X
Search Filters
Format Format
Subjects Subjects
Subjects Subjects
X
Sort by Item Count (A-Z)
Filter by Count
ultralarge-scale integration (46) 46
materials science, multidisciplinary (20) 20
electrochemistry (19) 19
engineering, electrical & electronic (19) 19
copper (17) 17
physics, applied (17) 17
metallization (16) 16
deposition (15) 15
materials science, coatings & films (13) 13
ultralarge scale integration (12) 12
ulsi (9) 9
copper deposition (8) 8
stromlose abscheidung (8) 8
thin-films (8) 8
chemistry, physical (7) 7
electrodeposition (7) 7
kupfer (7) 7
palladium (7) 7
films (6) 6
interconnects (6) 6
silicon (6) 6
chemistry (5) 5
design (5) 5
electroless (5) 5
metallurgy & metallurgical engineering (5) 5
thin films (5) 5
abscheidungsgeschwindigkeit (4) 4
activation (4) 4
electroless deposition (4) 4
integrated circuits (4) 4
interconnection (4) 4
layer (4) 4
metallische dünnschicht (4) 4
nanoscience & nanotechnology (4) 4
nucleation (4) 4
semiconductors (4) 4
ultra large scale integration (4) 4
very large scale integration (4) 4
additives (3) 3
barrier layers (3) 3
bottom-up fill (3) 3
chemical-vapor-deposition (3) 3
circuit synthesis (3) 3
co thin-films (3) 3
copper metallization (3) 3
design and construction (3) 3
design engineering (3) 3
dielectric films (3) 3
diffusion-barriers (3) 3
electrical engineering (3) 3
electrochemical deposition (3) 3
electroless plating (3) 3
fabrication (3) 3
film (3) 3
growth (3) 3
integrated circuit interconnections (3) 3
interconnect (3) 3
interconnections (3) 3
mechanism (3) 3
metallisieren (3) 3
microelectronics (3) 3
monolayers (3) 3
nanoparticles (3) 3
optimized surface pretreatments (3) 3
palladium catalysts (3) 3
physics, condensed matter (3) 3
reducing agent (3) 3
research (3) 3
seed layer (3) 3
surface (3) 3
surfaces (3) 3
temperature (3) 3
titanium nitride (3) 3
vlsi (3) 3
vlsi-schaltung (3) 3
wire (3) 3
2,2'-dipyridyl (2) 2
activation energy (2) 2
adhäsion (2) 2
alkaline-solutions (2) 2
alloys (2) 2
annealing (2) 2
batteries (2) 2
bis--disulfide sps (2) 2
bütünleşmiş devreler (2) 2
capacitance (2) 2
capacitors (2) 2
characterization and evaluation of materials (2) 2
chemical properties (2) 2
chemistry, multidisciplinary (2) 2
circuit design (2) 2
circuit noise (2) 2
circuit simulation (2) 2
circuitos integrados (2) 2
circuits (2) 2
clocks (2) 2
cmos (2) 2
complementary metal oxide semiconductors (2) 2
computer science, hardware & architecture (2) 2
computer simulation (2) 2
more...
Library Location Library Location
Language Language
Publication Date Publication Date
Click on a bar to filter by decade
Slide to change publication date range


Book
Journal Article
1996, McGraw-Hill series in electrical and computer engineering, ISBN 0070630623, xxv, 726
Book
Journal of Applied Electrochemistry, ISSN 0021-891X, 3/2004, Volume 34, Issue 3, pp. 291 - 300
Deposition of a thin electroless copper films on PVD copper seed layers in interconnect metallization was investigated for formation of a composite seed layer.... 
electroless | Chemistry | seed repair | electroplating | Physical Chemistry | Electrochemistry | copper | Industrial Chemistry/Chemical Engineering | interconnect | Interconnect | Electroless | Seed repair | Copper | Electroplating | ELECTROCHEMISTRY | DEPOSITION | ULTRALARGE-SCALE INTEGRATION | DUCTILITY | LAYER
Journal Article
Journal of the Electrochemical Society, ISSN 0013-4651, 2014, Volume 161, Issue 14, pp. D768 - D774
Glyoxylic acid is seen as a promising candidate to replace formaldehyde as reducing agent in electroless Cu baths. For deposition on ruthenium, the anodic... 
ELECTROCHEMISTRY | COPPER DEPOSITION | METALLIZATION | FILM | ELECTROCHEMICAL DEPOSITION | 2,2'-DIPYRIDYL | ULTRALARGE-SCALE INTEGRATION | THROUGH-SI VIAS | INTERCONNECTS | ELECTRODEPOSITION | MATERIALS SCIENCE, COATINGS & FILMS
Journal Article
IEEE Transactions on Components, Packaging and Manufacturing Technology, ISSN 2156-3950, 2013, Volume 3, Issue 3, pp. 384 - 390
Reliability of a quad-flat-package (QFP) with a circuit-under-pad (CUP) structure is investigated for Cu interconnects with porous low dielectric constant... 
porous low-k dielectrics | Copper | interconnect | ultralarge-scale integration | reliability | quad-flat-package | IMPACT | MATERIALS SCIENCE, MULTIDISCIPLINARY | ENGINEERING, MANUFACTURING | FREE SOLDER | WIRE | ENGINEERING, ELECTRICAL & ELECTRONIC
Journal Article
Journal of the Electrochemical Society, ISSN 0013-4651, 2012, Volume 159, Issue 7, pp. D437 - 441
Bath stability monitoring of electroless copper deposition has been done with different methods. A combination of UV-VIS spectra and pH measurement enabled us... 
