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Science, ISSN 0036-8075, 6/2011, Volume 332, Issue 6035, pp. 1294 - 1297
A wafer-scale graphene circuit was demonstrated in which all circuit components, including graphene field-effect transistor and inductors, were monolithically... 
Integrated circuits | Electric potential | Graphene | Dielectric materials | Drains | REPORTS | Semiconductor wafers | Transistors | Inductors | Electric current | Transconductance | HIGH-FREQUENCY | TRANSISTORS | EPITAXIAL GRAPHENE | MULTIDISCIPLINARY SCIENCES | GROWTH | Usage | Design and construction | Materials | Semiconductor chips | Materials science | Optoelectronics
Journal Article
2004, Springer series in materials science, ISBN 9783540210498, xv, 499
Book
Solar Energy Materials and Solar Cells, ISSN 0927-0248, 04/2017, Volume 162, pp. 1 - 6
This paper details an innovative recycling process to recover silicon (Si) wafer from solar panels. Using these recycled wafers, we fabricated Pb-free solar... 
Silicon | Photovoltaic module | Sustainable | Wafer | Recycle | Lead-free | PHYSICS, APPLIED | ENERGY & FUELS | MATERIALS SCIENCE, MULTIDISCIPLINARY | Waste management | Phosphates | Architecture and energy conservation | Phosphoric acid | Hydroxides | Solar energy industry | Recycling (Waste, etc.) | Methods | Electric properties | Remanufacturing | Analysis | Semiconductor wafers
Journal Article
1993, Materials science and process technology series. Electronic materials and process technology., ISBN 9780815513315, xx, 623
Book
IEEE Transactions on Electron Devices, ISSN 0018-9383, 03/2017, Volume 64, Issue 3, pp. 1239 - 1245
Surface passivation plays a dual role of protecting copper (Cu) from getting oxidized and reducing the surface roughness of Cu thin film and thus enables... 
alloy passivation | Nickel alloys | ultrathin constantan | Copper alloys | Cu–Cu bonding | Surface roughness | Rough surfaces | low temperature | Bonding | Passivation | 3-D integration | Cu-Cu bonding | Usage | Analysis | Complementary metal oxide semiconductors | Thin films | Relative humidity | CMOS | Oxidation resistance | Copper base alloys | Passivity
Journal Article
Angewandte Chemie International Edition, ISSN 1433-7851, 12/2018, Volume 57, Issue 49, pp. 16162 - 16165
Journal Article
1995, The Kluwer international series in engineering and computer science, ISBN 0792396197, Volume SECS 339., xix, 468
Book
Sensors & Actuators: A. Physical, ISSN 0924-4247, 2009, Volume 154, Issue 1, pp. 180 - 186
Journal Article
Microporous and Mesoporous Materials, ISSN 1387-1811, 03/2015, Volume 204, Issue C, pp. 251 - 256
Journal Article
Applied Optics, ISSN 1559-128X, 06/2017, Volume 56, Issue 17, pp. 4900 - 4904
Slip phenomenon on a (001) silicon surface under 1064 nm laser ablation was studied by experiments and simulations. The surface morphologies of the silicon... 
DAMAGE | MILLISECOND | OPTICS | Usage | Computer-generated environments | Computer simulation | Ablation (Vaporization technology) | Optical properties | Semiconductor wafers | Research
Journal Article
Nature, ISSN 0028-0836, 2014, Volume 505, Issue 7482, pp. 190 - 194
Graphene has attracted worldwide interest since its experimental discovery(1,2), but the preparation of large-area, continuous graphene film on SiO2/Si wafers,... 
LARGE-AREA | RAMAN-SCATTERING | ENERGY | CHEMICAL-VAPOR-DEPOSITION | MULTIDISCIPLINARY SCIENCES | GROWTH | COPPER | Properties | Graphene | Bubbles | Aqueous solutions | Plasma etching | Methods | Cracks | Semiconductors | Wafers | Copper | Density | Silicon dioxide | Defects
Journal Article