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copper (3) 3
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Transactions of Nonferrous Metals Society of China, ISSN 1003-6326, 03/2014, Volume 24, Issue 3, pp. 750 - 757
Journal Article
International Journal of Nanomanufacturing, ISSN 1746-9392, 2007, Volume 1, Issue 3, pp. 357 - 369
Preliminary experimental results have shown that an unexpected large needle-like phase Ag3Sn grows from the solder/strate interface and large polygon-like... 
lead free solders | nickel | interfacial structure | microstructure | copper | reinforcement | nano-particles | Sn3.5Ag solder
Journal Article
中国科学通报:英文版, ISSN 1001-6538, 2014, Volume 59, Issue 31, pp. 4147 - 4151
Journal Article
Defect and Diffusion Forum, ISSN 1012-0386, 04/2012, Volume 326-328, pp. 12 - 17
The present work is focused on the preparation and the properties of Sn-Ag-nanoCu composite solder by two methods, i.e. ball milling and paste mixing. Copper... 
Ball mill | Nano composite | Paste mix | Sn3.5Ag solder
Journal Article
by Liu, C S and Ho, C E
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, ISSN 2150-5934, 10/2010, pp. 1 - 4
This study was conducted to the Ni and Cu dissolution behaviors, and the cross-interaction during Ni/Sn3.5Ag/Cu joints fabrication. To form such joint... 
Metallization | Cu concentration | cross-interaction | Cu | Ni) 6 Sn 5 | Tin | Ni concentration | Nickel | Metal dissolution | Ni/Sn3.5Ag/Cu | Copper | Soldering | Joints | Cross-interaction | Cu,Ni
Conference Proceeding
02/2014, ISBN 1118887867, 8
This chapter contains sections titled: Introduction Experiment Conclusions Acknowledgements 
microstructure | bulk metallic glass | Sn3.5Ag | fast scanning calorimetry
Book Chapter
03/2012, ISBN 1118296095, Volume 2, 8
This chapter contains sections titled: Introduction Experimental Procedure Results and Discussions Conclusion Acknowledgements 
Wettability | Sn3 | 5Ag | Contact angle | Intermetallic | Interfacial microstructure | compound | Sn3.5Ag | Intermetallic compound
Book Chapter
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