X
Search Filters
Format Format
Format Format
X
Sort by Item Count (A-Z)
Filter by Count
Journal Article (9214) 9214
Conference Proceeding (546) 546
Newspaper Article (363) 363
Publication (218) 218
Book Chapter (118) 118
Magazine Article (99) 99
Government Document (78) 78
Book / eBook (66) 66
Trade Publication Article (30) 30
Paper (18) 18
Book Review (16) 16
Dissertation (12) 12
Journal / eJournal (1) 1
Newsletter (1) 1
Web Resource (1) 1
more...
Subjects Subjects
Subjects Subjects
X
Sort by Item Count (A-Z)
Filter by Count
tin (5601) 5601
materials science, multidisciplinary (3468) 3468
alloys (3315) 3315
tin base alloys (1897) 1897
copper (1830) 1830
microstructure (1828) 1828
physics, applied (1827) 1827
metallurgy & metallurgical engineering (1687) 1687
intermetallic compounds (1381) 1381
solders (1324) 1324
engineering, electrical & electronic (1228) 1228
materials science (1184) 1184
chemistry, physical (1180) 1180
analysis (1021) 1021
mechanical properties (959) 959
characterization and evaluation of materials (907) 907
tin alloys (887) 887
physics, condensed matter (816) 816
nickel (759) 759
thin films (720) 720
nanoparticles (717) 717
scanning electron microscopy (709) 709
silver (671) 671
optical and electronic materials (668) 668
tin dioxide (646) 646
morphology (633) 633
temperature (626) 626
behavior (575) 575
electrodes (572) 572
nanostructure (568) 568
soldering (547) 547
deposition (540) 540
coatings (539) 539
lead (522) 522
x-ray diffraction (520) 520
mikrostruktur (516) 516
metals (507) 507
intermetallics (504) 504
diffusion (502) 502
zinc (499) 499
growth (495) 495
mechanical-properties (491) 491
nanoscience & nanotechnology (490) 490
aluminum (489) 489
chemistry (478) 478
intermetallische verbindung (474) 474
material science (472) 472
substrates (471) 471
electrochemistry (453) 453
corrosion (452) 452
oxidation (449) 449
tin oxides (442) 442
joints (438) 438
hardness (436) 436
lead-free solder (436) 436
titanium (402) 402
gold (396) 396
copper base alloys (393) 393
crystal structure (377) 377
lead free (375) 375
zinnlegierung (375) 375
silicon (373) 373
materials science, coatings & films (369) 369
mathematical models (357) 357
alloy (353) 353
solidification (352) 352
performance (348) 348
films (343) 343
thermodynamics (343) 343
mathematical analysis (330) 330
annealing (325) 325
anodes (322) 322
antimony (318) 318
indium tin oxide (314) 314
copper alloys (312) 312
germanium (306) 306
electric properties (305) 305
electronics and microelectronics, instrumentation (303) 303
indium (301) 301
lead-free solders (301) 301
thin-films (301) 301
studies (292) 292
lithium-ion batteries (289) 289
fabrication (286) 286
kupfer (286) 286
lithium (285) 285
titanium base alloys (280) 280
optical properties (279) 279
photovoltaic cells (279) 279
weichlötverbindung (279) 279
metallic materials (274) 274
nanocomposites (271) 271
reliability (268) 268
chemistry, multidisciplinary (267) 267
interface reactions (265) 265
iron (264) 264
carbon (263) 263
electrodeposition (263) 263
evolution (262) 262
grain boundaries (259) 259
more...
Library Location Library Location
Library Location Library Location
X
Sort by Item Count (A-Z)
Filter by Count
UTL at Downsview - May be requested (14) 14
Gerstein Science - Stacks (13) 13
Robarts - Stacks (12) 12
Engineering & Comp. Sci. - Stacks (10) 10
Chemistry (A D Allen) - Stacks (2) 2
St. Michael's College (John M. Kelly) - 2nd Floor (2) 2
Thomas Fisher Rare Book - Rare Book (2) 2
Collection Dvlpm't (Acquisitions) - Closed Orders (1) 1
Earth Sciences (Noranda) - Missing (1) 1
Online Resources - Online (1) 1
Royal Ontario Museum - Periodical Stacks (1) 1
UofT at Mississauga - Stacks (1) 1
more...
Language Language
Language Language
X
Sort by Item Count (A-Z)
Filter by Count
English (9723) 9723
Chinese (184) 184
Japanese (82) 82
Portuguese (8) 8
Spanish (7) 7
German (6) 6
French (5) 5
Czech (4) 4
Dutch (4) 4
Hindi (4) 4
Russian (4) 4
Ukrainian (3) 3
Korean (2) 2
Persian (2) 2
Croatian (1) 1
Hungarian (1) 1
Romanian (1) 1
more...
