IEEE Transactions on Electron Devices, ISSN 0018-9383, 09/2017, Volume 64, Issue 9, pp. 3748 - 3755
Safe-operating-area (SOA) in a high-voltage complementary silicon-germanium (SiGe) (= n-p-n + p-n-p) on silicon-on-insulator (SOI) technology is investigated...
Temperature | high voltage | Stress | electrothermal boundary | high temperature | mixed-mode stress | silicon-on-insulator (SOI) | Silicon germanium | Semiconductor optical amplifiers | Temperature measurement | Degradation | complementary silicon–germanium (C-SiGe) | Reliability | high-current stress | Auger recombination | reliability | complementary silicon-germanium (C-SiGe) | PHYSICS, APPLIED | ENGINEERING, ELECTRICAL & ELECTRONIC | Bipolar transistors | Temperature measurements | Usage | Analysis | Silicon | Research | Electric potential | Annealing | Semiconductor devices | Property damage | Positive temperature coefficient | Damage detection | High current | Heterojunction bipolar transistors | Augers | Silicon germanides
Temperature | high voltage | Stress | electrothermal boundary | high temperature | mixed-mode stress | silicon-on-insulator (SOI) | Silicon germanium | Semiconductor optical amplifiers | Temperature measurement | Degradation | complementary silicon–germanium (C-SiGe) | Reliability | high-current stress | Auger recombination | reliability | complementary silicon-germanium (C-SiGe) | PHYSICS, APPLIED | ENGINEERING, ELECTRICAL & ELECTRONIC | Bipolar transistors | Temperature measurements | Usage | Analysis | Silicon | Research | Electric potential | Annealing | Semiconductor devices | Property damage | Positive temperature coefficient | Damage detection | High current | Heterojunction bipolar transistors | Augers | Silicon germanides
Journal Article
IEEE Transactions on Electron Devices, ISSN 0018-9383, 01/2013, Volume 60, Issue 1, pp. 34 - 41
We use predictive technology computer-aided design to investigate the device design challenges and optimization issues that will be necessarily encountered in...
Performance evaluation | technology computer-aided design (TCAD) | Doping | complementary silicon-germanium (C-SiGe) | Optimization | scaling roadmap | Silicon germanium | complementary bipolar | Bipolar junction transistor (BJT) | silicon-germanium (SiGe) | Heterojunction bipolar transistors | Semiconductor process modeling | Junctions | heterojunction bipolar transistor (HBT) | PHYSICS, APPLIED | FILM SOI | PROFILE DESIGN | SIMULATION | NPN | ENGINEERING, ELECTRICAL & ELECTRONIC | BICMOS | TRANSIT-TIME ANALYSIS | SOI TECHNOLOGY | BIPOLAR-TRANSISTORS | HIGH-SPEED | Silicon compounds | Bipolar transistors | Usage | Scalability | Analysis | Innovations | Computer-aided design | Mathematical optimization | Simulation methods | Electric properties | Computer simulation | Semiconductor devices | Germanium | Devices | Computer aided design | Silicon germanides
Performance evaluation | technology computer-aided design (TCAD) | Doping | complementary silicon-germanium (C-SiGe) | Optimization | scaling roadmap | Silicon germanium | complementary bipolar | Bipolar junction transistor (BJT) | silicon-germanium (SiGe) | Heterojunction bipolar transistors | Semiconductor process modeling | Junctions | heterojunction bipolar transistor (HBT) | PHYSICS, APPLIED | FILM SOI | PROFILE DESIGN | SIMULATION | NPN | ENGINEERING, ELECTRICAL & ELECTRONIC | BICMOS | TRANSIT-TIME ANALYSIS | SOI TECHNOLOGY | BIPOLAR-TRANSISTORS | HIGH-SPEED | Silicon compounds | Bipolar transistors | Usage | Scalability | Analysis | Innovations | Computer-aided design | Mathematical optimization | Simulation methods | Electric properties | Computer simulation | Semiconductor devices | Germanium | Devices | Computer aided design | Silicon germanides
Journal Article
IEEE Transactions on Nuclear Science, ISSN 0018-9499, 01/2019, Volume 66, Issue 1, pp. 389 - 396
The single-event transient response of a high-voltage complementary SiGe-on-silicon-on-insulator technology is investigated along with its temperature...
