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rie (32) 32
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Proceedings of SPIE - The International Society for Optical Engineering, ISSN 0277-786X, 2012, Volume 8328
The root causes of issues in state-of-the-arts resist mask are low plasma tolerance in etch and resolution limit in lithography. This paper introduces... 
reactive ion etch (RIE) | CD shrink | CD enlargement | DC superimposed (DCS) plasma | patterning enhancement technique (PET) | line width roughness (LWR) | resolution enhancement technique (RET) | CD variation | Patterning | Radio frequencies | Direct current | Resists | Etching | Nanostructure | Tolerances | Deposition
Conference Proceeding
Journal of Nanoscience and Nanotechnology, ISSN 1533-4880, 10/2019, Volume 19, Issue 10, p. 6506
Inductively coupled plasma reactive ion etching (ICPRIE) of copper thin films masked with photoresist (PR) and SiO2 thin films was performed in H2/Ar gas. As... 
Thin films | Ion etching | Reactive ion etching | Inductively coupled plasma | Copper compounds | Photoresists | Photoelectrons | Copper | Protective coatings | Substrates | Silicon dioxide
Journal Article
Solar Energy Materials and Solar Cells, ISSN 0927-0248, 2011, Volume 95, Issue 1, pp. 66 - 68
Texturing of silicon (Si) wafer surface is a key to enhance light absorption and improve the solar cell performance. While alkaline texturing of... 
Damage-free | Low reflectance | RIE (reactive ion etching) | ENERGY & FUELS | MATERIALS SCIENCE, MULTIDISCIPLINARY | Solar cells | Plasma physics | Silicon | Solar energy industry | Solar batteries | Photovoltaic cells | Wafers | Texturing | Etching | Damage | Reflectance
Journal Article
Journal of Physics D: Applied Physics, ISSN 0022-3727, 05/2011, Volume 44, Issue 17, p. 174012
The advances in information and communication technologies have been largely predicated around the increases in computer processor power derived from the... 
PHYSICS, APPLIED | GATE | ELECTRICAL CHARACTERISTICS | SILICON
Journal Article
International Journal of Nanotechnology, ISSN 1475-7435, 2018, Volume 15, Issue 1-3, pp. 93 - 107
Journal Article
Micro & Nano Letters, ISSN 1750-0443, 4/2018, Volume 13, Issue 4, pp. 421 - 426
Journal Article
Thin Solid Films, ISSN 0040-6090, 11/2018, Volume 665, pp. 51 - 58
Inductively coupled plasma reactive ion etching of copper thin films patterned with SiO2 masks was performed using CH4/O2/Ar gas mixture. The etch... 
Methane | Oxygen | Silica hard mask | Low-temperature etching | Inductively coupled plasma reactive ion etching | Copper | Argon | Thin film
Journal Article
Microelectronic Engineering, ISSN 0167-9317, 03/2017, Volume 172, pp. 13 - 18
A novel electron beam lithography process using PMMA/NEB bilayer was successfully developed for the generation of ultrafine slits as well as broad trenches in... 
PMMA/NEB bilayer | Sub-20 nm gold slits | Reactive ion etching | Electron beam lithography | PHYSICS, APPLIED | BIOSENSORS | NANOSCIENCE & NANOTECHNOLOGY | OPTICS | Sub-20 nm gold slits | ENGINEERING, ELECTRICAL & ELECTRONIC | Information science | Integrated circuit fabrication
Journal Article
Vacuum, ISSN 0042-207X, 09/2019, Volume 167, pp. 145 - 151
Dry etching of copper thin films patterned with SiO2 masks was performed using inductively coupled plasmas of CH3OH/Ar, C2H5OH/Ar, and O2/C2H5OH gases. The... 
C2H5OH/Ar | SiO2 hard mask | Low-temperature etching | Copper thin film | Inductively coupled plasma reactive ion etching | PHYSICS, APPLIED | MECHANISM | MATERIALS SCIENCE, MULTIDISCIPLINARY | DRY | Thin films | Copper compounds | X-ray spectroscopy | Dielectric films | Anisotropy | Analysis
Journal Article
Advances in Mechanical Engineering, ISSN 1687-8132, 12/2017, Volume 9, Issue 12, p. 168781401773815
Journal Article
Microelectronic Engineering, ISSN 0167-9317, 05/2018, Volume 191, p. 77
The quest to sculpture materials as small and deep as possible is an ongoing topic in micro- and nanofabrication. For this, the Bosch process has been widely... 
High aspect ratio | Size distribution | Erosion mechanisms | Trenches | Etching | Selectivity | Periodic variations | Masks | Studies | Ion etching | Reactive ion etching | Photoresists | Microstructure
Journal Article
Thin Solid Films, ISSN 0040-6090, 2011, Volume 519, Issue 20, pp. 6673 - 6677
Inductively coupled plasma reactive ion etching of CoFeB magnetic thin films patterned with Ti hard mask was studied in a CH 3OH/Ar gas mix. As the CH 3OH... 
CoFeB magnetic film | CH 3OH/Ar | Ti hard mask | Inductively coupled plasma reactive ion etching | OH/Ar | TUNNEL | PHYSICS, CONDENSED MATTER | MTJ | PHYSICS, APPLIED | MATERIALS SCIENCE, MULTIDISCIPLINARY | CH3OH/Ar | PARAMETERS | COSM | COZR | MATERIALS SCIENCE, COATINGS & FILMS | Thin films | Dielectric films | Electric potential | Reactive ion etching | Anisotropy | Coiling | Voltage | Titanium | Etching
Journal Article
Micro & Nano Letters, 04/2018, Volume 13, Issue 4, p. 421
The work reports on the exploitation of semi-sequential deep reactive ion etching (RIE) processes for realisation of deep vertically etched Si structures on Si... 
Optical fibers | Ion etching | Reactive ion etching | Silicon substrates | Purging | Etching | Surface roughness | Verticality | Exploitation | Fiber optics
Journal Article
Thin Solid Films, ISSN 0040-6090, 2011, Volume 519, Issue 23, pp. 8223 - 8228
Journal Article
Microelectronic Engineering, ISSN 0167-9317, 05/2019, Volume 212, pp. 13 - 20
Journal Article
Materials Science in Semiconductor Processing, ISSN 1369-8001, 03/2018, Volume 75, pp. 130 - 135
Journal Article
Journal of Micromechanics and Microengineering, ISSN 0960-1317, 03/2015, Volume 25, Issue 3, pp. 35024 - 8
Journal Article
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