Publication Date Publication Date
Click on a bar to filter by decade
Slide to change publication date range


Journal of Alloys and Compounds, ISSN 0925-8388, 08/2018, Volume 757, p. 333
In this paper, we show the first production of Cu-based electrode materials including self-assembled barrier layers which can prevent Cu-Si inter-diffusion... 
Solar cells | Self assembly | Mass production | Barrier layers | Silicon substrates | Copper base alloys | Crystallinity | Substrates | Electrodes | Pastes | Diffusion layers | Electrode materials | Photovoltaic cells | Diffusion barriers | Sintering | Tin | Silicon | Copper | Crystal structure | Structural analysis
Journal Article
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, ISSN 0021-4876, 2018, Volume 82, Issue 3, pp. 78 - 83
Journal Article
JOURNAL OF THE JAPAN INSTITUTE OF METALS AND MATERIALS, ISSN 0021-4876, 2018, Volume 82, Issue 3, pp. 78 - 83
The solidification processes for Sn-2Ag alloy and Sn-2Ag-0.6Zn alloy have been directly observed in. situ using time. resolved X-ray imaging at SPring-8. In... 
tin-silver alloy | STABILITY | METALLURGY & METALLURGICAL ENGINEERING | dendrite tip radius | SOLIDIFICATION PROCESS | REGION | INTERRUPTED TESTS | ALUMINUM | unidirectional solidification | solid-liquid interface energy | STEEL | GROWTH | in-situ observation | coupled zone | AG ALLOYS | PRIMARY BETA-SN | MORPHOLOGY
Journal Article
Journal of Alloys and Compounds, ISSN 0925-8388, 08/2018, Volume 757, pp. 333 - 339
In this paper, we show the first production of Cu-based electrode materials including self-assembled barrier layers which can prevent Cu-Si inter-diffusion... 
Self-assembled barrier layer | Tin | Copper alloys | Atmosphere | Sintering | METALLIZATION | BEHAVIOR | MATERIALS SCIENCE, MULTIDISCIPLINARY | METALLURGY & METALLURGICAL ENGINEERING | CHEMISTRY, PHYSICAL | FRACTURE | SOLDER JOINTS | ELECTRODE | SI SOLAR-CELLS | PHOSPHORUS ALLOY | Chemical industry | Herbicides | Pesticides industry | Solar energy industry | Alloys | Silicon | Electric properties
Journal Article
Journal of Applied Physics, ISSN 0021-8979, 07/2019, Volume 126, Issue 3
Tin-containing Group IV alloys show great promise for a number of next-generation CMOS-compatible devices. Not least of those are optoelectronic devices such... 
CMOS | Heat treatment | Photoluminescence | Organic light emitting diodes | Optoelectronic devices | Diodes | Tin base alloys
Journal Article
Solid State Phenomena, ISSN 1012-0394, 04/2018, Volume 273, pp. 91 - 94
Utilization of Sn-3.0Ag-0.5Cu to replace toxic lead-based solder was only feasible if the corrosion performance of this solder was assured. To obtain this... 
Corrosion | Tin base alloys
Journal Article
Journal of Alloys and Compounds, ISSN 0925-8388, 09/2013, Volume 572, Issue 1, pp. 97 - 106
Journal Article
Journal of Alloys and Compounds, ISSN 0925-8388, 01/2015, Volume 620, pp. 283 - 288
High entropy alloys, i.e. solid solution phases, are sought in the X-NbTaTiZr equiatomic system where the X element was chosen as Al, Cr, V and Sn by applying... 
High-entropy alloys | X-ray diffraction | Casting | Microstructure | ELEMENTS | PHASE | SOLID-SOLUTION | MATERIALS SCIENCE, MULTIDISCIPLINARY | METALLURGY & METALLURGICAL ENGINEERING | CONFIGURATION ENERGIES | CHEMISTRY, PHYSICAL | Solid solutions | Alloys | Phases | Aluminum | Vanadium base alloys | Chromium | Tin | Entropy
Journal Article
Materials and Design, ISSN 0264-1275, 01/2013, Volume 43, pp. 40 - 49
► Effect of Ni and Sb on thermal and creep behavior of Sn–1.0Ag–0.5Cu alloy was assessed. ► Alloying of Ni and Sb resulted in considerably reduced undercooling... 