Temperature dependence | Transient response | single-event transient (SET) | complementary SiGe (C-SiGe) | high voltage | high temperature | power electronics | silicon-germanium technology | silicon-on-insulator (SOI) | Silicon germanium | Temperature measurement | Temperature sensors | single-event effects (SEEs) | TCAD | Heterojunction bipolar transistors | Transient analysis | Bias dependence | SILICON | DEPENDENCE | ENGINEERING, ELECTRICAL & ELECTRONIC | GERMANIUM | NUCLEAR SCIENCE & TECHNOLOGY | ABSORPTION | Electric potential | Temperature | Amplitudes | Semiconductor devices | Computer simulation | High temperature | High voltages | Energetic particles | Temperature effects | Technology | Heating | Voltage | Germanium | Silicon | Electric fields | Silicon germanides
Temperature dependence | Transient response | single-event transient (SET) | complementary SiGe (C-SiGe) | high voltage | high temperature | power electronics | silicon-germanium technology | silicon-on-insulator (SOI) | Silicon germanium | Temperature measurement | Temperature sensors | single-event effects (SEEs) | TCAD | Heterojunction bipolar transistors | Transient analysis | Bias dependence | SILICON | DEPENDENCE | ENGINEERING, ELECTRICAL & ELECTRONIC | GERMANIUM | NUCLEAR SCIENCE & TECHNOLOGY | ABSORPTION | Electric potential | Temperature | Amplitudes | Semiconductor devices | Computer simulation | High temperature | High voltages | Energetic particles | Temperature effects | Technology | Heating | Voltage | Germanium | Silicon | Electric fields | Silicon germanides
Journal Article
IEEE Transactions on Nuclear Science, ISSN 0018-9499, 01/2017, Volume 64, Issue 1, pp. 89 - 96
The single-event transient (SET) response of the pre-amplification stage of two latched comparators designed using either npn or pnp silicon-germanium...
Performance evaluation | Latches | single-event transient | complementary SiGe | C-SiGe | PNP HBTs | Silicon germanium | radiation hardening by design (RHBD) | Measurement by laser beam | Comparators | Ring lasers | Transistors | Transient analysis | CIRCUITS | NUCLEAR SCIENCE & TECHNOLOGY | HBT | ENGINEERING, ELECTRICAL & ELECTRONIC | TPA | Uninterruptible power supply | Radiation | Voltage | Immunoglobulin E | Germanium | Silicon | Heterojunction bipolar transistors | Silicon germanides
Performance evaluation | Latches | single-event transient | complementary SiGe | C-SiGe | PNP HBTs | Silicon germanium | radiation hardening by design (RHBD) | Measurement by laser beam | Comparators | Ring lasers | Transistors | Transient analysis | CIRCUITS | NUCLEAR SCIENCE & TECHNOLOGY | HBT | ENGINEERING, ELECTRICAL & ELECTRONIC | TPA | Uninterruptible power supply | Radiation | Voltage | Immunoglobulin E | Germanium | Silicon | Heterojunction bipolar transistors | Silicon germanides
Journal Article
IEEE Transactions on Nuclear Science, ISSN 0018-9499, 01/2018, Volume 65, Issue 1, pp. 391 - 398
The benefits of using p-n-p silicon-germanium (SiGe) heterojuction bipolar transistors (HBTs) in radio frequency (RF) circuits for the mitigation of...
single-event transient (SET) | radiation hardening by design | complementary SiGe (C-SiGe) | radio frequency (RF) switch | inverse mode | pulsed laser | two-photon absorption (TPA) | Silicon germanium | Radio frequency | silicon–germanium (SiGe) heterojunction bipolar transistors (HBTs) | BiCMOS | p-n-p | single-pole single-throw (SPST) | Insertion loss | BiCMOS integrated circuits | Heterojunction bipolar transistors | Transient analysis | radiation effects | RHBD | silicon-germanium (SiGe) heterojunction bipolar transistors (HBTs) | CMOS | IRRADIATION | TECHNOLOGY | CHARGE COLLECTION | HEAVY-ION | 2-PHOTON ABSORPTION | LASER | SOI | ENGINEERING, ELECTRICAL & ELECTRONIC | CIRCUITS | NUCLEAR SCIENCE & TECHNOLOGY | X-RAY | Mitigation | Bipolar transistors | Semiconductor devices | Circuit design | Switches | Immunoglobulin E | Germanium | Silicon germanides | Spurs
single-event transient (SET) | radiation hardening by design | complementary SiGe (C-SiGe) | radio frequency (RF) switch | inverse mode | pulsed laser | two-photon absorption (TPA) | Silicon germanium | Radio frequency | silicon–germanium (SiGe) heterojunction bipolar transistors (HBTs) | BiCMOS | p-n-p | single-pole single-throw (SPST) | Insertion loss | BiCMOS integrated circuits | Heterojunction bipolar transistors | Transient analysis | radiation effects | RHBD | silicon-germanium (SiGe) heterojunction bipolar transistors (HBTs) | CMOS | IRRADIATION | TECHNOLOGY | CHARGE COLLECTION | HEAVY-ION | 2-PHOTON ABSORPTION | LASER | SOI | ENGINEERING, ELECTRICAL & ELECTRONIC | CIRCUITS | NUCLEAR SCIENCE & TECHNOLOGY | X-RAY | Mitigation | Bipolar transistors | Semiconductor devices | Circuit design | Switches | Immunoglobulin E | Germanium | Silicon germanides | Spurs
Journal Article
6.
