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Microelectronics Reliability, ISSN 0026-2714, 06/2014, Volume 54, Issue 6-7, pp. 1253 - 1273
Journal Article
Corrosion Science, ISSN 0010-938X, 2008, Volume 50, Issue 4, pp. 995 - 1004
Journal Article
Journal of Alloys and Compounds, ISSN 0925-8388, 04/2016, Volume 665, pp. 251 - 260
Journal Article
Microelectronics Reliability, ISSN 0026-2714, 08/2017, Volume 75, pp. 77 - 95
Ever since RoHS was implemented in 2006, Sn3.0Ag0.5Cu (SAC305) has been the primary lead-free solder for attaching electronic devices to printed circuit boards... 
Electronics | Lead-free solders | Alternative solders | SAC | Reliability | INTERMETALLIC GROWTH | SN-AG-CU | PHYSICS, APPLIED | NANOSCIENCE & NANOTECHNOLOGY | JOINTS | MECHANICAL-PROPERTIES | ENGINEERING, ELECTRICAL & ELECTRONIC | SNAGCU-SOLDER | SN-3.5AG SOLDER | SURFACE FINISH | TIN WHISKER ANALYSIS | MICROSTRUCTURE
Journal Article
Journal of Alloys and Compounds, ISSN 0925-8388, 2012, Volume 511, Issue 1, pp. 176 - 188
Journal Article
Current Opinion in Solid State & Materials Science, ISSN 1359-0286, 04/2016, Volume 20, Issue 2, pp. 55 - 76
Journal Article
Materials Science & Engineering A, ISSN 0921-5093, 03/2016, Volume 658, pp. 159 - 166
Journal Article
Materials Science & Engineering R, ISSN 0927-796X, 08/2014, Volume 82, Issue 1, pp. 1 - 32
Journal Article