Mechanical properties | Lead-free solder | Microstructure | Sn–Ag–Cu alloys | Non-ferrous alloys | Sn-Ag-Cu alloys | MATERIALS SCIENCE, MULTIDISCIPLINARY | CREEP-BEHAVIOR | BI | SN-AG | TENSILE-STRENGTH | AG-CU SOLDERS | ALLOY | AG3SN | Nonferrous alloys | Nonferrous metals | Emergency medical services | Alloys | Nickel base alloys | Solders | Intermetallic compounds | Antimony | Nickel | Alloying | Creep (materials) | Tin base alloys
Journal Article
Materials and Design, ISSN 0264-1275, 02/2015, Volume 67, pp. 209 - 216
The effect of aluminum concentration on the microstructure, wettability, interfacial IMC and mechanical properties of Sn–0.7Cu lead-free solder alloy is... 
Mechanical properties | Wettability | Microstructure | Aluminum | Solder alloy | CU SUBSTRATE | INTERMETALLIC COMPOUND LAYERS | MATERIALS SCIENCE, MULTIDISCIPLINARY | GROWTH | SN-3.9AG-0.7CU | DEFORMATION-BEHAVIOR | SB ADDITIONS | Analysis | Alloys | Alloying additive | Aluminum base alloys | Solders | Intermetallic compounds | Tin | Lead free | Tin base alloys
Journal Article
Journal of Materials Research, ISSN 0884-2914, 04/2013, Volume 28, Issue 9, pp. 1189 - 1195
Ni-base alloy coatings were fabricated on 45 steel by laser cladding using a CW-CO2 laser system. The microstructure of the coatings was analyzed using optical... 
TIN | STAINLESS-STEEL | COMPOSITE COATINGS | MATERIALS SCIENCE, MULTIDISCIPLINARY | MORPHOLOGY | Studies | Materials research | Nickel alloys | Microstructure | Analysis | Nickel base alloys | Thermodynamics | Medium carbon steels | Steels | Laser beam cladding | Coatings | Alloy steels
Journal Article
Journal of Applied Physics, ISSN 0021-8979, 02/2013, Volume 113, Issue 7, p. 73707
GeSn is predicted to exhibit an indirect to direct band gap transition at alloy Sn composition of 6.5% and biaxial strain effects are investigated in order to... 
ELECTRONIC-PROPERTIES | PHYSICS, APPLIED | FILMS | SEMICONDUCTORS | Thermal properties | Tin alloys | Usage | Analysis | Crystals | Mechanical properties | Germanium | Structure | Mathematical optimization | Alloy development | Band structure of solids | Disorders | Electronics | Alloying | Mathematical models | Strain | Tin base alloys
Journal Article
Journal of Alloys and Compounds, ISSN 0925-8388, 08/2018, Volume 756, p. 19
The microstructures and martensitic transformation behaviors of the quaternary Ti-Ni-Hf-X (Ag, Sn) high temperature shape memory alloys were investigated... 
Shape memory alloys | Intermetallic compounds | Martensitic transformations | Titanium base alloys | Tin base alloys | Titanium alloys | Martensitic stainless steel | Alloy systems | High temperature physics | Hafnium base alloys | Tin | Microstructure | Martensite | Silver base alloys
Journal Article
Scripta Materialia, ISSN 1359-6462, 02/2016, Volume 112, pp. 148 - 151
Journal Article
Journal of Alloys and Compounds, ISSN 0925-8388, 08/2019, Volume 796, pp. 210 - 220
Al-rich alloys prepared by milling and melting were characterized by a range of instrumental analysis techniques and employed for hydrolytic hydrogen... 
Al-rich alloy | Melting | Hydrogen production | Milling | Hydrolysis | Organic chemistry | Drinking water | Hydrogen | Alloys | Chemical composition | Tin base alloys
Journal Article
Journal of Alloys and Compounds, ISSN 0925-8388, 06/2018, Volume 749, p. 794
The precipitation behavior of Mg-8Al-2Sn-1Zn (ATZ821) alloy was investigated. Sn addition to the AZ81 alloy greatly influenced the initial precipitation... 
Diffraction patterns | Magnesium base alloys | Diffraction | Interfacial energy | Partitioning | Aluminum | Alloys | Tin | Microstructure | Microhardness | Pattern analysis | Precipitates
Journal Article
Angewandte Chemie International Edition, ISSN 1433-7851, 09/2017, Volume 56, Issue 40, pp. 12219 - 12223
Journal Article
No results were found for your search.

Cannot display more than 1000 results, please narrow the terms of your search.