Full Text
Total Ionizing Dose Effects on a High-Voltage (>30V) Complementary SiGe on SOI Technology
IEEE Transactions on Nuclear Science, ISSN 0018-9499, 01/2017, Volume 64, Issue 1, pp. 277 - 284
Total ionizing dose (TID) effects are evaluated for a high-voltage (>30 V) complementary SiGe on SOI technology. Devices are irradiated with 10-keV X-rays at...
Measurement | Radiation effects | total ionizing dose (TID) | Doping | C-SiGe | complementary SiGe | high voltage | power electronics | silicon-germanium technology | silicon-on-insulator (SOI) | Silicon germanium | TCAD | interface traps | Heterojunction bipolar transistors | Junctions | Bias dependence | High voltage | Interface traps | Silicon-on-insulator (SOI) | Power electronics | Total ionizing dose (TID) | Complementary SiGe | Silicon-germanium technology | FILM SOI | PROTON | RELIABILITY | BASE JUNCTION TRAPS | ENGINEERING, ELECTRICAL & ELECTRONIC | IMPACT | NUCLEAR SCIENCE & TECHNOLOGY | HBTS | BJTS | DEGRADATION | BIPOLAR-TRANSISTORS | Transistors | Usage | Electric potential | Traps | Technology | Voltage | Immunoglobulin E | Irradiated | Silicon | Injection | Silicon dioxide | Silicon germanides
Measurement | Radiation effects | total ionizing dose (TID) | Doping | C-SiGe | complementary SiGe | high voltage | power electronics | silicon-germanium technology | silicon-on-insulator (SOI) | Silicon germanium | TCAD | interface traps | Heterojunction bipolar transistors | Junctions | Bias dependence | High voltage | Interface traps | Silicon-on-insulator (SOI) | Power electronics | Total ionizing dose (TID) | Complementary SiGe | Silicon-germanium technology | FILM SOI | PROTON | RELIABILITY | BASE JUNCTION TRAPS | ENGINEERING, ELECTRICAL & ELECTRONIC | IMPACT | NUCLEAR SCIENCE & TECHNOLOGY | HBTS | BJTS | DEGRADATION | BIPOLAR-TRANSISTORS | Transistors | Usage | Electric potential | Traps | Technology | Voltage | Immunoglobulin E | Irradiated | Silicon | Injection | Silicon dioxide | Silicon germanides
Journal Article
IEEE Transactions on Nuclear Science, ISSN 0018-9499, 12/2014, Volume 61, Issue 6, pp. 3146 - 3153
The single-event transient (SET) response of a third-generation bulk C-SiGe ( npn + pnp) BiCMOS platform is investigated for the first time. Pulsed-laser,...
single-event transient (SET) | Radiation hardening (electronics) | C-SiGe | complementary-SiGe | silicon-germanium technology | Silicon germanium | nanoTCAD | Single event transients | complementary bipolar | radiation hardening | PNP heterojunction bipolar transistors | SiGe HBT | BiCMOS integrated circuits | charge collection | Heterojunction bipolar transistors | Transient analysis | single-event effects (SEE) | 4TH-GENERATION | LOGIC | ENGINEERING, ELECTRICAL & ELECTRONIC | CIRCUITS | PART-I | PROTON TOLERANCE | OPERATION | NUCLEAR SCIENCE & TECHNOLOGY | DESIGNING ELECTRONIC SYSTEMS | MITIGATION
single-event transient (SET) | Radiation hardening (electronics) | C-SiGe | complementary-SiGe | silicon-germanium technology | Silicon germanium | nanoTCAD | Single event transients | complementary bipolar | radiation hardening | PNP heterojunction bipolar transistors | SiGe HBT | BiCMOS integrated circuits | charge collection | Heterojunction bipolar transistors | Transient analysis | single-event effects (SEE) | 4TH-GENERATION | LOGIC | ENGINEERING, ELECTRICAL & ELECTRONIC | CIRCUITS | PART-I | PROTON TOLERANCE | OPERATION | NUCLEAR SCIENCE & TECHNOLOGY | DESIGNING ELECTRONIC SYSTEMS | MITIGATION
Journal Article
IEEE Transactions on Nuclear Science, ISSN 0018-9499, 01/2018, Volume 65, Issue 1, pp. 231 - 238
The single-event upset response of SiGe-based digital circuits designed in a third-generation, bulk C-SiGe ( npn + pnp ) BiCMOS platform is investigated....
