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Microelectronics Reliability, ISSN 0026-2714, 09/2018, Volume 88-90, pp. 67 - 74
Non-destructive failure analysis and defect characterization are necessary steps for every component that is destined to space projects. Infrared Thermography... 
Temperature measurement | Thermal characterization | Ceramic capacitor | IR thermography | Defect localization | TEMPERATURE-MEASUREMENT | PHYSICS, APPLIED | INFRARED THERMOGRAPHY | NANOSCIENCE & NANOTECHNOLOGY | ENGINEERING, ELECTRICAL & ELECTRONIC
Journal Article
Composites Part B, ISSN 1359-8368, 10/2014, Volume 65, pp. 109 - 116
A new method dedicated to macroscopic-like defect localization in composite materials is presented in this paper. The proposed method is based on non intrusive... 
B. Defects | Modulated photothermal method | D. Non destructive testing | MATERIALS SCIENCE, COMPOSITES | ENGINEERING, MULTIDISCIPLINARY | Non destructive testing | Defects | THERMAL WAVES | Heterogeneity | Heating | Mathematical analysis | Tools | Mathematical models | Localization | Position (location)
Journal Article
Journal of Visualized Experiments, ISSN 1940-087X, 05/2017, Volume 2017, Issue 123
Journal Article
Smart Materials and Structures, ISSN 0964-1726, 08/2007, Volume 16, Issue 4, pp. 1208 - 1217
This work focuses on an ultrasonic guided wave structural health monitoring (SHM) system development for aircraft wing inspection. In part I of the study, a... 
TOMOGRAPHY | INSTRUMENTS & INSTRUMENTATION | LAMB WAVES | ULTRASONICS | BEAMS | MATERIALS SCIENCE, MULTIDISCIPLINARY | THERMAL PROTECTION PANELS | COMPONENTS | JOINTS | SENSORS | PLATE | NDE
Journal Article
AIAA Journal, ISSN 0001-1452, 09/2018, Volume 56, Issue 9, pp. 3691 - 3700
The existence of debonding defects in thermal barrier coatings is one of the key problems that result in the premature failure of blades. In this paper, a line... 
PULSED THERMOGRAPHY | SYSTEMS | ENGINEERING, AEROSPACE | Temperature distribution | Temperature | Scanning | Blades | Nondestructive testing | Coatings | Defects | Thermal response | Unevenness | Heat | Debonding | Morphology | Thermal barrier coatings | Thermography
Journal Article
Materials Science & Engineering B, ISSN 0921-5107, 09/2012, Volume 177, Issue 15, pp. 1261 - 1267
Lock-in thermography (LIT), which is a well established technique for non-destructive evaluation, can also be used to identify and locate thermal active... 
Integrated circuits | Phase shift analysis | Microelectronic devices | Lock-in thermography | 3D integration | Thermal defect localization | PHYSICS, CONDENSED MATTER | MATERIALS SCIENCE, MULTIDISCIPLINARY | Circuit components | Usage | Semiconductor chips
Journal Article
International Journal of Thermophysics, ISSN 0195-928X, 2/2019, Volume 40, Issue 2, pp. 1 - 13
We report on photothermal detection of subsurface defects by coherent superposition of thermal wave fields. This is made possible by structured heating using... 
Condensed Matter Physics | Subsurface defects | Wavelet transformation | Physical Chemistry | Structured heating | VCSEL | Classical Mechanics | Thermal wave | Industrial Chemistry/Chemical Engineering | Heat diffusion | Physics | MECHANICS | PHYSICS, APPLIED | THERMODYNAMICS | CHEMISTRY, PHYSICAL
Journal Article
Journal of Materials Chemistry C, ISSN 2050-7534, 2018, Volume 6, Issue 26, pp. 7101 - 7110
Journal Article
Physica B: Physics of Condensed Matter, ISSN 0921-4526, 2007, Volume 401, pp. 584 - 586
The photoluminescence (PL), its power and temperature dependences have been studded for the ensembles of InAs quantum dots (QD) embedded in symmetric In Ga... 
Thermal quenching | InAs quantum dots | Photoluminescence | thermal quenching | PHYSICS, CONDENSED MATTER | photoluminescence | QUANTUM DOTS | Gallium arsenide | Analysis | Quantum wells
Journal Article
2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, ISSN 1946-1542, 06/2015, Volume 2015-, pp. 287 - 290
Defect localization becomes ever more challenging for low leakage failures especially with the dies stacking. More fault localization tools and innovative... 
Failure analysis | Metals | Electronic packaging thermal management | Solids | Silicon | Thermal analysis | Substrates | Leakage | Thermal emission | Packages | Hot spots | Position (location) | Failure | Defects
Conference Proceeding
2011 IEEE 13th Electronics Packaging Technology Conference, 12/2011, pp. 642 - 646
The efficiency of short fault isolation in flip-chip packaging has been increased greatly using the newly developed infrared lock-in thermography (IR-LIT)... 
Power supplies | Microscopy | Image edge detection | Failure analysis | Electronic packaging thermal management | SQUIDs | Lenses
Conference Proceeding
2011 17th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 09/2011, pp. 1 - 5
Recent improvements of microscopic Lock-In Thermography (LIT) offer the non-destructive localization of thermally active defects like shorts or resistive... 
Real time systems | Voltage measurement | Power supplies | Heating | Failure analysis | Three dimensional displays | Thermal analysis
Conference Proceeding
Microelectronics Reliability, ISSN 0026-2714, 2004, Volume 44, Issue 9, pp. 1699 - 1702
Journal Article
2008 2nd Electronics System-Integration Technology Conference, 09/2008, pp. 1041 - 1044
This paper presents the application of lock-in-thermography (LIT) for localisation of electrical defects in fully packaged microelectronic and microsystem... 
Semiconductor device measurement | Phase measurement | Thermal resistance | Integrated circuit interconnections | Electric variables measurement | Packaging | Thermal conductivity | Time measurement | Microelectronics | Response surface methodology
Conference Proceeding
2006 International Electron Devices Meeting, ISSN 0163-1918, 12/2006, pp. 1 - 4
The explosion in complexity of modern ICs resulting from reduced feature sizes, circuit density, and sophisticated electrical stimulus has made failure... 
Laser theory | Power demand | Thermal resistance | Heating | Voltage | Conductors | Laser modes | Silicon | Photoconductivity | Thermoelectricity
Conference Proceeding
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