 - 299
For cutting the functional material, a mechanical machining method which applied cutting and grinding is generally used. Therefore, a deformed layer is left in... 
plasma CVM | cutting speed | cutting of functional material | deformed layer | kerf loss
Journal Article
精密工学会誌, ISSN 0912-0289, 2002, Volume 68, pp. 1347 - 1350
New fabrication methods referred to elastic emission machining (EEM) and plasma chemical vaporization machining (CVM) together with a new figure testing method... 
X-ray mirror | ultraprecision machining | X-ray microscopy | plasma CVM | micro-focusing | wave optics | EEM
Journal Article
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