Performance evaluation | single-event transient (SET) | current-mode logic (CML) | Shift registers | Ions | complementary SiGe (C-SiGe) | Rail to rail outputs | Silicon germanium | silicon–germanium (SiGe) technology | single-event upset (SEU) | complementary bipolar | radiation hardening | NanoTCAD | Bit error rate test (BERT) | SiGe HBT | BiCMOS integrated circuits | charge collection | heavy-ion broad-beam experiments | Heterojunction bipolar transistors | pnp heterojunction bipolar transistors (HBTs)">pnp heterojunction bipolar transistors (HBTs) | single-event effects (SEE) | TCAD modeling | silicon germanium (SiGe) technology | pnp heterojunction bipolar transistors (HBTs) | DATA RATES | LOGIC | SRAM | ENGINEERING, ELECTRICAL & ELECTRONIC | CIRCUITS | SiCe HBT | NUCLEAR SCIENCE & TECHNOLOGY | silicon germanium (SiCe) technology | Semiconductor devices | Circuit design | Computer simulation | Digital electronics | Immunoglobulin E | Mitigation | Millimeter waves | Heterojunctions | Incidence angle | Three dimensional models | Silicon germanides
Performance evaluation | single-event transient (SET) | current-mode logic (CML) | Shift registers | Ions | complementary SiGe (C-SiGe) | Rail to rail outputs | Silicon germanium | silicon–germanium (SiGe) technology | single-event upset (SEU) | complementary bipolar | radiation hardening | NanoTCAD | Bit error rate test (BERT) | SiGe HBT | BiCMOS integrated circuits | charge collection | heavy-ion broad-beam experiments | Heterojunction bipolar transistors | pnp heterojunction bipolar transistors (HBTs)">
Journal Article
2005 IEEE Radio Frequency integrated Circuits (RFIC) Symposium - Digest of Papers, ISSN 1529-2517, 2005, pp. 553 - 556
We present the first comprehensive investigation of broadband noise in a complementary (npn + pnp) SiGe (C-SiGe) HBT BiCMOS technology. A base-transit time...
Integrated circuit technology | Semiconductor device noise | Noise figure | Germanium silicon alloys | Integrated circuit noise | Isolation technology | BiCMOS integrated circuits | Heterojunction bipolar transistors | Silicon germanium | Driver circuits | Noise model | Noise | SPICE noise model | C-SiGe | Complementary bipolar technology | SiGe HBT | Bipolar technology | Complementary-SiGe | Noisy two-port, noise figure | Shot noise
Integrated circuit technology | Semiconductor device noise | Noise figure | Germanium silicon alloys | Integrated circuit noise | Isolation technology | BiCMOS integrated circuits | Heterojunction bipolar transistors | Silicon germanium | Driver circuits | Noise model | Noise | SPICE noise model | C-SiGe | Complementary bipolar technology | SiGe HBT | Bipolar technology | Complementary-SiGe | Noisy two-port, noise figure | Shot noise
Conference Proceeding
10.
Full Text
Dual strained channel CMOS in FDSOI architecture: New insights on the device performance
Solid State Electronics, ISSN 0038-1101, 11/2011, Volume 65-66, Issue 1, pp. 9 - 15
We report an original Dual Strained Channel On Insulator (DSCOI) Fully Depleted CMOS architecture by co-integrating nFETs on sSOI and pFETs on Si/c-SiGe/(s)SOI...
CMOS | MOSFET | Integration | High-K | Dual channel | Mobility | Silicon–germanium | Low-frequency noise | SOI | Metal gate | Access resistance | Strain | Silicon-germanium | PHYSICS, CONDENSED MATTER | PHYSICS, APPLIED | ENGINEERING, ELECTRICAL & ELECTRONIC | GATE STACK | Nitrides | Transistors | Complementary metal oxide semiconductors | Semiconductor industry | Architecture | Tin | Hafnium oxide | Stacks | Density | Channels | Gates
CMOS | MOSFET | Integration | High-K | Dual channel | Mobility | Silicon–germanium | Low-frequency noise | SOI | Metal gate | Access resistance | Strain | Silicon-germanium | PHYSICS, CONDENSED MATTER | PHYSICS, APPLIED | ENGINEERING, ELECTRICAL & ELECTRONIC | GATE STACK | Nitrides | Transistors | Complementary metal oxide semiconductors | Semiconductor industry | Architecture | Tin | Hafnium oxide | Stacks | Density | Channels | Gates
Journal Article
04/2014, Pan Stanford Series on Intelligent Nanosystems, ISBN 9789814411424, Volume 1, 516
This book gives a state-of-the-art overview by internationally recognized researchers of the architectures of breakthrough devices required for future...
Metal oxide semiconductors, Complementary | Electromagnetics & Microwaves | Intelligent Systems | Materials Science
Metal oxide semiconductors, Complementary | Electromagnetics & Microwaves | Intelligent Systems | Materials Science
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