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Solid State Electronics, ISSN 0038-1101, 11/2017, Volume 137, pp. 123 - 127
Journal Article
Analytical and bioanalytical chemistry, ISSN 1618-2642, 08/2013, Volume 405, Issue 20, pp. 6453 - 6460
Journal Article
Journal of Nanoscience and Nanotechnology, ISSN 1533-4880, 2017, Volume 17, Issue 5, pp. 3056 - 3059
Journal Article
Microelectronics Journal, ISSN 0026-2692, 2014, Volume 45, Issue 12, pp. 1716 - 1720
As junction-to-case thermal resistance R is a primary performance and reliability parameter for high power light emitting diodes (LED... 
Junction-to-case thermal resistance | Power semiconductor devices | Thermal transient measurement | Thermal resistance production test | Inline test | Light emitting diode | NANOSCIENCE & NANOTECHNOLOGY | ENGINEERING, ELECTRICAL & ELECTRONIC
Journal Article
IEEE transactions on electron devices, ISSN 1557-9646, 2019, Volume 66, Issue 11, pp. 4631 - 4637
Journal Article
IEEE transactions on electron devices, ISSN 1557-9646, 2019, Volume 66, Issue 7, pp. 2898 - 2903
Journal Article
Journal of nanoscience and nanotechnology, ISSN 1533-4880, 04/2019, Volume 19, Issue 4, pp. 2281 - 2284
.... However, because SHEs generated under high I-on prevent any increase of I-on, the trench steps should be adjusted appropriately considering the balance between the contact resistance and the SHEs. In order to obtain a proper trench depth, several steps were compared through a simulation. To support the results, the thermal resistance (R-th) was used in the comparison. 
PHYSICS, CONDENSED MATTER | PHYSICS, APPLIED | FINFET | MATERIALS SCIENCE, MULTIDISCIPLINARY | DEVICE | NANOSCIENCE & NANOTECHNOLOGY | Thermal Resistance (R-th) | Nanowire FET (NWFET) | SOI | CHEMISTRY, MULTIDISCIPLINARY | Self Heating Effects (SHEs) | WORK FUNCTION VARIATION | Contact resistance | Self heating | Nanowires | Thermal resistance | High temperature effects
Journal Article
Journal of semiconductor technology and science, ISSN 1598-1657, 2017, Volume 17, Issue 5, pp. 685 - 690
.... Through analysis of on-current (I-on), thermal resistance (R-TH), and heat flux, the DC characteristics of SHE were investigated according to the increase of buried oxide thickness (T-box... 
nanowire FET (NWFET) | PHYSICS, APPLIED | Self heating effect (SHE) | heat flux | thermal resistance (R-TH) | ENGINEERING, ELECTRICAL & ELECTRONIC | 전기공학
Journal Article
IEEE Transactions on Components, Packaging and Manufacturing Technology, ISSN 2156-3950, 06/2018, Volume 8, Issue 6, pp. 1024 - 1031
Journal Article
IEEE TRANSACTIONS ON ELECTRON DEVICES, ISSN 0018-9383, 10/2006, Volume 53, Issue 10, pp. 2540 - 2544
Journal Article
2013 14th International Conference on Electronic Packaging Technology, 08/2013, pp. 870 - 878
Recently, silver paste, silver epoxy, and solders were commonly used as die-attach materials for power electronic packaging. Thermal performance of these... 
Temperature measurement | Insulated gate bipolar transistors | Resistance | thermal resistance | Impedance measurement | Z th | Heating | R th | Logic gates | insulated gate bipolar transistor (IGBT) | Electronic packaging thermal management | gate-emitter voltage
Conference Proceeding
Journal of Chemical Physics, ISSN 0021-9606, 03/2010, Volume 132, Issue 9, pp. 094703 - 094703-5
.... In this work, we study the interfacial thermal resistance R th in nanoscale force-driven flows at different temperatures and fluid-wall interactions... 
adsorption | PHYSICS, ATOMIC, MOLECULAR & CHEMICAL | microchannel flow | two-phase flow | thermal resistance | HEAT | FLUID | CONFIGURATIONAL TEMPERATURE | argon | copper | SOLID INTERFACE | silver | ENERGY-TRANSFER | MOLECULAR-DYNAMICS SIMULATIONS | interface phenomena
Journal Article
Journal of semiconductor technology and science, ISSN 1598-1657, 2016, Volume 16, Issue 2, pp. 204 - 209
.... Through the comparison of thermal resistance at each node, main heat transfer path in Bulk FinFET device can be determined... 
Bulk FinFET | Self-heating effect | Lattice temperature | Thermal conductivity R | thermal conductivity R-th | PHYSICS, APPLIED | self-heating effect | lattice temperature | ENGINEERING, ELECTRICAL & ELECTRONIC | 전기공학
Journal Article
Solid State Electronics, ISSN 0038-1101, 2009, Volume 53, Issue 10, pp. 1086 - 1091
.... The heat flux, temperature profile, and thermal resistance ( R th) of the devices were investigated by incorporating heat source values, obtained from experimentally measured results, into the thermal simulation... 
VCSELs | Thermal analysis | Thermal resistance | InGaAs/GaAs MQWs | PHYSICS, CONDENSED MATTER | PHYSICS, APPLIED | WELL | PARAMETERS | ENGINEERING, ELECTRICAL & ELECTRONIC | SURFACE-EMITTING LASERS | CONDUCTIVITY | BOUNDARY RESISTANCE | QUANTUM CASCADE LASERS | Lasers | Gallium arsenide | Analysis | Gold | Cooling | Asymmetry | Apertures | Oxides | Devices | Heat transfer | Passivation
Journal Article
International Journal of Heat and Mass Transfer, ISSN 0017-9310, 11/2015, Volume 90, pp. 848 - 856
•The optimum liquid filling ratio increased as the length of the FPHP increased.•A shorter FPHP had a larger effective thermal conductivity, implying more... 
Bending angle | Maximum heat transport capability | Effective thermal conductivity | Length effect | Thermal resistance | Flat plate heat pipe | MODEL | ENGINEERING, MECHANICAL | PREDICTION | EXPERIMENTAL VALIDATION | MECHANICS | THERMODYNAMICS | THERMAL PERFORMANCE | MICRO-GROOVES
Journal Article
International Journal of Heat and Mass Transfer, ISSN 0017-9310, 03/2019, Volume 131, pp. 273 - 290
....•Correlations for evaporator and condenser Nu and overall thermal resistance are generated. The thermal performances of a radially rotating pulsating heat pipe (RPHP... 
Radial rotation | Pulsating heat pipe | Rotating machinery cooling | MECHANICS | THERMODYNAMICS | PERFORMANCE | LOOP | FLOW | ENGINEERING, MECHANICAL | Deformation | Evaporators | Parameters | Computational fluid dynamics | Fluid flow | Evaporation | Slugs | Dimensionless numbers | Rotation | Thermal energy | Thermal resistance | Heat pipes | Flow visualization | Liquid flow | Heat transfer
Journal Article
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