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Materials Letters, ISSN 0167-577X, 08/2014, Volume 128, pp. 42 - 45
We achieve robust bonding of large area power chip (≥100 mm ) based on pressureless sintering of silver particles at low temperature, i.e., 250 °C. The... 
Die attachment | Microstructures | Pressureless sintering | Diffusion bonding | Silver nanoparticles | PHYSICS, APPLIED | MATERIALS SCIENCE, MULTIDISCIPLINARY | Packaging | Sintering | Electric properties
Journal Article
Biosensors and Bioelectronics, ISSN 0956-5663, 01/2013, Volume 39, Issue 1, pp. 124 - 132
Journal Article
Journal of Materials Processing Tech, ISSN 0924-0136, 05/2018, Volume 255, pp. 644 - 649
We achieved robust bonding of a large area power chip (>100 mm ) with sintered Ag joint produced by the electrical current assisted sintering (ECAS) technique... 
ECAS | Nano-Ag | IGBT | Die-attach | Current-assisted sintering | Twin | MATERIALS SCIENCE, MULTIDISCIPLINARY | RELIABILITY | SILVER JOINTS | LOW-TEMPERATURE | NANOPARTICLES | NANOSCALE | ENGINEERING, MANUFACTURING | ENGINEERING, INDUSTRIAL
Journal Article
Journal of Electronic Materials, ISSN 0361-5235, 6/2011, Volume 40, Issue 6, pp. 1394 - 1402
Journal Article
Scripta Materialia, ISSN 1359-6462, 04/2012, Volume 66, Issue 8, pp. 582 - 585
We have developed a new method for preparing a paste containing a high concentration of Ag nanoparticles for pressureless bonding. A nanoscale layer of... 
Ag nanoparticle paste | Sintering | Electronic packaging | Pressureless bonding | GOLD | METALLOORGANIC NANOPARTICLES | BEHAVIOR | MATERIALS SCIENCE, MULTIDISCIPLINARY | METALLURGY & METALLURGICAL ENGINEERING | NANOSCIENCE & NANOTECHNOLOGY | SILVER NANOPARTICLES | TEMPERATURE | METALS | Packaging | Usage | Mechanical engineering
Journal Article
Critical Reviews in Analytical Chemistry, ISSN 1040-8347, 07/2009, Volume 39, Issue 3, pp. 189 - 203
Journal Article
Journal of Alloys and Compounds, ISSN 0925-8388, 07/2019, Volume 795, pp. 163 - 167
Journal Article
Electroanalysis, ISSN 1040-0397, 08/2009, Volume 21, Issue 16, pp. 1786 - 1791
A differential pulse voltammetric (DPV) method was developed for the determination of 4‐nitrophenol (4‐NP) at a newly developed silver amalgam paste electrode... 
Environmental chemistry | Drinking water | Silver amalgam paste electrode | Voltammetry | 4‐Nitrophenol | ELECTROCHEMISTRY | CHEMISTRY, ANALYTICAL | DIFFERENTIAL-PULSE VOLTAMMETRY | NITROPHENOLS | WATERS | PARATHION | FLOW SYSTEM | 4-Nitrophenol | 2-NITROPHENOL | PHENOLS
Journal Article
Microelectronic Engineering, ISSN 0167-9317, 08/2019, Volume 216, p. 111085
Imprint lithography technique is widely used as microfabrication technology. Imprint lithography is a contact method utilizing a fine pattern mold and prints... 
Imprint lithography | Gas permeability | Repeatability | Mold release property | Flexibility | Silver nano-paste | PHYSICS, APPLIED | DEFECT | NANOSCIENCE & NANOTECHNOLOGY | ENGINEERING, ELECTRICAL & ELECTRONIC | NANOIMPRINT LITHOGRAPHY | ADHESION | SOLVENTS | SURFACTANT | REDUCTION | OPTICS | Offset printing | Patterning | Lithography | Cellulose | Molds | Crosslinking | Microelectronics | Permeability | Derivatives
Journal Article
Journal of Materials Science: Materials in Electronics, ISSN 0957-4522, 2019, Volume 30, Issue 8, pp. 8071 - 8079
A new type of Ag nanoparticle (NP) paste for rapid sintering was prepared by controlling the thickness of the NP capping agent. The Ag NP paste was combined... 
PHYSICS, CONDENSED MATTER | PHYSICS, APPLIED | MATERIALS SCIENCE, MULTIDISCIPLINARY | ENGINEERING, ELECTRICAL & ELECTRONIC | Nanoparticles | Silver | Transmission electron microscopy | Sintering | Shear strength | Bonded joints | Bonding strength | Copper | Substrates
Journal Article
Microelectronics Reliability, ISSN 0026-2714, 2012, Volume 52, Issue 2, pp. 375 - 380
New types of die attach pastes comprising micron-sized Ag particles hybridized with submicron-sized Ag particles were considered as lead-free die attach... 
NANOSCIENCE & NANOTECHNOLOGY | PHYSICS, APPLIED | SILICON-CARBIDE | ELECTRONICS | POWER DEVICES | ENGINEERING, ELECTRICAL & ELECTRONIC | Sintering | Pastes | Silver | Silicon carbide | Semiconductors | Electrical resistivity | Bonding strength | Nanostructure | Alcohols
Journal Article
Biosensors and Bioelectronics, ISSN 0956-5663, 01/2017, Volume 87, pp. 1065 - 1070
A new sensitive simple electrochemical sensor for Moxifloxacin Hydrochloride (MOXI) detection has been successfully performed. The sensor built on carbon paste... 
Moxifloxacin Hydrochloride | EDX | SEM | Ag nanoparticles | EIS | ELECTROCHEMISTRY | CHEMISTRY, ANALYTICAL | ANTIBIOTICS | BEHAVIOR | ANIONIC SURFACTANT | NANOSCIENCE & NANOTECHNOLOGY | HYDROGEN EVOLUTION | BIOPHYSICS | BIOTECHNOLOGY & APPLIED MICROBIOLOGY | DNA | ELECTRODE | HUMAN URINE | BIOSENSOR | ALLOY | ACID-SOLUTION |