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2012, ISBN 9783527326464, 430
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D... 
Microelectromechanical systems | Semiconductor wafers | Design and construction | Semiconductors | Handbooks, manuals, etc | Bonding
eBook
Journal of applied physics, ISSN 1089-7550, 02/2006, Volume 99, Issue 3, pp. 031101 - 031101-28
Wafer bonding with intermediate polymer adhesives is an important fabrication technique for advanced microelectronic and microelectromechanical systems, such as three-dimensional integrated circuits... 
Physical Sciences | Physics | Science & Technology | Physics, Applied | Chemical bonds | Usage | Semiconductor wafers | Chemical properties | Analysis | Complementary metal oxide semiconductors
Journal Article
Science (American Association for the Advancement of Science), ISSN 1095-9203, 06/2011, Volume 332, Issue 6035, pp. 1294 - 1297
A wafer-scale graphene circuit was demonstrated in which all circuit components, including graphene field-effect transistor and inductors, were monolithically integrated on a single silicon carbide wafer... 
Integrated circuits | Electric potential | Graphene | Dielectric materials | Drains | REPORTS | Semiconductor wafers | Transistors | Inductors | Electric current | Transconductance | Science & Technology - Other Topics | Multidisciplinary Sciences | Science & Technology | Usage | Design and construction | Materials | Semiconductor chips | Materials science | Optoelectronics | Silicon carbide | Broadband | Circuits | Decibels | Mixers
Journal Article
Journal of Applied Physics, ISSN 0021-8979, 03/2011, Volume 109, Issue 5, pp. 053718 - 053718-6
Light-induced degradation (LID) due to boron-oxygen complex formation seriously diminishes the minority carrier lifetime of p -type Czochralski-grown (Cz) wafers... 
Physical Sciences | Physics | Science & Technology | Physics, Applied | Oxides | Semiconductor wafers | Electric properties
Journal Article
2013, ISBN 9780071785143, xxiv, 487
This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost,... 
Three-dimensional integrated circuits
Book
2004, Physics and astronomy online library., ISBN 9783540210498, Volume 75., xvii, 499
Book
Journal of Applied Physics, ISSN 0021-8979, 09/2010, Volume 108, Issue 5, pp. 054905 - 054905-10
.... Die-to-wafer assembly appears to be an unavoidable step to reach full integration. While robotic methods experience difficulties to accommodate fabrication speed... 
Physical Sciences | Physics | Science & Technology | Physics, Applied | Moore's Law | Analysis | Semiconductor wafers | Microelectronics | Structure | Miniature electronic equipment | Electric properties
Journal Article
Applied Physics Letters, ISSN 0003-6951, 02/2008, Volume 92, Issue 6, pp. 063504 - 063504-3
...) wafers is correlated with the surface passivation quality and heterojunction cell performance... 
Physical Sciences | Physics | Science & Technology | Physics, Applied | HETEROJUNCTIONS | THIN FILMS | PASSIVATION | SOLAR CELLS | DEPOSITION | SILICON | ION BEAMS | MATERIALS SCIENCE | LIFETIME | LAYERS | ELECTRIC POTENTIAL | PLASMA | CRYSTAL DEFECTS | MICROSTRUCTURE | SEMICONDUCTOR MATERIALS
Journal Article
2018, ISBN 0323510841, 794
Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications... 
Silicon-on-insulator technology
eBook