ELECTROCHEMISTRY | SEED LAYER | DEPOSITION | BARRIER | CU SEED | ULTRALARGE-SCALE INTEGRATION | THROUGH-SI VIAS | CATALYST | SELF-ASSEMBLED MONOLAYER | TECHNOLOGY | MATERIALS SCIENCE, COATINGS & FILMS
Journal Article
IEEE Transactions on Electron Devices, ISSN 0018-9383, 01/2015, Volume 62, Issue 1, pp. 83 - 87
Journal Article
Applied Surface Science, ISSN 0169-4332, 11/2016, Volume 385, pp. 9 - 17
Journal Article
Journal Article
Langmuir, ISSN 0743-7463, 01/2012, Volume 28, Issue 3, pp. 1673 - 1677
″Ultrathin″ metallization layers on the order of nanometers in thickness are increasingly used in semiconductor interconnects and other nanostructures. Aqueous... 
HYDROGEN | ALKALINE-SOLUTIONS | DESORPTION | EVOLUTION | DISSOLUTION | MATERIALS SCIENCE, MULTIDISCIPLINARY | CHEMISTRY, PHYSICAL | ULTRALARGE-SCALE INTEGRATION | CHEMISTRY, MULTIDISCIPLINARY | HYDRIDE | SURFACES
Journal Article
Journal of the Electrochemical Society, ISSN 0013-4651, 08/2003, Volume 150, Issue 8, pp. C558 - C562
The deposition process of an electroless copper plating solution using sodium citrate as the main complexing agent and sodium hypophosphite as the reducing... 
ELECTROCHEMISTRY | ULTRALARGE-SCALE INTEGRATION | MATERIALS SCIENCE, COATINGS & FILMS
Journal Article
Electrochimica Acta, ISSN 0013-4686, 2005, Volume 50, Issue 16, pp. 3563 - 3568
The effect of bis-(3-sulfopropyl)-disulfide (SPS) in Cu electroless deposition was investigated. Quartz crystal microbalance (QCM) was used to measure the... 
Additive | QCM | Cu electroless deposition | Bottom-up filling | SPS | ELECTROCHEMISTRY | COPPER DEPOSITION | ACID | METALLIZATION | FILM | BEHAVIOR | OPTIMIZED SURFACE PRETREATMENTS | INTERCONNECTION | additive | LAYERS | bottom-up filling | ULTRALARGE-SCALE INTEGRATION | ELECTRODEPOSITION
Journal Article
The Journal of Physical Chemistry C, ISSN 1932-7447, 11/2011, Volume 115, Issue 45, pp. 22354 - 22359
Metallization layers nanometers to tens of nanometers thick are desirable for semiconductor interconnects, among other technologically relevant nanostructures.... 
C: Surfaces, Interfaces, Catalysis | ALKALINE-SOLUTIONS | MATERIALS SCIENCE, MULTIDISCIPLINARY | SILVER | CHEMISTRY, PHYSICAL | NANOSCIENCE & NANOTECHNOLOGY | HYDRIDE | DISSOLUTION | SUBSTRATE | ULTRALARGE-SCALE INTEGRATION | NUCLEATION | ELECTRODEPOSITION | IN-SITU | SURFACES
Journal Article
Journal of the Electrochemical Society, ISSN 0013-4651, 2010, Volume 157, Issue 4, pp. D222 - D227
Microcontact printing (mu CP) is incorporated with electroless plating to fabricate the micrometer (and submicrometer) scale pattern of copper on poly(ethylene... 
ELECTROCHEMISTRY | METALLIZATION | DEPOSITION | catalysis | PATTERNS | adhesion | POLYELECTROLYTE MULTILAYERS | soft lithography | MONOLAYERS | GLASS | TEMPERATURE | SUBSTRATE | copper | ULTRALARGE-SCALE INTEGRATION | FABRICATION | electroless deposition | MATERIALS SCIENCE, COATINGS & FILMS
Journal Article
IEEE Transactions on Components, Packaging and Manufacturing Technology, ISSN 2156-3950, 07/2018, Volume 8, Issue 7, pp. 1272 - 1280
Journal Article
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, ISSN 0278-0070, 03/2012, Volume 31, Issue 3, pp. 418 - 431
Journal Article
No results were found for your search.

Cannot display more than 1000 results, please narrow the terms of your search.